Handbook of Adhesives and Sealants
Covering structural and non-structural applications, this handbook lets you thoroughly explore the use of polymeric adhesives and sealants for joining or bonding metals, plastics, composites and elastomers.
TABLE OF CONTENTS Handbook of Adhesives and Sealants
Appendix D: Surface Preparation Methods for Common Substrate Materials
D.1 Surface Preparation Methods for Metal Substrates
| Substrates | Cleaning solvents | Substrate treatments | Comments |
|---|---|---|---|
| Aluminum and aluminum alloys | Trichloroethylene | 1. Sandblast or 100 grit emery cloth followed by solvent degreasing | Medium to high strength bonds, suitable for non critical applications |
| 2. Immerse for 10 min at 70 82 C in a commercial alkaline cleaner or | Optimum bond strength per FPL etch process. Specified in ASTM D 2651 and MIL-A-9067. Solvent degrease may replace alkaline cleaning | ||
| 3.0 | ||
| 1.5 | ||
| 1.5 | ||
| 128.0 | ||
| Wash in water below 65 C and etch for 12 15 min at 66 71 C in | |||
| 1.0 | ||
| 10.0 | ||
| 30.0 | ||
| Rinse in distilled water after washing in tap water and dry in air | |||
| 3. Alkaline clean as described in 2 above. Then immerse for 10 12 mins at 60 65 C in the following solution: | P-2 etch specified in ASTM D 2651 | ||
| 7 36% by wt. | ||
| 135 to 165 g/l | ||
| Rinse as descirbed in 2 above | |||
| 4. Degrease with solvent. Abrade lightly with mildly abrasive cleaner. Rinse in deionized water; wipe; or air dry. Etch 20 min at RT in | Room temperature etch | ||
| 2 | ||
| 7 | ||
| Rinse thoroughly in deionized water; dry at 70 C for 30 min | |||
| 5. Form a paste using sulfuric acid sodium dichromate solution and finely divided silica or fuller's earth. Apply; do not permit paste to... |
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