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Supplier: Indium Corporation
Description: Several low melting point Indalloy® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent
- Alloy: Indium (In)
- Form / Shape: Paste
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator
- Applications: Refractory / High Temperature Materials
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Density: 2.52 g/cc
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator
- Applications: Refractory / High Temperature Materials
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Density: 2.52 g/cc
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator
- Applications: Refractory / High Temperature Materials
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Density: 2.52 g/cc
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator
- Applications: Construction & Building / Architectural, Electrical / HV Parts, Refractory / High Temperature Materials, Walls
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Density: 2.52 g/cc
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
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Supplier: Honeywell Sensing & IoT
Description: 135 Series Thermistors are high-quality, hermetically-sealed, glass-encapsulated units in an axial lead package. They cover the full temperature range of -60 °C to 300 °C [-76 °F to 572 °F]. The uniform dimensions are often suited for automated assembly. The tinned
- Coating: Glass
- Length: 1.13 inch
- Minimum Thermal Time Constant: 4 sec, in air
- Resistance (@25°C): 1.00E6 ohms
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Supplier: Honeywell Sensing & IoT
Description: 135 Series Thermistors are high-quality, hermetically-sealed, glass-encapsulated units in an axial lead package. They cover the full temperature range of -60 °C to 300 °C [-76 °F to 572 °F]. The uniform dimensions are often suited for automated assembly. The tinned
- Coating: Glass
- Length: 1.13 inch
- Minimum Thermal Time Constant: 4 sec, in air
- Resistance (@25°C): 10000 ohms
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Supplier: Honeywell Sensing & IoT
Description: 135 Series Thermistors are high-quality, hermetically-sealed, glass-encapsulated units in an axial lead package. They cover the full temperature range of -60 °C to 300 °C [-76 °F to 572 °F]. The uniform dimensions are often suited for automated assembly. The tinned
- Coating: Glass
- Length: 1.13 inch
- Minimum Thermal Time Constant: 4 sec, in air
- Resistance (@25°C): 10000 ohms
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Supplier: Honeywell Sensing & IoT
Description: 135 Series Thermistors are high-quality, hermetically-sealed, glass-encapsulated units in an axial lead package. They cover the full temperature range of -60 °C to 300 °C [-76 °F to 572 °F]. The uniform dimensions are often suited for automated assembly. The tinned
- Coating: Glass
- Length: 1.13 inch
- Minimum Thermal Time Constant: 4 sec, in air
- Resistance (@25°C): 10000 ohms
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Supplier: Littelfuse, Inc.
Description: or thermal conditions. Their uniform dimensions and axial lead configuration make them especially suitable for use with automatic insertion equipment. Features: High temperature capability to +300°C Hermetically sealed glass package Low cost Excellent long-term stability High
- Coating: Glass
- Resistance (@25°C): 1800 ohms
- Temperature Range: -55 to 300 C
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Supplier: Littelfuse, Inc.
Description: or thermal conditions. Their uniform dimensions and axial lead configuration make them especially suitable for use with automatic insertion equipment. Features: High temperature capability to +300°C Hermetically sealed glass package Low cost Excellent long-term stability High
- Coating: Glass
- Resistance (@25°C): 500 ohms
- Temperature Range: -55 to 300 C
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Supplier: Littelfuse, Inc.
Description: or thermal conditions. Their uniform dimensions and axial lead configuration make them especially suitable for use with automatic insertion equipment. Features: High temperature capability to +300°C Hermetically sealed glass package Low cost Excellent long-term stability High
- Coating: Glass
- Resistance (@25°C): 100000 ohms
- Temperature Range: -55 to 300 C
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Supplier: Littelfuse, Inc.
