Handbook of Adhesives and Sealants
Covering structural and non-structural applications, this handbook lets you thoroughly explore the use of polymeric adhesives and sealants for joining or bonding metals, plastics, composites and elastomers.
TABLE OF CONTENTS Handbook of Adhesives and Sealants
Chapter 10: Adhesives Families
10.1 Introduction
This chapter will review the common chemical families of materials that are employed in adhesive formulations. They consist of synthetic polymeric resins, naturally occurring resins, and inorganic products. These materials form the base resin portion of the adhesive formulation. Along with additives and modifiers, they govern the chemical and physical characteristics of the adhesive system. Families of materials that are normally used in sealant formulations will be described in Chapter 13.
10.2 Classification Methods
There are many ways of classifying adhesives. In this chapter they will primarily be grouped as either structural or non-structural. This grouping is admittedly subjective and broad, but it represents the type of application where the adhesive is commonly used. We can also classify adhesives by whether or not they form cross-linked molecules (i.e., thermosetting or thermoplastic), by their flexibility (i.e., rigid or elastomeric), and by their form and curing conditions. Table 10.1 identifies and classifies common adhesive families that are covered in this chapter.
| General use | Flexibility | ||||||||
|---|---|---|---|---|---|---|---|---|---|
| Thermoset or thermoplastic | Structural | Rigid (T = Tough) | Elastomeric | Form | Cure | ||||
| Chemical family | TS | TP | Yes | No | Sealant | ||||
| Thermosetting resins | |||||||||
| Epoxy | x | x | x | F, S, 1C, 2CC | RT, ET | ||||
| Modified epoxies | |||||||||
| x | x | x | 2CC | RT,... |
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