NVRAM Specifications

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Type / Organization


	Type:
	Your choices are...
	FRAM		Ramtron’s ferroelectrics random access memory (FRAM) is a new generation of nonvolatile memory that combines high-performance and low-power operation with the ability to retain data without power. FRAM has the fast read/write speed and low power of battery-backed SRAM and eliminates the need for a battery. EEPROM and Flash require long write times, wear out after being written a small number of times, and use a large amount of power to write data. FRAM writes instantly, has virtually unlimited endurance, and requires very little write power.
	NVSRAM		Non-volatile static random access memory (nvSRAM).
	Other
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	Bus Type:
	Your choices are...
	Parallel		A general bus where the data bits are sent in groups.
	Serial		A general bus where the data bits are sent one at a time.
	Serial-1 Wire		A type of communication protocol that uses an I/O pin.
	Serial-2 Wire		A type of communication protocol.
	Serial-3 Wire		A type of communication protocol.
	I²C		Inter-Integrated Circuit (I²C) bus is a two-wire, low to medium speed, communication bus developed by Philips Semiconductors in the early 1980's.
	MICROWIRE™		MICROWIRE™ is a serial protocol created by National Instruments.
	SPI		The serial peripheral interface (SPI) port was developed by Motorola.
	Serial-uPort		A type of communication protocol.
	Other
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Density:
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Number of Words:
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Bits per Word:
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

Performance


	Access Time:
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	Data Rate:
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Data Retention:		The time (in years) that the memory chips can retain the data without reloading.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Endurance:		The maximum number of write / read cycles that the chip can support.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Logic Family:
	Your choices are...
	LCX
	LV
	L
	CMOS 4000
	Emitter Coupled Logic (ECL)
	Transistor-Transistor Logic (TTL)
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Power Characteristics


	Supply Voltage:
	Your choices are...
	-5 V		The chip operates with -5 volts.
	-4.5 V
	-3.3 V		The chip operates with -3.3 volts.
	-3 V		The chip operates with -3 volts.
	1.2 V
	1.5 V
	1.8 V
	2.5 V
	2.7 V		The chip operates with 2.7 volts.
	3 V
	3.3 V
	3.6 V
	5 V
	Other
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	Operating Current:
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	Standby Current:
	Search Logic:		All matching products will have a value less than or equal to the specified value.

Packaging Information


	IC Package Type
	Your choices are...
	BGA		Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	FLGA		Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	TQFP		Thin quad flat package (TQFP).
	SOP		Small outline package (SOP).
	SOIC		Small outline integrated circuit (SOIC).
	TSOP		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	SSOP		Shrink small outline package (SSOP).
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	PLCC		Plastic leaded chip carrier (PLCC).
	LCCC		Leadless ceramic chip carrier (LCCC).
	DIP		Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
	SIP		Single in-line package (SIP).
	Other		Other unlisted, specialized, or proprietary IC packages.
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	Screening Level:
	Your choices are...
	Commercial		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications.
	Industrial		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications.
	Military		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications.
	Other		Other unlisted screening levels.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Pin Count:
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Operating Temperature:
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

NVRAM Specifications

Type:

Bus Type:

Density:

Number of Words:

Bits per Word:

Access Time:

Data Rate:

Data Retention:

Endurance:

Logic Family:

Supply Voltage:

Operating Current:

Standby Current:

IC Package Type:

Screening Level:

Pin Count:

Operating Temperature:

Help with NVRAM specifications: