Upon completion of this chapter, you should be able to:

1. Identify the three major effects of contamination on semiconductor devices and processing.

2. List the major sources of contamination in a fabrication area.

3. Define the "class number" of a cleanroom.

4. List the particle density of class 100, 10, and 1 fabrication areas.

5. Describe the role of positive pressure, air showers, and adhesive mats in maintaining cleanliness levels.

6. List at least three techniques used to minimize contamination from fabrication personnel.

7. Identify the three contaminants present in "normal" water, and their control in semiconductor plants.

8. Describe the differences between normal industrial chemicals and semiconductor-grade chemicals.

9. Name two problems associated with high static levels, and two methods of static control.

10. Describe a typical FEOL and BEOL wafer cleaning process.

11. List typical wafer rinsing techniques.