Ceramic Paste

Description: AGH – series Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition

• Features: Electrically Conductive Compound (Adhesive, Grease)
• Form: Grease / Paste
• Industry: Electronics

Description: Diamond Paste consists of blocky diamond particles prepared in paste form to suit various applications. It exhibits uniform cutting properties producting precision reflective surfaces of high values. Applications: Ceramics, T.C., Mechanical Seals, Metallographic Samples,

Description: Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete

• Chemical / Polymer System Type: Ceramic / Inorganic Cement
• Composition: Unfilled
• Compound Type: Thermally Conductive
• Cure Type / Technology: Single Component System

Description: Properties: Concentration: 30 g/L - 35g/L Single Layer > 80% Flake Size: 0.5-5 Microns Color: Brown Water based paste Sizes: 30 ml and 60 ml Application: Transparent Conductive Films Composites and Paper-Like Materials Energy-Related Materials

• Applications: Biotech / Medical (Biomaterial)

Description: Conductive silver paste is a quick-drying silver paste. It is refined from ultra-fine silver powder and low-temperature curing thermoplastic resin, suitable for screen printing. It can be widely used in FFC and flexible printed circuits, and can be used on PET and PC sheets, especially

• Density: 1.8 g/cc

Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals,

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Features: Electrical Insulation / Dielectric
• Material Type: Grease / Paste

Description: Dap Kwik Seal Plus clear adhesive/sealant is compatible with ceramic, drywall, fiberglass, glass, metal, plastic, stone and wood materials with a 24 hr cure time. Provides a 30 min fixture time. Minimum to maximum operating temperatures are -30 F to +180 F.

• Features: Grease / Paste
• Use Temperature: -30 to 180 F

Description: Dap Kwik Seal Plus clear adhesive/sealant is compatible with ceramic, drywall, fiberglass, glass, metal, plastic, stone and wood materials with a 24 hr cure time. Provides a 30 min fixture time. Minimum to maximum operating temperatures are -30 F to +180 F.

• Features: Grease / Paste
• Use Temperature: -30 to 180 F

Description: Dap Kwik Seal Plus white adhesive/sealant is compatible with ceramic, drywall, fiberglass, glass, metal, plastic, stone and wood materials with a 24 hr cure time. Provides a 30 min fixture time. Minimum to maximum operating temperatures are -30 F to +180 F.

• Features: Grease / Paste
• Use Temperature: -30 to 180 F

Description: Dap Kwik Seal Plus off-white adhesive/sealant is compatible with ceramic, drywall, fiberglass, glass, metal, plastic, stone and wood materials with a 24 hr cure time. Provides a 30 min fixture time. Minimum to maximum operating temperatures are -30 F to +180 F.

• Features: Grease / Paste
• Use Temperature: -30 to 180 F

Description: Sauereisen Aluseal Adhesive Cement Paste No. 2 White is a ceramic adhesive that is used for sealing, cementing, and assembling metal, glass, porcelain, and other materials. It has excellent flow, bond strength, thermal shock resistance, and can be used on production lines. It can be

• Chemical / Polymer System Type: Ceramic / Inorganic Cement
• Dielectric Strength: 49 kV/in

Description: STANDARD TEST METHOD FOR BOND STRENGTH OF CERAMIC TILE TO PORTLAND CEMENT PASTE

Description: This product is a conductive carbon paste with graphene as the main conductive agent developed and produced by our company. It is suitable for printing various types of glass, ceramics and other high-temperature insulating materials. The cured film thickness and final resistance are

Description: Graphene epoxy anti-corrosion coating puree is prepared by using bisphenol A epoxy resin E-20 as the base material, graphene as the auxiliary material, adding specific additives and solvents, and adopting a specific process. The product is easy to use, easy to disperse again, and does not change the

Description: Supreme 11HTND withstands thermal cycling, has high bond strength and excellent toughness. It has a paste consistency andis easy to apply.

• Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 38.89 to 41.67 µin/in-F
• Dielectric Constant (Relative Permittivity): 5.3

Description: STANDARD TEST METHOD FOR BOND STRENGTH OF CERAMIC TILE TO PORTLAND CEMENT PASTE - INCLUDES STANDARD + REDLINE (PDF)

Description: Momentive TSE392 clear is a one-component, fast cure, non-corrosive silicone adhesive sealant that cures on exposure to atmospheric moisture to form an elastic silicone rubber. TSE392 has a thixotropic paste consistency and excellent corrosion-free adhesion to metals, including copper,

• Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric

Description: Application Fields Universal high-gloss 2 component UV screen printing ink for the printing of glass and ceramics. Substrates may differ in their surface properties or method of manufacture. Therefore, a suitability test must always be carried out before printing. Characteristics

• Substrate / Surface: Ceramic / Porcelain, Glass, Metal

Description: Machinable Glass Ceramic Parts Machining Instruction: Machinable ceramics is a new kind of ceramic material, the material the use of metal processing tools and equipment can usually work out precision tolerance of the products, here is a brief introduction of its processing

• Compressive / Crushing Strength: 73679 psi
• Density: 2.48 g/cc
• MOR / Flexural Strength: 15664 psi
• Material Type: Glass Ceramic

Description: EP22ND has a high compressive strength, long working life and is readily machinable.

• Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 12.22 to 13.89 µin/in-F
• Dielectric Constant (Relative Permittivity): 7.5 to 8

Description: 1.1 This test method covers the determination of the ability of glazed ceramic wall tile, ceramic mosaic tile, quarry tile, and pavers to be bonded to portland cement paste. This test method includes both face-mounted and back-mounted tile. 1.2 The values stated in inch-pound

Description: 1.1 This test method covers the determination of the ability of glazed ceramic wall tile, ceramic mosaic tile, quarry tile, and pavers to be bonded to portland cement paste. This test method includes both face-mounted and back-mounted tile. 1.2 The values stated in inch-pound

Description: 1.1 This test method covers the determination of the ability of ceramic tile, ceramic mosaic tile, quarry tile, porcelain tile, and paver tile to be bonded to portland cement paste. Tiles may be glazed or unglazed. This test method includes both face-mounted and back-mounted

Description: Typical uses are screen printing of PCBs (for surface mounting of chip and leadless components), fired-on ceramics, and gold/silver-plated surfaces. Methods of heating are hot air, vapour phase, infrared, hot plates and even conventional electric irons. Standard particle size available.

• Form / Shape: Paste

Description: of ceramic-to-metal brazing , the brazing industry has relied primarily on hand application for the refractory metallization pastes needed to create the braze seal. For a complex joint, skilled technicians (artists, really) painstakingly apply the paste using a variety of

• Density: 3.6 to 3.9 g/cc
• Material Type: Alumina / Aluminum Oxide

Description: Sauereisen Insa-Lute Adhesive Cement Paste No. 1 Off-White is used for bonding, encapsulating, and insulating applications. It bonds well to glass, metal, and ceramics. It is thermally conductive, insulates electricity, non-toxic, odorless, high temperature resistant, and thermal shock

• Chemical / Polymer System Type: Ceramic / Inorganic Cement
• Dielectric Strength: 12.5 to 51 kV/in
• Substrate / Material Compatibility: Ceramic / Glass, Metal
• Tensile Strength (Break): 410 psi

Description: 1.1 This test method covers the determination of the ability of glazed ceramic wall tile, ceramic mosaic tile, quarry tile, and pavers to be bonded to portland cement. This test method includes both face-mounted and back-mounted tile. 1.2 The values stated in inch-pound units are to be

Description: EP21NDCL is an eye-catching system that is optically clear when mixed, even though Part A is translucent and Part B is light amber. It produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. EP21NDCL

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 22.22 to 25 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Dielectric Constant (Relative Permittivity): Over 2.92

Description: Application Fields Universal high-gloss 2 component UV screen printing ink for the printing of glass and ceramics. Substrates may differ in their surface properties or method of manufacture. Therefore, a suitability test must always be carried out before printing. Characteristics

• Substrate / Surface: Ceramic / Porcelain, Glass, Metal

Description: on three principles and criteria: the fluxing of the paste (binder + fine particles + water) the limitation of friction between aggregates the stabilization of the mixture to avoid segregation risks Just like conventional castables, self

• Applications: Refractory / High Temperature Materials

Description: Small diameter ceramic media used to disperse paint and paint pigments, and chemical coatings. Primary users include paint manufacturers (industrial, automotive and marine paints), medical manufacturers, and producers of wear resistant epoxies. Applications include: Paint mixing and

• Applications: Grinding / Ball Milling, Specialty / Other
• Grading System (Grit / Shot): Mesh Graded
• Material / Composition: Aluminum Oxide
• Media Dimension A / Diameter: 0.0311 to 0.1319 inch

Description: Master Bond Polymer System UV15-7TK1ANV is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive, does not contain any solvents or other volatiles and does not embrittle even upon exposure to low

• Coeff. of Thermal Expansion (CTE): 33 to 39 µin/in-F
• Dissimilar Substrates: Yes
• Elongation: 2 to 6 %
• Features: Thermal / Heat Insulating, Electrical Insulation / Dielectric, Flexible / Dampening, Non-corrosive Cure

Description: Ceramic Metering Pump types we supply : Two Piece Ceramic pump Three Piece Ceramic pump Groove Valve Ceramic Pump Trace Filling pump Two Piece Ceramic Pump : Minimum Filling Capacity : 0.5ml Maximum filling accuracy: 1000ml Filling accuracy

• Maximum Discharge Pressure: 652671 psi
• Pump Type: Positive Displacement Pumps

Description: A silicone based oil with various metal oxide (ceramic) powders for providing the best in thermal conductivity. The materials are electrically insulative to ensure that leakage of currents can not be formed should the paste come into contact with other parts of the assembly. For use

• Chemical / Polymer System Type: Silicone
• Material Type: Grease / Paste
• Thermal Conductivity: 3 W/m-K
• Use Temperature: -58 to 392 F

Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.

• Fluxes & Cleaners: Soldering Flux / Rosin
• Form / Shape: Paste