Products & Services
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Supplier: Bluestar Silicones USA Corp.
Description: Soft Dielectric Compound Lubricant/Sealant Description Bluesil V-726 is a soft, easily spreadible, silica-thickened dimethyl silicone compound. It is designed as a lubricant for rubber and plastics, rubber coated and fiber optic cables. Bluesil V-726 is also an excellent
- Operating / Use Temperature: -50 to 400 F
- Dielectric Strength: 650,000 V/m
- Density / Specific Gravity (@15.6°C, 60°F): 1.03 specific gravity
- Features: Dielectric (Transformer / EDM), Lubricant, Process Equipment, Specialty / Other
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Supplier: Bluestar Silicones USA Corp.
Description: Stiff, Tacky Dielectric Compound Lubricant and Sealant Description Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric
- Use Temperature: -67 to 400 F
- Dielectric Strength: 502.92000000000104 kV/in
- Dielectric Constant (Relative Permittivity): 3
- Features: Electrical Insulation / Dielectric Material
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Supplier: Newark, An Avnet Company
Description: SEALING & DIELECTRIC COMPOUND
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Supplier: Bluestar Silicones USA Corp.
Description: Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric properties and is useful for protecting and sealing electrical and mechanical
- Flash Point: 500 F
- Density / Specific Gravity (@15.6°C, 60°F): 1.03 specific gravity
- Industry Applications: Automotive / Transportation, Electrical / Electronic
- Features: Bearings, Dielectric (Transformer / EDM), Lubricant, Specialty / Other
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Supplier: Newark, An Avnet Company
Description: SEALING & DIELECTRIC COMPOUND ROHS COMPLIANT: YES
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Supplier: Techsil Limited
Description: NovaGard® G624 is an amorphous fumed silica thickened, polysiloxane based compound which offers an excellent water barrier with superior corrosion protection properties. Novagard® G624 is a general purpose compound; formulated specifically for use as a water repellent coating to
- Type / Function: Dielectric (Transformer / EDM)
- Composition / Chemistry: Silicone
- Features: Synthetic / Semi-synthetic
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Supplier: Accuris
Description: COMPOUND, RUBBER, SILICONE, HIGH DIELECTRIC PROPERTIES, ROOM TEMPERATURE VULCANIZING
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR DIELECTRIC TESTING OF WIRE AND CABLE FILLING COMPOUNDS
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Supplier: Accuris
Description: Standard Test Method for Dielectric Testing of Wire and Cable Filling Compounds
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Supplier: ASTM International
Description: Standard Test Method for Dielectric Testing of Wire and Cable filling Compounds
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR DIELECTRIC TESTING OF WIRE AND CABLE FILLING COMPOUNDS - INCLUDES STANDARD + REDLINE (PDF)
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Supplier: ASTM International
Description: or salts, degrade the cable's electrical properties. Limits on the dielectric properties of the cable filling compound are usually specified by the cable manufacturer, by industry standards or both.
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: IES2000
Description: VBC is a water based damping compound for the treatment of vibrating metal, wood, glass, ceramic and most plastic surfaces. This material imparts vibration damping and a shift in the dominant frequency. The resulting structure borne noise reduction provides a means of improving the noise
- Thickness: 0.0625 to 0.1875 inch
- Description: Compound (Spray), Compound (Trowel)
- Mounting: Spray / Trowel
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Viscosity: 500 to 3,000 cP
- Thermal Conductivity: 0.297109474 W/m-K
- Dielectric Strength: 400.000000000001 to 609.9999999999997 kV/in
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of
- Use Temperature: -40 to 392 F
- Thermal Conductivity: 0.92 W/m-K
- Features: Air Setting / Film Drying, Specialty / Other, Thermally Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: base Natural Oil Polyol (NOP) used in 20-2125 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN potting compound. Using renewable resources such as NOPs will reduce the demand on
- Use Temperature: -22 to 257 F
- Thermal Conductivity: 0.297109474 W/m-K
- Elongation: 225 to 295 %
- Tensile Strength (Break): 155 to 1,750 psi
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Supplier: Dupont Molykote
Description: Silicone-based compound, heavy consistency APPLICATIONS Lubrication for control and pressure plug valves, water softener and faucet valves. Sealant for vacuum and pressure systems. Sealant for outdoor equipment (also shipboard) subject to washing and harsh environmental exposure: meters,
- Operating / Use Temperature: -40 to 399.2 F
- Dielectric Strength: 17,716,535.4330708 V/m
- Density / Specific Gravity (@15.6°C, 60°F): 1 specific gravity
- Industry Applications: Automotive / Transportation, Electrical / Electronic, Food Grade / Contact (FDA H1), Marine
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Supplier: Waytek, Inc.
