Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Techsil Limited
Description: NovaGard® G624 is an amorphous fumed silica thickened, polysiloxane based compound which offers an excellent water barrier with superior corrosion protection properties. Novagard® G624 is a general purpose compound; formulated specifically for use as a water repellent coating to
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
-
Supplier: Bluestar Silicones USA Corp.
Description: Soft Dielectric Compound Lubricant/Sealant Description Bluesil V-726 is a soft, easily spreadible, silica-thickened dimethyl silicone compound. It is designed as a lubricant for rubber and plastics, rubber coated and fiber optic cables. Bluesil V-726 is also an excellent
- Applications: Electrical / Electronic, Process Equipment
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Density / Specific Gravity (@15.6°C, 60°F): 1.03 specific gravity
- Dielectric Strength: 650000 V/m
-
Supplier: Dupont Molykote
Description: Silicone-based compound, heavy consistency APPLICATIONS Lubrication for control and pressure plug valves, water softener and faucet valves. Sealant for vacuum and pressure systems. Sealant for outdoor equipment (also shipboard) subject to washing and
- Applications: Automotive / Transportation, Electrical / Electronic, Marine, Food Grade / Contact (FDA H1)
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Density / Specific Gravity (@15.6°C, 60°F): 1 specific gravity
- Dielectric Strength: 1.77E7 V/m
-
-
Supplier: Bluestar Silicones USA Corp.
Description: Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric properties and is useful for protecting and sealing electrical and mechanical
- Applications: Automotive / Transportation, Electrical / Electronic
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Density / Specific Gravity (@15.6°C, 60°F): 1.03 specific gravity
- Features: Sealing / Barrier, Mold Release / Release Agent
-
Supplier: Nordson EFD
Description: -pneumatic dispensers High dielectric strength Long shelf-life stability RoHS and REACH compliant Lead-free EFD's thermal compounds are formulated to virtually eliminate pump-out, ensuring long-lasting thermal management and effective heat transfer. The long-term material stability of
- Chemical / Polymer System Type: Specialty / Other
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
-
Supplier: Techsil Limited
Description: Offers self-adhesion properties Non-corrosive to metals and sensitive substrates Excellent dielectric properties Outstanding performance over a wide thermal range Technical Properties Uncured Consistency: Flowable Colour: Blue Tack-Free Time: 20 Mins Cured Shore Hardness: 45 Shore A
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric
- Industry: Electronics
- Rubber Based / Elastomeric: Yes
-
Supplier: IES2000
Description: VBC is a water based damping compound for the treatment of vibrating metal, wood, glass, ceramic and most plastic surfaces. This material imparts vibration damping and a shift in the dominant frequency. The resulting structure borne noise reduction provides a means of improving the noise
- Mounting: Spray / Trowel
- Product Description: Compound (Trowel), Compound (Spray)
- Thickness: 0.0625 to 0.1875 inch
-
Supplier: Dupont Molykote
Description: Silicone grease for automotive spark plug boots
- Applications: Automotive / Transportation
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Type: Grease / Gel, Specialty / Other
-
Supplier: Hapco, Inc.
Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 1.67 to 1.73
- Dielectric Strength: 390 kV/in
-
Supplier: Hapco, Inc.
Description: A tough, REPAIRABLE, shock resistant potting compound for short and long run productions. DI-PAK E-4568 has excellent insulating properties, a very low moisture vapor transmission rate, can be operated from -60°C to +100°C, and performs in both wet and dry environments. It can be easily
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 1.3
- Dielectric Strength: 710 kV/in
-
Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.2 to 4.5
- Dielectric Strength: 565 kV/in
-
Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.1 to 4.4
- Dielectric Strength: 400 kV/in
-
Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone compound, non-flowable
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Elongation: 250 to 350 %
-
Supplier: Bluestar Silicones USA Corp.
Description: Stiff, Tacky Dielectric Compound Lubricant and Sealant Description Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric
- Dielectric Constant (Relative Permittivity): 3
- Dielectric Strength: 503 kV/in
- Features: Electrical Insulation / Dielectric Material, Grease / Paste
- Use Temperature: -67 to 400 F
-
Supplier: Fluoro-Plastics, Inc.
Description: Most widely used filler in various percentages (5%, 10%, 15% and 25%) Improves creep resistance, both at low and high temperatures Chemically stable (except for strong alkalis and hydrofluoric acid (HF) Little effect on the electrical properties of PTFE, and improves wear and friction behavior
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
- Elongation: 100 to 200 %
- Filler Material: Other
- Form / Shape: Plate, Rod / Round Stock
-
Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
-
Supplier: Waytek, Inc.
Description: Dynatex Dielectric Grease is a silicon dioxide thickened, very high molecular weight dimethyl polysiloxane-based material. It is an extremely stiff, tacky, tenacious compound with excellent water repellency even to seawater. It has outstanding high-temperature and vacuum capabilities
- Operating / Use Temperature: 40 to 400 F
- Type: Grease / Gel
-
Supplier: ACCRAbond, Inc.
Description: INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Epoxies Etc...
Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
-
Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has a convenient mix ratio and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
-
Supplier: Epoxies Etc...
Description: -2125. The base Natural Oil Polyol (NOP) used in 20-2125 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN potting compound. Using renewable resources such as NOPs will reduce the
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 5.5 to 5.8
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Single Component System
- Dielectric Strength: 533 kV/in
-
Supplier: Wacker Chemical Corp.
Description: dielectric gel especially designed to seal, protect and preserve the electrical characteristics of delicate electronic components (e.g. bonded chips on hybrid components which are exposed to extreme external influences).
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Dielectric Constant (Relative Permittivity): 2.5
-
Supplier: Accuris
Description: COMPOUND, RUBBER, SILICONE, HIGH DIELECTRIC PROPERTIES, ROOM TEMPERATURE VULCANIZING
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow product
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Dielectric Strength: 457 kV/in
-
Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 912 is a pourable, addition-curing, 2-part silicone rubber that cures to a soft silicone gel when mixed with ELASTOSIL® CAT PT, ELASTOSIL® CAT PT-F or ELASTOSIL® CAT UV. Special features two-part, 10 : 1 mixing ratio low viscosity modular system allows flexible adjustment of pot life and
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Two Component System
- Dielectric Constant (Relative Permittivity): 2.7
-
Supplier: ASTM International
Description: Standard Test Method for Dielectric Testing of Wire and Cable filling Compounds
-
Supplier: Accuris
Description: STANDARD TEST METHOD FOR DIELECTRIC TESTING OF WIRE AND CABLE FILLING COMPOUNDS
-
Encapsulants and Potting Compounds - Thermally Conductive Silicone Compound -- SEMICOSIL® 970 TC A/BSupplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still flowable almost constant properties between -40 °C
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 911 A/B is a pourable, addition-curing, two-part silicone rubber that cures to a soft silicone gel. Special features two-part, 1 : 1 mixing ratio thixotropic rapid heat cure forms a soft gel on vulcanization low content of volatiles low content of uncured polymer almost constant
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Provides the ultimate in thermal conductivity with a very wide temperature range obtained by using silicone base oils. Product Overview HTSP Silicone Heat Transfer Compound Plus is a modified "Plus" version of Electrolube’s successful HTS, offering superior thermal
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Grease / Paste
-
Supplier: TelephoneStuff.com
Description: flooding compound and provides efficient and craft-friendly cable preparation - SZ-stranded, loose tube design isolates fibers from installation and environmental rigors and facilitates midspan access - Stable performance over a wide temperature range - Dielectric central strength
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. It has an easy to use, non-critical 4 to 1 mix ratio by weight. This
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
Find Suppliers by Category Top
Featured Products Top
-
Designing thermal management for a coffee-machine heater means balancing three practical constraints: the pad must shrink predictably during processing, conduct heat efficiently away from the heater, and—where applicable—provide high dielectric (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
resistance. Unlike conventional pastes or pads, it then chemically cures into a resilient solid, eliminating pump-out and providing permanent dielectric bonding between heatsink and processor. Key benefits include sustained low thermal resistance under continuous power and thermal cycling (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. Total Conformability: It "wets" microscopic surface irregularities, eliminating the air gaps that often remain when using rigid mechanical fasteners. Dielectric Strength: (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
providing electrical insulation.They feature high dielectric breakdown strength,good thermal conductivity,tear resistance,and more.These properties help prevent accidents such as leakage or breakdowns.Additionally,silicone insulator pads are highly temperature-resistant,preventing degradation or aging (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
that require electrical protection, an optional dielectric coating is available. This helps prevent short circuits while preserving the thermal benefits of the graphite sheet. SR Series graphite sheets are widely used in (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. This self-adhesive thermal pad combines excellent compressibility with high dielectric strength of over 8 kV/mm, helping battery designers protect sensitive cells and nearby components in demanding high-voltage environments. Its soft (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
electrical characteristics and exhibits superior performance over conventional PFA, PTFE, polyimide and epoxy materials in many AV applications. Key benefits of Fluon+ PFA EA-2000 compounds include: Superior electrical performance, with the lowest dielectric constant (2.0) and low dissipation factor (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
solutions. Wide Temperature Range:Operates effectively from -60°C to +200°C, accommodating high-temperature conditions in chargers. High Dielectric Strength:Withstands voltages exceeding 11kV, ensuring stable and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
compounds allow for 800V+, higher PDIV, flexibility and lower dielectric constant. Follow us on: (read more)
Browse Datasheets for AGC Chemicals Americas, Inc.
Conduct Research Top
-
Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
-
Selecting the Right Potting Compound for Your Application
Many questions arise when trying to select an appropriate potting compound. An experienced materials expert can help identify the primary concerns, recommend materials, provide testing of the materials, and offer information on dielectric strength, adhesive. characteristics, thermal conductivity
-
NEW ADVANCES IN PRIMERLESS SILICONE INSULATION MATERIALS
insulation properties, consistent flexibility, and tenacious bond strength. However, the process for applying silicone rubber laminate insulation tape requires a cumbersome priming step. Recent advances in silicone compound chemistry have led to the formulation of primerless silicones that bond without
More Information Top
Indicates content that may require registration and/or purchase.
-
Patent reportings on chemisch‐technische apparatuses
North German Seekrbelwerke Nordenham a. d. W., Akt.-Gee., of Erfmder: Heinz Kinky, Ernst Studt, Hermann Havenith, Nordenham a. d. W. method and device for production einm of permanent dielectric compound on the solder and repair positions of ladders isolated with gutta …
-
Review
North German Seekrbelwerke Nordenham a. d. W., Akt.-Gee., of Erfmder: Heinz Kinky, Ernst Studt, Hermann Havenith, Nordenham a. d. W. method and device for production einm of permanent dielectric compound on the solder and repair positions of ladders isolated with gutta …
-
32. Main assembly of the Germans Bunsen‐Gesellschaft for applied physical chemistry
Aiialoge Uberlegungen applies fur dielectric compounds .
-
Chemical display in New York
dielectric compounds , capacitors and hochfeuer-brooklyn, N.Y., its new auBerordentlich light-stable chromium .
-
Generation and consumption of non-ferrous metals in Germany
dielectric compounds , capacitors and hochfeuer-brooklyn, N.Y., its new auBerordentlich light-stable chromium .
-
A new low emissivity system for architectural glass
The arrangement allows the langzeitstabile high rate separation of dielectric connecting layers like SiO2 .