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Back-diffusion: (vacuum technology) Flow of vapor in a direction opposite to that of the flow of gas being pumped. Occurs in the molecular flow range. Also called Backstreaming.
Back-end: (semiconductor technology) Final processing such as dicing, wire bonding, encapsulation, test, assembly packaging, etc.

See also Frontend.
Back-scattering: Scattering of particles in a direction counter to that of the main particle flow.
Backcoat: The protective coating that is applied to the film on the second surface. Example: Polymer coating applied to the aluminum reflector coating on a back surface mirror.

See also Second surface coating.
Backfill: (vacuum technology) Raising the system pressure with a specific gas. Example: Backfill with dry gas and raising the pressure in order to establish a plasma.

See also Venting.
Backing plate: (sputtering target) The plate that the target material is bonded to that allows mounting to the cooling portion of the sputtering target assembly.
Backing pump: (vacuum technology) A vacuum pump used to keep the discharge pressure of a high vacuum pump below some critical value. The backing pump may be also used as a roughing pump. Also called a Forepump.
Backpressure: (vacuum technology) The pressure in an exhaust system that impedes the flow of gas through the exhaust system.
Backside film: (semiconductor processing) Film or coating deposited on the backside of a silicon wafer during processing of the frontside (the side on which the device structure is being built).
Backstreaming: (vacuum technology) Movement of gases or vapors from the high pressure to...

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The Foundations of Vacuum Coating Technology

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