Description: Dynatex Dielectric Grease is a silicon dioxide thickened, very high molecular weight dimethyl polysiloxane-based material. It is an extremely stiff, tacky, tenacious compound with excellent water repellency even to seawater. It has outstanding high-temperature and vacuum capabilities
- Operating / Use Temperature: 40 to 400 F
- Type / Function: Dielectric Grease
- Features: Grease / Gel
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame
- Use Temperature: 266 F
- Thermal Conductivity: 0.41826091 W/m-K
- Elongation: 120 %
- Tensile Strength (Break): 1,200 psi
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Supplier: Epoxies Etc...
Description: 20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006 provides low stress on surface mount and other delicate electronic
- Viscosity: 19,000 to 25,000 cP
- Thermal Conductivity: 0.4326837 W/m-K
- Elongation: 10 %
- Dielectric Constant (Relative Permittivity): 3.53
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low
- Viscosity: 690 cP
- Dielectric Strength: 533 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
- Thermal Conductivity: 0.37499254 W/m-K
- Dielectric Strength: 454.99999999999955 kV/in
- Dielectric Constant (Relative Permittivity): 4.3
- Viscosity: 30 to 20,000 cP
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is
- Use Temperature: 248 F
- Thermal Conductivity: 0.21634185 W/m-K
- Elongation: 9.5 %
- Tensile Strength (Break): 6,370 psi
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Supplier: Dupont Molykote
Description: Silicone grease for automotive spark plug boots
- Applications: Automotive / Transportation
- Features: Dielectric Grease
- Type / Function: Grease / Gel, Specialty / Other
- Composition / Chemistry: Silicone, Synthetic / Semi-synthetic
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Supplier: Bluestar Silicones USA Corp.
Description: 20 durometer, designed for use in special effects applications, skin contact grade Properties Viscosity 50000 Hardness Sha 25 Description Bluesil V-1022 is a medium hardness, self-bonding, room temperature curing silicone rubber compound. It is designed as a potting and encapsulating material
- Use Temperature: -65 to 400 F
- Thermal Conductivity: 0.184611712 W/m-K
- Tensile Strength (Break): 150 psi
- Elongation: 150 %
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Supplier: Ellsworth Adhesives
Description: DuPont MOLYKOTE® 5 Compound is a grease-like, dielectric compound that is used to make moisture resistant seals for electrical, automotive, aircraft, and marine assemblies. It can also be used to lubricate and seal o-rings, switches, door seals, cable connectors, and battery
- Dielectric Strength: 545 kV/in
- Substrate Compatibility: Metal
- Chemical System: Silicone
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect and preserve the
- Viscosity: 700 cP
- Dielectric Strength: 558.8000000000012 kV/in
- Dielectric Constant (Relative Permittivity): 2.5
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound, Flexible / Dampening, Liquid
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21BAS is a radio-opaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical and chemical properties. A user friendly one-to-one (1/1) mix ratio by weight or
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 27 µin/in-F
- Tensile Strength (Break): 7,500 psi
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Supplier: Allied Electronics, Inc.
Description: Heat Transfer Compound, 350 V⁄MIL Dielectric Strength, 2.5 Specific Gravity Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high
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Supplier: SAE International
Description: This specification covers class L, low dielectric constant (12 or under), ceramic, electrical, insulating compounds, for use in electronic, communications, and allied electrical equipments, and the grading thereof (see 6.1 ).
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still flowable almost constant properties between -40 °C
- Viscosity: 25,000 to 120,000 cP
- Thermal Conductivity: 0.8 W/m-K
- Tensile Strength (Break): 580.147357428788 psi
- Elongation: 90 %
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Supplier: Allied Electronics, Inc.
Description: Heat Transfer Compound, 400 V⁄MIL Dielectric Strength, 2.3 Specific Gravity Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high
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Supplier: Allied Electronics, Inc.
