Products & Services
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Supplier: Aries Electronics, Inc.
Description: FEATURES 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board For Panelized
- Operating Temperature: 105 C
- Number of Contacts: 8
- Contact Plating: Nickel Plating
- Features: Other
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Supplier: Aries Electronics, Inc.
Description: FEATURES 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board. GENERAL SPECIFICATIONS SOCKET BODY:
- Current Rating: 3 amps
- Operating Temperature: 105 C
- Number of Contacts: 8
- Socket Type: DIP
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Supplier: ROHM Semiconductor USA, LLC
Description: ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.
- VF: 1.3 volts
- IF: 150,000 mA
- VR: 75 volts
- Tj: -55 to 150 C
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Supplier: Micropac Industries, Inc.
Description: No Description Provided
- Isolation Voltage: 1,000 volts
- Rise Time: 25 µs
- Collector Emitter Breakdown Voltage: 40 volts
- Operating Temperature: -55 to 125 C
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Supplier: Micropac Industries, Inc.
Description: No Description Provided
- Isolation Voltage: 1,000 volts
- Rise Time: 15 µs
- Collector Emitter Breakdown Voltage: 40 volts
- Operating Temperature: -55 to 125 C
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Supplier: Micropac Industries, Inc.
Description: No Description Provided
- Isolation Voltage: 1,500 volts
- Rise Time: 100 µs
- Collector Emitter Breakdown Voltage: 20 volts
- Operating Temperature: -55 to 125 C
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Supplier: Aries Electronics, Inc.
Description: FEATURES Lead-Free RoHs/WEEE-compliant 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
- Operating Temperature: 105 C
- Number of Contacts: 8
- Contact Plating: Gold Plating, Nickel Plating
- Features: Other
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Supplier: Accuris
Description: Monotonic Bend Characterization of Board-Level Interconnects
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Supplier: Accuris
Description: JEDEC Module Sideband Bus (SidebandBus)
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Supplier: Accuris
Description: Notification Standard for Product Discontinuance
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Supplier: Accuris
Description: Mechanical Shock Test Guidelines for Solder Joint Reliability
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Supplier: IPC International, Inc.
Description: DESCRIPTION This publication is intended to characterize the fracture strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The
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Supplier: IPC International, Inc.
Description: DESCRIPTION This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices
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Supplier: IPC International, Inc.
Description: DESCRIPTION Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board
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Supplier: Allied Electronics, Inc.
Description: M25P32 T7YSO 16 .30 LARGE JEDEC MS-013
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Supplier: Aries Electronics, Inc.
Description: FEATURES Convert surface-mount QFP packages to a 13x13 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and
- Operating Temperature: 105 C
- Number of Contacts: 132
- Contact Plating: Nickel Plating
- Features: Other
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Supplier: Utmel Electronic Limited
Description: MOSFET 150V 7L JEDEC GREEN EMC
- PD: 3,800 milliwatts
- TJ: -55 to 175 C
- Features: MOSFET, Other
- Packing Method: Tape Reel
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Safety Labels and Signs - Label;Reusable Orange w/Black Type;JEDEC-14 Symbol;1.875"x2.5" -- 70112919Supplier: Allied Electronics, Inc.
Description: Reusable, black printing on orange background. This 3M JEDEC-14 label displays the reaching hand symbol and provides writing space. Size: 1.875 in. x 2.5 in. (4.6 cm x 6.4 cm)
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Supplier: IPC International, Inc.
Description: by IPC and JEDEC. 14 pages. Released March 2008.
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Supplier: Allied Electronics, Inc.
Description: Destructible, black printing on yellow background. This 3M JEDEC-14 label displays the reaching hand symbol and provides writing space. Room to write. JEDEC-14 Symbol Size: 1.875 in. x 2.5 in. (4.6 cm x 6.4 cm)
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Supplier: Texas Instruments
Description: JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
- Gate Type: Buffer / Driver
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Supplier: Texas Instruments
Description: JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
- Operating Temperature: 0 to 85 C
- Supply Voltage: 1.5 V
- Gate Type: Buffer / Driver
- IC Package Type: Other
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Supplier: DigiKey
Description: SO 08 .15 JEDEC
- Supply Current (IS): 1.7999999999999998 milliamps
- Slew Rate (SR): 2 V/µs
- Operating Temperature: -40 to 125 C
- Features: Buffer, Current Sense Amplifier, Instrumentation Amplifiers, Operational Amplifiers, Other
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Supplier: InnoDisk USA Corporation
Description: Features JEDEC standard 1.5V +/- 0.075V Power Supply Frequency:1066Mhz, 1333Mhz SSTL_15 Interface 8 independent internal bank 8-bit pre-fetch Burst Length: 8, 4 Average Refresh Period 7.8us On Die Termination using ODT pin Asynchronous Reset All of Lead-free products are compliant for RoHS
- Capacity: 1,000 to 4,000 MB
- Clock Speed: 1,066 to 1,333 MHz
- Pin Count: 240 #
- Operating Temperature: -40 to 185 F
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Supplier: Lingto Electronic Limited
Description: SO 20 .30 TO JEDEC M
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Supplier: RS Components, Ltd.
