Multilayer Chip Inductors

High Frequency Circuits -- 8430 Series
from API Technologies Corp.

Multilayer Ceramic Chip Inductor [See More]

  • Technology: Multilayer
  • Inductance Range: 1.00E-3 to 0.2200
  • Core Material: Ceramic
  • DCR: 0.1000 to 2.8
Fixed Inductors -- 1276-6188-1-ND [CIG10FR47MNC from Samsung Electro-Mechanics]
from Digi-Key Electronics

FIXED IND 470NH 800MA 200 MOHM [See More]

  • Technology: Multilayer
  • Molded / Shielded: Shielded
  • Packing Method: Tape Reel
  • Inductance Range: 0.4700
RF Chip Inductor -- 1624117-5 [1624117-5 from TE Connectivity ™]
from Richardson RFPD

Inductors [See More]

  • Technology: Multilayer
  • Application: RF Choke
  • Core Material: Ferrite
  • DCR: 3.00E-4
1048558 [LQG15HN12NJ02D from Murata Power Solutions]
from RS Components, Ltd.

LQG15HN SMD inductors from Murata feature a multilayer construction. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others. LQGH15HS SMD inductors are highly reliable and suitable... [See More]

  • Technology: Multilayer
  • Inductance Range: 0.0120
  • EIA Case Size: 0402 (1005M)
  • Inductance Tolerance: -5 to 5
High Frequency Multilayer Chip Inductors for Automotive (BODY & CHASSIS, INFOTAINMENT) / Industrial Applications (HK series) -- HK06031N0S-TV
from TAIYO YUDEN (U.S.A.) Inc.

Features. AEC-Q200 qualified. Multilayer inductor made of advanced ceramics with low-resistivity. silver used as internal conductors provides excellent Q and SRF characteristics. Designed to address surface mount inductor needs for applications above 100MHz. Multilayer block structure ensures... [See More]

  • Technology: Multilayer
  • Inductance Range: 1.00E-3
  • Standards and Certifications: RoHS
  • DCR: 0.1100
Multilayer Chip Inductors
from Bourns, Inc.

The Bourns Technology Center is home to several emerging high-tech companies in Riverside, California. It is dedicated to providing a strong partnership between resident companies and the community. The Bourns Technology Center is located at the entrance to one of the fastest developing industrial... [See More]

  • Technology: Multilayer
  • Packing Method: Tape Reel
  • Core Material: Ceramic; Ferrite
  • Standards and Certifications: RoHS
CTCB-Power -- CTCB0402F-100P
from Central Technologies

Applications include noise suppression, telecommunication equipment [See More]

  • Technology: Multilayer
  • Devices in Package: 1
  • Core Material: Ferrite
  • Packing Method: Tape Reel
EFH Series -- EFH1608 - 10N
from Excel Cell Electronic USA Corp.

High SRF & Q at high frequency, monolithic inorganic material construction [See More]

  • Technology: Multilayer
  • Packing Method: Tape Reel; Bulk
  • Core Material: Ferrite
  • Application: High Frequency
Chip Inductors
from Frontier Electronics Corp.

Frontier Electronics designs and manufactures customer specific solutions when industry standard products do not meet their requirements. Redesigns for tighter tolerances, smaller footprints, higher performance, etc.. Redesigning and/or re-manufacturing obsolete components to conform to the latest... [See More]

  • Technology: Wirewound; Multilayer
  • EIA Case Size: 0402 ~ 2220
  • Core Material: Ceramic; Ferrite
  • Inductance Range: 0.0013 to 10000
SMD Inductors & Ferrite Beads
from KEMET Electronics Corporation

KEMET is proud to introduce ferrite products (inductors) to our product portfolio. Inductors are used in every type of electronic equipment including computers, telecommunication, automotive electronics, military electronics, medical electronics and consumer electronics. Offerings include both... [See More]

  • Technology: Standard; Wirewound; Multilayer
  • Standards and Certifications: RoHS
  • Packing Method: Tape Reel
  • Inductance Range: 1 to 100
High Frequency Ceramic Chip Inductors -- MHI Series
from RCD Components, Inc.

HIGH FREQUENCY CERAMIC CHIP INDUCTORS. Wide range - 0.6nH to 470nH, up to 10GHz 420mA. Advanced monolithic construction especially suited for high frequency applications. Excellent Q and SRF characteristics. Operating temperature range: -55 °C to +125 °C. Standard tolerance: ±5% (... [See More]

  • Technology: Multilayer
  • Packing Method: Tape Reel (optional feature); Bulk (optional feature)
  • Core Material: Ceramic
  • Application: High Frequency
High Frequency Inductors
from Samsung Electro-Mechanics

High-frequency inductors consist of ceramic materials made of glass and internal/external electrodes made of silver. They are plated with nickel and tin. These inductors can be applied usefully for high frequency of 100 MHz or higher because they have high Q characteristics in high frequency, the... [See More]

  • Technology: Multilayer
  • EIA Case Size: 0603 to 1608
  • Core Material: Ferrite
  • Application: High Frequency
IMCG Series
from Trigon Components, Inc.

SERIES. IMCG. DESCRIPTION. Multilayer, General Purpose. INDUCTANCE RANGE. 0.047 to 10uH. IDC. 15 to 300mA. DCR. 0.15 to 1.15ohm. PACKAGE. SMD 0402 to 1206. FEATURE. •To prevent EMI interference noises between. •High Q and high reliability and ferrite material. [See More]

  • Technology: Multilayer
  • Devices in Package: 1
  • Core Material: Ferrite
  • Packing Method: Tape Reel; Bulk
Multilayer Chip Inductors -- CL100505T-10NM-N
from Yageo USA

General Features [See More]

  • Technology: Multilayer
  • Inductance Range: 0.0100
  • Packing Method: Tape Reel
  • Inductance Tolerance: 20