EMI Shielding Epoxy

Description: RF EMI Powder ECCOSTOCK® FFP Epoxy-Based Powder X X

Description: RF EMI Powder ECCOSTOCK® FFP Epoxy-Based Powder X X

Description: properties including no mixing and unlimited working life at room temperature. It should be noted that this one part epoxy requires a curing temperature of 250°F or above.

• Viscosity: 150,000 cP
• Use Temperature: -452.47 to 300 F
• Tensile Strength (Break): 3,000 psi
• Elongation: 65 %

Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent

• Thermal Conductivity: 6.5 W/m-K
• Chemical System: Epoxy (EP)
• Industry: OEM / Industrial
• Cure / Technology: Thermosetting / Crosslinking

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and

• Viscosity: 15,000 to 25,000 cP
• Use Temperature: 572 F
• Thermal Conductivity: 1.1 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 111.66666666666666 µin/in-F

Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and

• Features: Electrically Conductive, Thermal / Heat Conductive
• Industry: Electronics
• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and

• Use Temperature: 482 F
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 28.88888888888889 to 49.44444444444444 µin/in-F
• Viscosity: 25,000 to 45,000 cP

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and

• Viscosity: 800 to 1,600 cP
• Use Temperature: 482 F
• Thermal Conductivity: 1.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and

• Viscosity: 25,000 to 45,000 cP
• Use Temperature: 482 F
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F

Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies;

• Features: Electrically Conductive, Thermal / Heat Conductive
• Industry: Electronics
• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -80 to 400 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
• Features: Anti-static / ESD Control, Die Bonding Adhesive / Compound, EMI / RFI Shielding Material, Electrical Insulating / Dielectric, Electrically Conductive, Gap Filling Sealant / FIP Gasket, Liquid, Other, Specialty / Other, Unfilled

Description: Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of

• Viscosity: 700 to 800 cP
• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.11538232 W/m-K
• Coeff. of Thermal Expansion (CTE): 25,000,000 µin/in-F

Description: Master Bond Polymer System EP21BAS is a radio-opaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical and chemical properties. A user friendly one-to-one (1/1) mix ratio by

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 27 µin/in-F
• Tensile Strength (Break): 7,500 psi

Description: The VXR Series of EMI filters is the most advanced offering in VPT’s extensive line of high reliability COTS products. Building on a proven design heritage, the VXRF10 features low resistance, high attenuation and a wide input voltage range. The VXR product family is optimized for a broad

• Rated Voltage: 60 volts
• Rated Current: 10 amps
• Minimum Insertion Loss: 55 to 67 dB
• Operating Temperature: -55 to 105 C

Description: to other enclosures in our Heavy Duty product line. EEC's N6 enclosure - High End shielded enclosure with a NEMA 6 rating Product Features Military Standards 14 gauge steel frame body construction Painted to meet your specification. The model shown has a durable epoxy paint Fully

• Features: EMI/RFI Coating, Hinged Cover
• Type: Electronic and Instrument Enclosures, Rack Enclosures
• NEMA Rating: NEMA / IP Enclosures
• Shape: Rectangular

Description: Super Shield Silver Epoxy Conductive EMI

Description: Cuming Microwave manufactures a range of epoxy and silicone-based rigid and castable absorbers, loaded with high magnetic loss carbonyl iron and ferrite fillers. The proper filler and loading level can produce a very lossy material in UHF, microwave or millimeter wave frequencies. Unlike

• Type: Casting Resin, Thermoset
• Features: EMI / RFI Shielding
• Chemical System: Epoxy, Silicone

Description: LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding

• Thermal Conductivity: 6.5 W/m-K
• Chemical System: Epoxy (EP)
• Industry: Military / Government (MIL-SPEC / GG)
• Features: Thermal / Heat Conductive

Description: Designed for three-phase, four-line power systems, these high-performance power line filters provide excellent attenuation for high voltage impulse and have current ratings from 5 to 150 amps available. Its metal case provides effective EMI shielding and they are epoxy molded

Description: Sprayable absorber is ideally suited for broadband, specular, off-normal, and surface wave attenuation. Silicone or urethane binder systems should be selected for dynamic applications, epoxy should be selected when a hard coating is needed or chemical resistance is desired. Sprayable

• Applications: EMI / RFI Shielding
• Form / Shape: Foam Spray

Description: Designed for high performance, three-phase, three-Delta connection systems, this power line filter is effective for both balanced and unbalanced three-phase loads and has excellent attenuation for high voltage impulse. Its metal case provides effective EMI shielding and they are

Description: ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.