Description: with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination. MIL-DTL-47113D
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Supplier: Techsil Limited
Description: Non-corrosive to metals and sensitive substrates Excellent dielectric properties Outstanding performance over a wide thermal range Technical Properties Uncured Consistency: Flowable Colour: Blue Tack-Free Time: 20 Mins Cured Shore Hardness: 45 Shore A Elongation: 230% Dielectric
- Features: Electrical Insulation / Dielectric, Thermal / Heat Conductive
- Industry: Electronics
- Chemical System: Rubber Based / Elastomeric, Silicone
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Featured Products Top
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flexibility, strength, and durability in HFFR compounds, with ADMER™ adhesive polyolefins that improve insulation performance and enable lighter, more efficient cable designs. For high-frequency applications, TPX™ offers a PFAS-free alternative with excellent (read more)
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Designing thermal management for a coffee-machine heater means balancing three practical constraints: the pad must shrink predictably during processing, conduct heat efficiently away from the heater, and—where applicable—provide high dielectric (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
resistance. Unlike conventional pastes or pads, it then chemically cures into a resilient solid, eliminating pump-out and providing permanent dielectric bonding between heatsink and processor. Key benefits include sustained low thermal resistance under continuous power and thermal cycling (read more)
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. Total Conformability: It "wets" microscopic surface irregularities, eliminating the air gaps that often remain when using rigid mechanical fasteners. Dielectric Strength: (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. SC900FG is engineered to meet these challenges. Built with a reinforced glass fiber or PI film base, this 0.2 mm thermal insulating film offers low thermal resistance, excellent dielectric (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
providing electrical insulation.They feature high dielectric breakdown strength,good thermal conductivity,tear resistance,and more.These properties help prevent accidents such as leakage or breakdowns.Additionally,silicone insulator pads are highly temperature-resistant,preventing degradation or aging (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
that require electrical protection, an optional dielectric coating is available. This helps prevent short circuits while preserving the thermal benefits of the graphite sheet. SR Series graphite sheets are widely used in (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. This self-adhesive thermal pad combines excellent compressibility with high dielectric strength of over 8 kV/mm, helping battery designers protect sensitive cells and nearby components in demanding high-voltage environments. Its soft (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
electrical characteristics and exhibits superior performance over conventional PFA, PTFE, polyimide and epoxy materials in many AV applications. Key benefits of Fluon+ PFA EA-2000 compounds include: Superior electrical performance, with the lowest dielectric constant (2.0) and low dissipation factor (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc.
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
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Selecting the Right Potting Compound for Your Application
Many questions arise when trying to select an appropriate potting compound. An experienced materials expert can help identify the primary concerns, recommend materials, provide testing of the materials, and offer information on dielectric strength, adhesive. characteristics, thermal conductivity
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NEW ADVANCES IN PRIMERLESS SILICONE INSULATION MATERIALS
insulation properties, consistent flexibility, and tenacious bond strength. However, the process for applying silicone rubber laminate insulation tape requires a cumbersome priming step. Recent advances in silicone compound chemistry have led to the formulation of primerless silicones that bond without
More Information Top
Indicates content that may require registration and/or purchase.
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Patent reportings on chemisch‐technische apparatuses
North German Seekrbelwerke Nordenham a. d. W., Akt.-Gee., of Erfmder: Heinz Kinky, Ernst Studt, Hermann Havenith, Nordenham a. d. W. method and device for production einm of permanent dielectric compound on the solder and repair positions of ladders isolated with gutta …
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Review
North German Seekrbelwerke Nordenham a. d. W., Akt.-Gee., of Erfmder: Heinz Kinky, Ernst Studt, Hermann Havenith, Nordenham a. d. W. method and device for production einm of permanent dielectric compound on the solder and repair positions of ladders isolated with gutta …
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32. Main assembly of the Germans Bunsen‐Gesellschaft for applied physical chemistry
Aiialoge Uberlegungen applies fur dielectric compounds .
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Chemical display in New York
dielectric compounds , capacitors and hochfeuer-brooklyn, N.Y., its new auBerordentlich light-stable chromium .
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Generation and consumption of non-ferrous metals in Germany
dielectric compounds , capacitors and hochfeuer-brooklyn, N.Y., its new auBerordentlich light-stable chromium .
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A new low emissivity system for architectural glass
The arrangement allows the langzeitstabile high rate separation of dielectric connecting layers like SiO2 .