Description: or thermal conditions. Their uniform dimensions and axial lead configuration make them especially suitable for use with automatic insertion equipment. Features: High temperature capability to +300°C Hermetically sealed glass package Low cost Excellent long-term stability High
- Coating: Glass
- Resistance (@25°C): 150000 ohms
- Temperature Range: -55 to 300 C
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Supplier: Palomar Technologies, Inc
Description: Overview The SST 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to use and designed for a wide variety of
- Application: Brazing / Soldering, Curing, Other
- Configuration: Top Loading
- Controller Type: Programmable
- Height: 483 mm
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Supplier: Pyromation
Description: within a ceramic or glass capsule. Since most resistance temperature detectors and resistance thermometers have a low initial resistance, often 100 ohms, and have a small change in resistance per unit of temperature range, the resistance of the lead wire is often
- Base, Noble and Refractory Metal Type: K
- Configuration: Grounded Thermocouple, Ungrounded Thermocouple
- Element Configuration: Single Element
- Probe Configuration: Angled Probe
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Supplier: Aries Electronics, Inc.
Description: FEATURES Low-Profile Collet Sockets with Solder Pin Tails For Wire Wrap Pins, see Data Sheet 12012 Choose from several size and plating options GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon PIN BODY
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 3 amps
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Supplier: Elite Semiconductor Products, Inc.
Description: Universal 3-way terminales; nap-on, wire wrap-around, or P.C.B. mounting High forward surge current capability Glass passivated chip junctions Typical IR 0.3 uA High temperature soldering guaranteed: 260°C/10 seconds at 5 Ibs. (2.3kg) tension
- Diode Applications: Rectifier Diode
- Diode Type: Other
- IF: 15000 mA
- Tj: -55 to 150 C
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed
- Electrically Conductive: Yes
- Operating / Use Temperature: 302 to 356 F
- Type / Form: Adhesive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Overview ATROX NC200-3 is a electrically insulating die attach adhesive paste. ATROX NC200-3 is formulated to be applied via time pressure dispensing, with either single needle or showerhead configuration. It has a high glass transition temperature and a low temperature
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 56C CAT 9, Epoxy, Assembly LOCTITE® ABLESTIK 56C CAT 9 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Use Temperature: 76 to 248 F
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Supplier: Allied Electronics, Inc.
Description: DIP Sockets, Phosphor Bronze Contact Material, +105°C Operating Temperature Thru hole mounting type Wave solder capable to 240°C Glass-filled thermoplastic housing material Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts
- Contact Plating: Other
- Mounting: Solder
- Number of Contacts: 28
- Package Type: DIP
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Supplier: Pyromation
Description: core and sealing the element within a ceramic or glass capsule. Since most resistance temperature detectors and resistance thermometers have a low initial resistance, often 100 ohms, and have a small change in resistance per unit of temperature range, the resistance of
- # of Lead Wires Per Element: 2, 3, 4
- Diameter or Width Range: 0.1875 to 0.3750 inch
- Element Configuration: Single Element
- Element Material: Platinum
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Supplier: RS Components, Ltd.
Description: Schurter SMD-FST series surface mount glass fuse are directly solder able on printed circuit boards. The SMD-FST series has gold-plated copper alloy terminals that offer a highly reliable connection for primary protection on SMD PCBâ??s. Low breaking capacity. Surface mount
- Approvals / Standards: UL Approval
- Current Rating: 1.6 amps
- Fuse Type: Miniature
- Material: Glass, Other
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Supplier: RS Components, Ltd.
Description: Pico-SPOXâ?¢ SMT wire to board vertical headers with a 1.5mm pitch and a compact low profile design for use in higher current tight packaging applications. These 1.5mm Pico-SPOXâ?¢ headers have high temperature glass-filled nylon UL 94V-0 housings that withstand
- Contacts Pitch: 1.5 mm
- Mounting: SMT, Solder
- Number of Contacts: 10
- Product Type: IC Headers
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Supplier: RS Components, Ltd.
Description: Top & side actuation versions. Sealed terminals to prevent ingress of flux during soldering. Electrical life: 10000 cycles. Glass filled Polyamide actuator and PBT high temperature thermoplastic case Contact Configuration = SPDT Mounting Type = PCB Switch Operation = On
- Maintained Switch Function: ON / ON (Low / High)
- Maximum Current: 0.1000 amps
- Maximum DC Voltage: 30 volts
- Maximum Mechanical Life: 20000 (#)
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Supplier: RS Components, Ltd.
