Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: CHINO Works America Inc.
Description: The equipment is semiconductor aging testing equipment to full-automatically execute burn-in processing and data measurement/judgment /analytical processing and also has tester function as well as temperature accelerating testing.
- Components / Products Tested: Active Components / Semiconductors, Boards - Loaded PCB, MEMS / Sensors, Optoelectronics / Fiber Optics, Passive Components, Power Supplies / Transformers
- DUT Interfacing / Adapters: Flying Prober / Scanner
- Features: Burn-in, Fault Diagnostics / Logic Analysis, Temperature Controller
- Options / Module Types: Measure Unit / Monitor, Source Module / Unit, Interface / Fixture System
-
Supplier: Haida International Equipment Co., Ltd.
Description: by the level very high temperatures and very low temperature environment can tolerate continuous, whereby chemical changes in the shortest time to test its thermal expansion and contraction caused or physical damage. Usage For electrical and electronic components, automation
- Configuration: Floor Mount
- Features: Programmable
- Temperature Control: Heating, Cooling
- Temperature Range: -50 to 175 C
-
Supplier: Haida International Equipment Co., Ltd.
Description: Walk-in test rooms is suitable for the high temperature, low temperature resistance and moisture resistance test of the products such as inductance, PCB, battery, computer, mobile phone, printer, household appliance, auto parts and vehicle. Particularly walk in
- Configuration: Walk-In
- Humidity Range: 40 to 85 % RH
- Temperature Control: Heating, Cooling
- Temperature Range: 20 to 80 C
-
-
Supplier: Weiss Technik North America, Inc.
Description: PCB’s, blister packs or lipstick – tests to stabilize and optimize the quality of products are indispensable in research and laboratories. Our laboratory test chambers were designed for this purpose in particular and allow reproducible temperature and climatic
-
Supplier: Aries Electronics, Inc.
Description: /contact on 0.40-0.45mm pitch OPERATING TEMPERATURE:-55°C [-67°F] min. to 150°C [302°F] max. MOUNTING CONSIDERATIONS See “PCB FOOTPRINT TOP VIEW” for requirements REQUIRES: four #2-56 screws and PEM nuts for mounting (not supplied
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 0.4000 to 0.4500 mm
- Features: Solderless, Clamshell Socket
-
Supplier: Hitachi High-Tech America
Description: Oxford Instruments CMI511 is a temperature compensating gauge for measuring Plated Through Hole (PTH) Cu thickness using Eddy Current technology. The CMI511 system is a hand held, battery operated instrument capable of measuring Plated Through Hole Cu prior to and after etching. It operates
- Application: Coating Thickness
- Measurement Range: 0.0020 to 0.1020 mm
- NDT Probe Technology: Eddy Current, Specialty / Other
- Style / Type: Surface Probe
-
Supplier: Aries Electronics, Inc.
Description: FEATURES Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers Contacts are normally closed to eliminate dependence on plastic to sustain contact
- Contact / Pin Type: Solder Tail Pins
- Contact Plating: Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
-
Supplier: Dyna-Graphics Corporation
Description: characteristics. Not only can they tolerate extreme temperatures and be water resistant, they can also withstand a wide variety of chemicals and solvents making them suitable for almost any industry. Touch Screens: We offer ITO Analog Resistive Touch Screens. Designed with 4-wire, 5-wire or 8
- Location: North America, United States Only, Midwest US Only
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability
-
Supplier: Hitachi High-Tech America
Description: The CMI 165 Copper Plating Gauge is a handheld coating thickness gauge that is specifically designed for PCB electronics manufacturers and copper platers who require quick, easy, accurate and repeatable measurements on hot or cold copper traces or panels.
- Application: Coating Thickness
- Measurement Range: 2.50E-4 to 0.2540 mm
- NDT Probe Technology: Eddy Current, Specialty / Other
- Special Features: Replaceable / Detachable Tip
-
Supplier: Aries Electronics, Inc.