Description: JEDEC DIMM Serial output temp sensor
- Operating Temperature: -40 to 125 C
- Standards and Certifications: RoHS Compliant
- Sensor Type: Temperature Sensor
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Description: JEDEC DDR5 TEMPERATURE SENSOR WI
- Input (Supply) Voltage: 1.7 to 1.98 volts
- Operating Temperature: -40 to 125 C
- Features: Other, Tape Reel
- Sensor Type: Temperature Sensor
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Supplier: ODG (Origin Data Global)
Description: SO 20 .30 TO JEDEC M
- Operating Temperature: -40 to 150 C
- Input Voltage (VIN): 9.5 to 19 volts
- Features: Linear Regulator, Other
- Package Type: SOIC / SOP
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Supplier: Powell Electronics, Inc.
Description: LABEL, MOISTURE BARRIER BAG, IPC/JEDEC J
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Supplier: DigiKey
Description: IC Socket Adapter SOIC To JEDEC Through Hole
- Features: Board Mount Connector
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Supplier: VAST STOCK CO., LIMITED
Description: MOSFET 150V 7L JEDEC GREEN EMC
- Features: MOSFET
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Supplier: RS Components, Ltd.
Description: 20 MHz, JEDEC SOIC, Ind Temp, Green, T&R
- Internal ROM Size: 1 KB
- Pin Count: 8
- Bits: 8 Bit
- Features: Other
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Supplier: VAST STOCK CO., LIMITED
Description: High Speed Optocouplers HIGH SPEED JEDEC OPTOCPLR/SOLID STATE
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Supplier: ODG (Origin Data Global)
Description: MBB IPC/JEDEC 4MIL 14X16" 100/PK
- Features: ESD Suppressor
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Supplier: VAST STOCK CO., LIMITED
Description: Registers DDR4RCD01 JEDEC Cmpliant DDR4 Regstr
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Featured Products Top
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CAMM2 (Compression Attached Memory Module) is the next generation of memory interconnect from Amphenol, a JEDEC standard that comes in several stack heights and pin sizes. CAMM2 uses Amphenol cLGA® direct-attach compression technology for high (read more)
Browse Board Mount Connectors Datasheets for Amphenol Communications Solutions -
. Product is rapidly transferred between the hot and cold chamber creating a temperature shock of the specimens. These thermal shock chambers meet a variety of test specifications including Mil-Std 810, Mil-Std 883, IEC 60068-2-14, JEDEC and a variety of commercial test standards (read more)
Browse Environmental Test Chambers and Rooms Datasheets for Weiss Technik North America, Inc. -
?Performance Validation ? 25% better thermal transfer than JEDEC standard heatsinks (tested @ 15W/in² heat flux) ? 5000+ hr salt spray certified for industrial environments (ASTM B117) ? -40°C to 150°C operational range with <3% thermal resistance (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
compatibility • Wide 2.7 to 5 V supply voltage range • 200 nS switching time • Ultra-miniature, MLPD (6-pin, 1.1 x 0.7 x 0.45 mm) package (MSL1, 260 °C per JEDEC J-STD-020) Applications: • WiFi 6E T/R switches • WLAN (read more)
Browse RF Switches Datasheets for Richardson RFPD -
Features Tight parameter distribution Available as singles, pairs, and dual pairs Packages rated MSL1, 260 per JEDEC J-STD-020 Skyworks GreenTM products are compliant with all applicable (read more)
Browse Diodes Datasheets for Skyworks Solutions, Inc. -
JESD78, Class II ESD protection: HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2,000 V CDM ANSI/ESDA/JEDEC JS-002 Class C3 exceeds 1,000 V Specified from -40°C to +85°C (read more)
Browse Serial Cables Datasheets for DigiKey -
for AI server hot-swap functions. With top-side and bottom-side cooling options, these MOSFETs in CCPAK provide high power density and reliable solutions. All devices are supported by JEDEC registration and Nexperia’s interactive datasheets for seamless integration (read more)
Browse Metal-Oxide Semiconductor FET (MOSFET) Datasheets for Nexperia B.V. -
called out in the EIA/IPC/JEDEC joint standard J-STD-002. Learn how traditional solderability tests may over-reject acceptable aged material. Discover an allowable alternative that more closely simulates board attach, providing a practical solution to this (read more)
Browse Uncategorized Products Datasheets for Rochester Electronics -
125 volts with liner removal or label removal/repositioning. These products are ANSI/ESD S20.20, ESD S541, IEC 61430 and JEDEC JESD 625B compliant (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Polyonics -