Description: Toggle switches designed for low-level signal switching. Terminations sealed with epoxy resin. Nylon 4//6 actuator and Glass Filled Nylon 6//6 case. Gold contacts. Electrical life: 20000 cycles. Operating temperature range: -30 to +85°C Contact Configuration = SPDT Switch
- Actuator Material: Metallic
- Maintained Contact: Yes
- Maximum Current Rating: 0.4000 amps
- Momentary Contact Switch Function: Other
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Supplier: Henkel Corporation - Industrial
Description: required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing. Room
- Coeff. of Thermal Expansion (CTE): 33.89 µin/in-F
- Viscosity: 354 cP
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Supplier: Entech Electronics Inc.
Description: · Single, Double-Sided and Multilayer Flexible Circuits · Flexi-Rigid Technologies · Multilayer RF/Microwave Boards Substrates · High temperature FR4 · Standard Epoxy Glass NEMA grade FR4 · Exotic materials with higher maximum operating
- Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Supplier Capability: Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability
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Supplier: NDK
Description: extremely severe environmental conditions. Excellent environmental characteristics, including heat, vibration and shock resistance. Meets the requirements for re-flow profiling using lead-free solder. Excellent performance for wide temperature range heat cycles (-40 to x125 °C) when
- Drive Level: 0.0100 milliwatts
- Features / Standards: RoHS Compliant
- Frequency Tolerance: 0.0050 %
- Load Capacitance: 8 pF
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Supplier: G.I.E. Inc.
Description: Available with a wide range of manual and automatic actuators, these valves are available with weir style and straightway flow patterns. Sizes range from 1/2" thru 3" threaded or weld ends: and 1/2" thru 12" flanged ends. Pressure ratings to 200 psi and temperatures to 340 F. GIE, Inc
- Actuation: Manual / Hand, Pneumatic
- Connection: Threaded, Bolt Flange, Butt Weld, Socket Weld / Solder
- Material of Construction: PVC, Polypropylene (PP), Other
- Number of Ports/Ways: 2
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Supplier: Equilibar, LLC.
Description: /VCO type and Valco (low dead volume) ends available Wide Variety of Diaphragms Including PTFE, Polyimide, SS316, and glass reinforced PTFE Chemical Compatibility: Can be configured to meet your aggressive chemistry Each of these standard Instrument Series models is based on
- Actuation: Mechanical Device
- Connection: Threaded, Compression Fitting, Bolt Flange, Clamp Flange, Union, Tube Fitting, Butt Weld, Socket Weld / Solder
- Material of Construction: PTFE - Teflon®
- Number of Ports/Ways: 2
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Supplier: ATV Technologie GmbH
Description: atmosphere and receiving perfect void free soldering results – again and again. Due to its very low nitrogen consumption the SRO-700 is prepared for the latest generation of flux based solder pastes which depend on low oxygen content during the process run. Technical Data
- Configuration: Bench / Cabinet
- Temperature Range: 450 to 700 F
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Supplier: HSI Sensing (Hermetic Switch, Inc.)
Description: Features Hermetically Sealed Contact Magnetically balanced w/latching capability High Power: 3 Amp 75 W or VA @ .1 Hz Max., Life 30,000 + Cycles Low Power: 1 Amp 25 W or VA @ 1 Hz Max., Life 1,000,000 + Cycles Advantages
- Current Rating: 2 amps
- DC Voltage Rating: 150 volts
- Pole and Throw Specifications: Single Pole, Double Throw (SPDT)
- Power Rating: 50 watts
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Supplier: Richardson RFPD
Description: the anode strap is bonded to the chip at temperatures exceeding 300°C. The anode strap has a unique, large cross-sectional area design allowing for high current capability. The packages are sealed using a projection welding technique in an inert environment. Kilovolt PIN diodes are available
- Diode Type: PIN Diodes, RF Diodes
- VR: 3000 volts
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Supplier: Allied Electronics, Inc.