Description: CONTACT CURRENT RATING: 1 amp OPERATING TEMPERATURES: -85°F to 257°F [-65°C to 125°C] Au plating, -85°F to 392°F [-65°C to 200°C] NiB (Spinodal) ACCEPTS LEADS: 0.014-0.026 [0.36-0.66] dia., 0.120-0.290 [3.05-7.37] long MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.032 ±0.002 [0.81
- Contact / Pin Type: Solder Tail Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
-
Supplier: IDENTCO International
Description: labels feature a 2.0 mil ultra-aggressive permanent acrylic adhesive that, like the product’s printable materials, offers excellent resistance to harsh chemicals and high temperatures. Its adhesive power is equally impressive, with tests showing a 20-minute dwell with a peel adhesion
- Backing / Base: Specialty / Other
-
Supplier: Aries Electronics, Inc.
Description: FEATURES Aries Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers Contacts are normally closed to eliminate dependence on plastic to sustain contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
- Dielectric Withstanding Voltage: 1 kilovolts
-
Supplier: Richardson RFPD
Description: 14-Bit, 80 MSPS Analog to Digital Converter is now available as a Standard Microcircuit Drawing (SMD). The 5962-0423001QXC is a high-speed, high-performance monolithic 14-bit ADC, which is 100% production tested at 70 MHz and 150MHz at -35°C to +85°C case temperature. Units are
- IC Package Type: QFP
- Resolution: 14 bits
- Sample Rate: 80000 kSamples/Sec
-
Description: resulting from the accuracy of the measuring equipment, preparation method and specifications of the component manufacturers (components, PCB, solder paste, etc.). b) Distinction from existing standards The envelope profile given in this document does not represent a temperature-time
-
Supplier: Smiths Interconnect
Description: 5A continues current carrying capacity and capable -50 to 170deg C test environment. Proprietary contact design with wiping action at device pad to ensure consistent contact resistance. Minimal scrub action to the PCB pad. Features & Benefits Smiths Interconnect's Celsius
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
-
Supplier: Allied Electronics, Inc.
Description: , 30,000 cycles, 120 VAC, 1 A, resistive, 30,000 cycles. 5 VDC, 20 mA, resistive, 100,000 cycles. Temperature Ratings: One fixed set point 40°C-120°C (104°F-248°F). Differential: 15°C (27°F). Dielectric Strength: 1,500 VAC/1 minute. Features: Approvals: CSA and UL Recognized Applications:
- Contact Configuration: Switch Type: Normally Closed, NC
- High Temperature Set Point: 248 F
- Maximum AC Voltage: 120 volts
- Maximum Current: 1.00E-3 to 0.0200 amps
-
Supplier: Allied Electronics, Inc.
Description: , 30,000 cycles, 120 VAC, 1 A, resistive, 30,000 cycles. 5 VDC, 20 mA, resistive, 100,000 cycles. Temperature Ratings: One fixed set point 40°C-120°C (104°F-248°F). Differential: 15°C (27°F). Dielectric Strength: 1,500 VAC/1 minute. Features: Approvals: CSA and UL Recognized Applications:
- Contact Configuration: Switch Type: Normally Closed, NC
- High Temperature Set Point: 248 F
- Maximum AC Voltage: 120 volts
- Maximum Current: 1.00E-3 to 0.0200 amps
-
Supplier: Allied Electronics, Inc.
Description: , 30,000 cycles, 120 VAC, 1 A, resistive, 30,000 cycles. 5 VDC, 20 mA, resistive, 100,000 cycles. Temperature Ratings: One fixed set point 40°C-120°C (104°F-248°F). Differential: 15°C (27°F). Dielectric Strength: 1,500 VAC/1 minute. Features: Approvals: CSA and UL Recognized Applications:
- Contact Configuration: Switch Type: Normally Open, NO
- High Temperature Set Point: 248 F
- Maximum AC Voltage: 120 volts
- Maximum Current: 1.00E-3 to 0.0200 amps
-
Supplier: Allied Electronics, Inc.