code shadowing to RAM Interfaces: Quad SPI and JEDEC xSPI-compatible Octal and HYPERBUS™ Automotive grade: AEC-Q100 qualified and proven at extreme temperatures (-40°C to +125°C) Enhanced reliability: Supports ECC (SECDED) along with CRC protection over (read more)
Browse FLASH Memory Chips Datasheets for Infineon Technologies AG
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App Note: Guidelines for Pb-Free Soldering of Fairchild Components Based on JEDEC (R) J-STD 20D / IEC EN 61760-1:2006
This app note presents Fairchild's recommendation for a starting point for SMT and wave solder profiles.
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Achieving High-Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
In this study, the reliability of low-Ag SAC alloy doped with Mn (SACm (R)) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
for business this week, Japan's Renesas Technology Inc. has also reeled in its 300-mm silicon foundry unit--Trecenti Technologies Inc. JEDEC may offer its own seal of approval The JEDEC Solid State Technology Association
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (March 29) Heard on the Beat (March 29) JEDEC forms new IC standards group to make 802.11 WLANs fly ARLINGTON, Va. -- Will the wireless local-area networking (WLAN) market finally take off? JEDEC here is attempting to make the WLAN market fly by confirming the formation of a new
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Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-Scale Packaging Technology (.pdf)
the size and performance advantage of bare die assembly and the reliability of encapsulated devices, while permitting automated assembly processes and low production costs. According to the IPC/JEDEC J-STD-012 definition, a chip scale package is a single-die, surface-mountable pack¬age with an area
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Chinese consumer electronics firms pursue GSM cell phones Hitachi's reply to Rambus: you violated antitrust act, Jedec rules Motorola to de-emphasize SRAMs in favor of network-specific memories On Semi widens power-management line with new voltage converters GenRad acquires two imaging
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Rambus targeted by FTC probe The Federal Trade Commission has launched a preliminary investigation of Rambus Inc. for possible antitrust violations stemming from the company's dealings with the JEDEC standards deliberation body. Semiconductor Alert! (Jan. 29-Feb. 2) Commentary & analysis of week's
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
In a rare move, the JEDEC standards body is considering a specification that would result in a modified, or look-alike, DDR-II memory chip aimed at graphics cards. IEDM sees strained, fully depleted future The 48th International Electron Devices Meeting, planned for Dec. 8-11 in San Francisco, may
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http://dspace.mit.edu/bitstream/handle/1721.1/41026/43034251-MIT.pdf?sequence=2
Standard designs have been established, for example, by the JEDEC (Joint Electronic Device Engineering Council) [88].
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http://dspace.mit.edu/bitstream/handle/1721.1/37674/124507392-MIT.pdf?sequence=2
Table 3.10: JEDEC Membership 2005 .
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More standardization skullduggery
… secret informant (designated Secret Squirrel) inside the Joint Electronic Devices Engi- neering Council ( JEDEC ) standard-setting group …
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ZCP2009ISTFA182
Instrumental Discrepancy and Relation of Stress Condition between ESD Association and JEDEC Standards on ESD CDM Test …
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Tape and Reel Information - RF Modules
ESD-SURFACE RESISTIVITY SHALL BE ≤ 1 X 10 8 OHMS/SQUARE PER EIA, JEDEC TNR SPECIFICATION.
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The effect of copper trace routing on the drop test reliability of BGA modules
The JEDEC drop test has become a popular method for the assessment of the dynamic mechanical reliability …
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High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics
Various test board assemblies have been drop tested in 00 JEDEC and 900 vertical drop orientations.
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Thermal characterization of plastic ball grid array packages via infrared thermography
… via IRT were found to be equal to those obtained by thermocouple techniques using standard JEDEC methods.