Description: PCB Headers Are Molded from High-Temperature Glass-Filled PA46 Nylon to Withstand Reflow-Solder Temperatures, Which Eliminates the Need for a Secondary Wave- Solder Process
Find Suppliers by Category Top
Featured Products Top
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ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions. This (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
properties of components by eliminating stress caused by solder materials. DeepMaterial provides formulations for fast filling of very fine pitch parts, fast cure capability, long working and lifespan, as well as the reworkability. Reworkability saves costs by allowing removal of the underfill for (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
lower soldering temperatures and to protect other temperature sensitive PCB components. An additional key feature is that the solder tails are located outside of the insulator material in order to facilitate visual inspection. These strong, lightweight holders also employ reliable spring tension for low (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
. Hartford Technologies manufactures glass balls from soda-lime and borosilicate materials. Soda-lime balls are recommended for applications requiring hardness and excellent corrosion resistance. In applications where high temperatures and (read more)
Browse Balls and Sphere Shapes Datasheets for Hartford Technologies, Inc. -
ALPHA HRL3 is a lead-free, low temperature, high reliability alloy for use application where low temperature processing is desired. ALPHA HRL3 is available in solder sphere format for ball mount application. The alloy was designed to exhibit improved drop shock and thermal (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
distinctive characteristics of this glass filled PAI is improved machinability when compared to other PAI compression molded materials. Micro machining with fewer burs left behind than competitive materials is possible. TECAPAI CM XP530 has high strength and stiffness at elevated temperatures, a low CLTE (read more)
Browse Plastic Plate, Rod, and Stock Shapes Datasheets for Ensinger, Inc. -
. Classic GMT materials consist of glass fiber mats manufactured to the company’s own patents, and these are impregnated with polypropylene in a second process step. The result is materials with outstanding impact resistance and optimum crash behavior. Even at low temperatures, GMT (read more)
Browse Polymer and Plastic Composites Datasheets for MCA - Advanced Materials Division -
Pyroid Pyrolytic Graphite for Glass Industry Pyroid pyrolytic graphite material is a universal glass-handling material having exceptional heat resistance, strength, and durability with nonabsorption characteristics to (read more)
Browse Carbon, Graphite, and Diamond Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group
Conduct Research Top
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LED Lamp Soldering
Since the transparent resin has a low softening temperature (glass transition temperature), carefully control the temperature when soldering. The following precautions should be observed when soldering lead type LED lamps.
More Information Top
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Hermetic sealing of long period fiber gratings
A low temperature glass solder is introduced to seal around the fiber.
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Sealing optical fibers without metallization: design guidelines
This paper describes a low temperature solder glass and the process for sealing optical fibers reliably and at a significant cost savings over the solder sealing method.
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Optical fiber sealing with solder glass: design guidelines
This paper describes a low temperature solder glass and the process for sealing optical fibers reliably and at a significant cost savings over the solder sealing method.
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CERAMIC ABSTRACTS
-The properties and applications of some low temperature solder glasses used in the electron tube industry are discussed.
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Real Cost Of He-Ne Lasers For The Original Equipment Manufacturer (OEM) User
In this process mirrors are sealed onto the laser tube envelope using an intermediate low temperature solder glass in a manner similar to the way face plates are sealed to the bulbs of CRT's.
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A Reliable Dry Ceramic Dual In-Line Package (CERDIP)
The internal cavity moisture condition which insures absence of corrosion is reproducibly attained by using vitreous low temperature solder glass of the proper composition to form the hermetic seal.
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Temperature dependence of microelectronic device failures
R. R. Tummala, ‘Stress corrosion of low temperature solder glass ’, Noncrystalline Solids, 19, (l), 26S272 (1975).
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Hybrid Glass Structures for Telecommunication Applications
Frit bonding involves the sandwiching of a low temperature solder glass in the form of a paste or dry powder between two glass surfaces3,4 .
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The use of differential thermal analysis for the examination of glasses
Most low temperature solder glasses were found to cry- stallize quite readily under different thermal stresses.
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Fracture toughness in the PbO-GeO2 and PbO-SiO2 binary glass systems
Inorganic glasses with PbO as a major constituent are important for commercial applications involving low temperature solder glasses , for coatings on metals and other glasses and for optical appli- cations, the latter because of their high index of refraction and dispersion [1…