Description: , 30,000 cycles, 120 VAC, 1 A, resistive, 30,000 cycles. 5 VDC, 20 mA, resistive, 100,000 cycles. Temperature Ratings: One fixed set point 40°C-120°C (104°F-248°F). Differential: 15°C (27°F). Dielectric Strength: 1,500 VAC/1 minute. Features: Approvals: CSA and UL Recognized Applications:
- Contact Configuration: Switch Type: Normally Closed, NC
- High Temperature Set Point: 248 F
- Maximum AC Voltage: 120 volts
- Maximum Current: 1.00E-3 to 0.0200 amps
-
Supplier: InfraTec GmbH
Description: E-LIT – Automated testing solution system allows non-contact failure inspection of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss can be measured with Lock-in Thermography. This is achieved by using the shortest
- Form Factor: Bench / Rack / Cabinet, Monitoring System
- Instrument Type: Flaw Detection
- Technology: Other
-
Supplier: MacDermid Alpha Electronics Solutions
Description: flexibility at extremely low temperatures and provides extremely low moisture vapour permeability. This readily repairable coating maintains its excellent mechanical and dielectric properties over a wide temperature range, especially after thermal shock testing. LTC low
- Flexible / Dampening: Yes
- Industry Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
-
Supplier: Richardson RFPD
Description: /repetitive unclamped inductive switching (UIS) Three-phase, 380/400 V RMS, 50Hz or 60 Hz input voltage 140 kHz switching frequency 780 V DC output voltage PCB layout with consideration for safety, current stress, mechanical stress, and noise immunity Open source software for digital control
- Category: Development Board
-
Supplier: Honeywell Sensing & IoT
Description: industry-leading Total Error Band and its being a combined humidity/temperature sensor. True, temperature-compensa ted digital I2C output: Typically allows the customer to remove the components associated with signal conditioning from the PCB to free up space and reduce costs
- Form Factor: Sensor / Probe
- Operating Temperature: -40 to 185 F
- Relative Humidity Accuracy: 4 %
- Relative Humidity Range: 10 to 90 %
-
Supplier: Honeywell Sensing & IoT
Description: industry-leading Total Error Band and its being a combined humidity/temperature sensor. True, temperature-compensa ted digital I2C output: Typically allows the customer to remove the components associated with signal conditioning from the PCB to free up space and reduce costs
- Form Factor: Sensor / Probe
- Operating Temperature: -40 to 185 F
- Relative Humidity Accuracy: 4 %
- Relative Humidity Range: 10 to 90 %
-
Supplier: Honeywell Sensing & IoT
Description: industry-leading Total Error Band and its being a combined humidity/temperature sensor. True, temperature-compensa ted digital I2C output: Typically allows the customer to remove the components associated with signal conditioning from the PCB to free up space and reduce costs
- Form Factor: Sensor / Probe
- Operating Temperature: -40 to 185 F
- Relative Humidity Accuracy: 4 %
- Relative Humidity Range: 10 to 90 %
-
Supplier: Honeywell Sensing & IoT
Description: industry-leading Total Error Band and its being a combined humidity/temperature sensor. True, temperature-compensa ted digital I2C output: Typically allows the customer to remove the components associated with signal conditioning from the PCB to free up space and reduce costs
- Form Factor: Sensor / Probe
- Operating Temperature: -40 to 185 F
- Relative Humidity Accuracy: 4 %
- Relative Humidity Range: 10 to 90 %
-
Description: IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
-
Supplier: HAVE, Inc.
Description: tabs for FASTON 0.187" x 0.02" (4.8 mm x 0.5 mm) or PCB-version with pins 1.6 mm x 0.5 mm (FASTON is a trademark of AMP Inc.) Solderability complies with IEC 68-2-20 Materials Contacts: Female: CuZn39Pb3 Male: CuSn8, 4 â•¡m Ag plated Housing Insulator: PA 6 30% GR Housing Flange: Zinc Diecast
-
Supplier: Master Bond, Inc.
