Practical MMIC Design
Filled with real-world design techniques and rules of thumb, this practical resource offers professionals a unique look into the day-to-day practices of MMIC production and the economics associated with it.
TABLE OF CONTENTS Practical MMIC Design
5.3: Amplifiers
5.3 Amplifiers
Of all the types of MMIC circuits designed, the most common by far is the amplifier, and this comes as no surprise because an MMIC is made primarily by a transistor fabrication process with the additional capability of making passive components as well. For this reason the first "whole chip" (as opposed to a subcircuit) design type considered is the amplifier, and a large part of this chapter is given over to MMIC amplifier design techniques. Also, because the whole chip design is now being looked at, the first section discusses the initial considerations that are required for all MMIC design, in particular the effects and consequences of the chip-to-substrate/package/ system interface.
5.3.1 Initial Considerations
When considering the design of an MMIC, whatever the circuit type, there are a few general points that the designer must note in relation to the desired specification. The first concerns the RF path through the chip and connecting to the system it must work in. It is important to remember that although the system impedance may be 50 ?, there is almost certainly going to be an interface between the chip and the system that will not be 50 ? but will have parasitic impedances associated with it. The simplest interface will either be just a bond-wire or a flip-chip solder joint, but there may also be a package wall to go through and a further connection between the package and the system. The second concerns the dc path through...
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