16.1 Introduction

This chapter identifies various materials and processes that have been used to successfully bond and seal specific substrates. Methods, other than adhesive bonding, are also included if they have been recommended for use on the particular substrate. Recommended substrate surface treatments are usually the same for both adhesives and sealants, although surface treatment might not be as critical with sealants.

The examples provided in this chapter will be grouped by substrate material. The substrates are broadly identified as:

• Metals

• Plastics (thermosets and thermoplastics)

• Composites

• Foams

• Elastomers

• Wood and wood products

• Glass and ceramics

• Sandwich and honeycomb structures

Specific substrates are described under each classification. This chapter certainly does not consider all possible substrates. However, the guidance that is presented and the lessons provided throughout the rest of this Handbook should be sufficient for the user to wisely select "candidate" joining processes and materials no matter what substrates are involved. This initial list of candidates may require further modification or refinement relative to parameters unique to the user's application or because of the results of prototype testing. However, they provide a "first-cut" as to the best possible assembly process. Along with the information contained in this chapter, the reader will want to review Chapter 6, Surface Preparation; Chapter 11, Selection of Adhesives; and Chapter 14, Selecting and Using Sealants. Together, these chapters should provide the information necessary to choose a candidate joining process.