Description: Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100°F to +500°F with a glass transition
- Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Composition: Unfilled
-
Supplier: Richardson RFPD
Description: and ADC header pins Single Power Module Solution 21 mOhm six-pack module All Silicon Carbide MOSFETs Integrated temperature sensor Baseplateless package with isolated alumina substrate Specifications
- Category: Development Board
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP42HT-2 is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding chemical resistance. It is widely used in medical devices because of its ability to
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrical Insulation / Dielectric
- Coeff. of Thermal Expansion (CTE): 19.44 to 22.22 µin/in-F
- Composition: Unfilled
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrical Insulation / Dielectric
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
-
Supplier: TE Connectivity
Description: Number of Sections : 4 Number of Signal Positions : 68 PCB Mount Orientation : Vertical Contact Features Contact Current Rating (Max) (AMP) : 25, 7.5 Contact Mating Area
- Contact Plating: Gold Plating
- Mounting: Other
- Product Type: Pin Receptacles
-
Supplier: HAVE, Inc.
Description: 3 pole female chassis connector, plastic housing, pin 1 separated from chassis and ground, vertical PCB mount. Retention spring instead of latch. TECHNICAL DATA Electrical Number of contacts: 3 - 5Rated current: 6 A (5-pole: 3 A) Rated voltage: 50 V ac Contact resistance: = 5 m Ohm Insulation
- Connector Type: XLR Connector
- Gender: Female / Jack
-
Supplier: HAVE, Inc.
Description: : - initial > 2 G Ohm - after damp heat test > 1 G Ohm (IEC 68-2-30) Dielectric strength: 1500 V dc Mechanical Lifetime: > 1000 mating cycles Insertion / withdrawal force: = 20 N Retention method (Female versions only): - standard: latch lock - â"¤-0â"¤ version
- Connector Type: XLR Connector
- Gender: Female / Jack
-
Supplier: HAVE, Inc.
Description: : - initial > 2 G Ohm - after damp heat test > 1 G Ohm (IEC 68-2-30) Dielectric strength: 1500 V dc Mechanical Lifetime: > 1000 mating cycles Insertion / withdrawal force: = 20 N Retention method (Female versions only): - standard: latch lock - â"¤-0â"¤ version
- Connector Type: XLR Connector
- Gender: Female / Jack
Find Suppliers by Category Top
Featured Products Top
-
environmental testing at the device’s intended operating temperature, pressure and relative humidity. In the case of copper coining as a heat sink, the cavity needs to be placed near the component being targeted for heat sinking. This could be easy in power systems, but it could be difficult (read more)
Browse PCB Design and Layout Services Datasheets for Summit Interconnect -
Identification of test points in high density PCB packages is a key to greater PCB production testing and service troubleshooting. Keystone Electronics has developed a new series of (read more)
Browse Test Points Datasheets for Keystone Electronics Corp. -
been lumped together in the summary to improve readability if their purposes are closely related. Temperature and Altitude (Section 4.0) These tests check for the effects of altitude and cabin pressure changes on the performance of aircraft systems. There are multiple (read more)
Browse Metal Oxide Varistors (MOVs) Datasheets for MDE Semiconductor, Inc. -
The Dytran 3316 Series is an ultra high temperature piezoelectric accelerometer, designed to reliably operate in temperatures up to +1000°F (+538°C) with charge mode capabilities. Featuring a (read more)
Browse Accelerometers Datasheets for Dytran by HBK -
Hast High Humidity Pressure Accelerated Aging Test Equipment for PCB Control System: 1.Micro-computer saturated steam LED digital display temperature controller ,LED digital time controller and pointer type pressure display (read more)
Browse Environmental Test Chambers and Rooms Datasheets for AI SI LI (China) Test Equipment Co., Ltd. -
circuitry caused by shorted test probes. The color-coded standoff of the TP-106 is molded from 30% glass filled polyester which is designed to withstand the temperatures of production wave soldering processes and resist board cleaning solvents or chemicals. The oval contact element is precision formed (read more)
Browse Test Points Datasheets for bisco industries -
