State the class number required for VLSI processing and ULSI processing.

List three techniques used to keep contamination out of a cleanroom.

Draw a cross section of a "total" cleanroom, showing the filters and air patterns.

What does VLF mean?

What is the DI water specification?

Name three contaminants found in normal water.

What are the two ways that static is harmful in a fabrication area?

Explain the problem associated with high humidity in a fabrication area.

What is a mobile ionic contaminant, and why is it unwanted in a fabrication area?

How does a service bay contribute to the cleanliness of a cleanroom?

Describe a mini-environment.

Describe and sketch a SMIF/micro-environment unit.

List four types of contamination found on wafer surfaces.

List a cleaning chemical or chemical solution for each contaminant listed in question no. 13.

Describe the major techniques used to dry wafers.