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  • E&I Materials Power and Protect Space Exploration Vehicles and Satellites
    NASA is again using DuPont technology, including Kapton (R) polyimide films and Pyralux (R) copper-clad flexible circuit laminate materials, to power and protect the Perseverance mission to Mars.
  • AMB AlN Ceramic Substrate
    Aluminum nitride (AlN) ceramics as a high thermal conductivity, thermal expansion coefficient close to silicon semiconductor material, has good insulation and mechanical properties, aluminum nitride copper clad plate has very high thermal conductivity in thermal characteristics, heat dissipation