/MXB family share a single, universal PCB footprint layout Ideal for high-density arrays and filter banks Wide temperature ranges with tight stability and great long-term reliability Standard, off-the-shelf products Custom frequencies or rejection with 3-6 poles and up to two shunts Can be made in USA and with ITAR compliance (read more)
Browse RF Filters and Microwave Filters Datasheets for Richardson RFPD -
Discover the P Series plastic circular connectors, an ideal choice for medical electronics, testing, and consumer electronics. Engineered with medical standards in mind, these connectors boast non-toxicity, high-temperature sterilization capability, and compliance with ROHs and REACH regulations (read more)
Browse Circular Connectors Datasheets for Shenzhen Beike(Bexkom) Electronics Co., Ltd. -
resistance against temperature and mechanical stress. If vibrations, collisions, or twists occur, the robust use of lead wires reduces potential damage to a PCB’s chip capacitor. TMH-assembled PCB components are also easy to remove and replace for testing or prototype development. Common (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Advanced Assembly, LLC. -
mount process temperatures. With its low profile and small footprint, the CGSM is ideal for use in high density PCB layouts and high bandwidth applications. (read more)
Browse Reed Relays Datasheets for Comus International
Conduct Research Top
-
UltraPad (R) Silicone Press Pad with Excellent Mar Resistance (Press Pads for Flex and Rigid Flex PCB Lamination)
of the potential to cause lamination induced defects in the PCB. A test method is developed to quantify mar resistance in this paper. The factors for mar resistance such as temperature, pressure, time, press pad thickness, and crosslink density of silicone rubber are analyzed. This paper also introduces
-
FAQs > Diodes
Maximum Storage and Operating Temperature. Using parallel resistors and capacitors across diodes. Dimensions - nominal, max., and min. MTBF for MD90FF18 and similar diodes. Space level diodes. Mounting K25UF epoxy diode to PCB. Polarity testing. High Temp Plastic Diodes. I 2T. Series and parallel
More Information Top
Indicates content that may require registration and/or purchase.
-
Analysis of Field Loads in Automotive ECUs and MEMS Sensors
Fig. 8: Measured car speed and PCB temperature during test drive and soak phase .
-
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
A real time low tem- perature test of PCBs will provide useful information about their behavior.
-
Design of high-temperature SiC three-phase AC-DC converter for >100°C ambient temperature
So, the high- temperature PCB is tested again with -55~180°C cycling profile and the results showed no significant changing after 200 thermal cycling times.
-
Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections
The mechanism of failures can be specified with high probability at the basis of plotted curves, and information about test conditions (such as momentary acceleration, strain in specific location on the surface of tested PCB or temperature in the climatic chamber).
-
Cryptographic Hardware and Embedded Systems - CHES 2013
We used a TestEquity Model 107 temperature chamber to fully enclose the test PCB during temperature variation testing.
-
Development of a novel PCB-based voice coil actuator for opto-mechatronic applications
Thermal Test Results ( PCB Temperature .
-
Temperature-dependent elimination of 2,4,6,2′, 4′-pentachloro[U-14 C]biphenyl inNereis virens (Polychaeta)
The two ap- proaches have the same result: among the four tested temperatures , PCB elimination is optimum at 12~ .
-
Liquid crystal polymer as a substrate material for flip chip ACA interconnections
Table 4 Failure percentages for the FR-4 PCB during Temperature cycling test A FR-4 .
-
Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection
The results are presented so that the dependency of the component operating temperature on the test PCB construction and the effect of using different PCB modeling strategies on prediction accuracy are both highlighted.
-
Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints
• Thickness of gold plating, the nature of the component substrate, and the solder volume in the joint all need to be considered carefully for high- temperature test of the PCB .