• Thermal Conductivity: 1 W/m-K
• Type: Electrically Conductive
• Industry: Electronics (PCB / SMT Assembly)
• Features: Film / Sheet

Description: These filters are effective for both balanced and unbalanced three-phase loads. The metal case of these filters provides effective EMI shielding and they are epoxy molded for internal component reliability.

Description: sealed keypads. These keypads are legended by epoxy ink printing the rubber key tops. Custom legends and colors are available at a nominal cost. The Series 84LS is offered with a choice of matrix or single pole⁄common bus circuitries and EMI shielding.

Description: options include: Low Ripple (including EMI shielding), Remote Enable, CDRH Delay, and Epoxy Potting.

• DC Input Voltage: 12 to 24 volts
• DC Output Voltage: 1,100 to 2,200 volts
• DC Output Current: 0.0025 to 0.005 amps
• DC Output Power: 11 watts

Description: The VXR30-2800S is optimized for a broad range of applications from military ground vehicles to commercial and military aircraft and is intended for harsh environments including severe vibration, shock and temperature cycling. The VXR Series patent-pending epoxy encapsulated V-SHIELD®

• DC Input Voltage: 9 to 60 volts
• DC Output Voltage: 3.3 to 15 volts
• DC Output Current: 0 to 9 amps
• DC Output Power: 30.000000000000004 watts

Description: Our compact 10 watt single and dual output DC-DC converter is a highly efficient, epoxy-encapsulated design with customizable six-sided shielding and short circuit protection available. INPUT Input Voltages 12 Vdc: 9 - 18 Vdc 24 Vdc: 18 - 36 Vdc 48 Vdc: 36 - 72 Vdc OUTPUT Voltage

• DC Input Voltage: 12 to 48 volts
• DC Output Voltage: -15 to 15 volts
• DC Output Current: -1 to 2 amps
• DC Output Power: 10 watts

Description: compatibility to all IR remote control data formats. This component has not been qualified according to automotive specifications. Features: Low Supply Current Photo Detector and Preamplifier in One Package Internal Filter for PCM Frequency Improved Shielding Against EMI Supply

Description: compatibility to all IR remote control data formats. This component has not been qualified according to automotive specifications. Features: Low Supply Current Photo Detector and Preamplifier in One Package Internal Filter for PCM Frequency Improved Shielding Against EMI Supply

Description: Our 25 watt single, dual and triple output DC-DC converter features input/output isolation, an efficiency of 86%, a minimum switching frequency of 100 KHz and short circuit protection. Six-sided shielding is also available for this epoxy-encapsulated design. INPUT Input Voltages 12

• DC Input Voltage: 12 to 48 volts
• DC Output Voltage: -15 to 15 volts
• DC Output Current: -2.5 to 5 amps
• DC Output Power: 25 watts

Description: Transparent conductive coatings such as Indium Tin Oxide (ITO), Indium Molybdenum (IMO) or Index-Matched (IMITO) are used to make robust transparent electro-magnetic shielded (EMI) display enhancement glass, anti-fogging/frost-free camera windows and controlled temperature sample surfaces for

• Busbar Type: Laminate Busbars
• Busbar (Conductor) Material: Other

Description: (SLA), DMLS, Selective Laser Sintering (SLS), CNC and Urethane Castings. Prototype parts can be produced in thermoplastics, urethanes, acrylics and epoxy photopolymers. The 3D parts can also be finished with paint, EMI shielded, vacuum metalized and electroplated to create a more

• Industry / Application: Aerospace / Avionics, Agriculture / Forestry, Building / Construction, Consumer / Retail, Energy / Utility, Industrial / Commercial, Instruments / Sensors, Material Handling, Medical / Health Care, Military / Defense, Telecommunications
• Capabilities: Ceramic Manufacturing, Die Cutting, Electrical and Electromechanical Assembly, Electronic Manufacturing, Extrusion, Foam Fabrication, Gear Manufacturing, Glass Fabrication, Laser Processing, Machining, Metal Casting, Mold Making, Molding, Optical Manufacturing, Plastic Fabrication, Powder Metal
• Additional Services: Certification, Computer Aided Design (CAD) / Solid Modeling, Computer Aided Machining (CAM), Design / Development, Reverse Engineering, Testing / Inspection
• Features: Midwest US Only, North America, Other, United States Only