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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and
- Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Thermal / Heat Conductive
- Industry: Electronics, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and
- Coeff. of Thermal Expansion (CTE): 52 to 89 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Thermal / Heat Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and
- Coeff. of Thermal Expansion (CTE): 26.67 to 112 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Thermal / Heat Conductive
- Industry: Aerospace, Electronics, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Coeff. of Thermal Expansion (CTE): 31.11 to 111 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Electronics, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Techsil Limited
Description: repairs and is effective at bonding heat sinks to other components and PCB's. 8331 also provides excellent EMI/RFI shielding and is very effective at filling seams between metal plates. Product Benefits Electrical resistivity: 0.007 O·cm Thermal conductivity: 0
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: handling properties including no mixing and unlimited working life at room temperature. It should be noted that this one part epoxy requires a curing temperature of 250°F or above.
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Elongation: 65 %
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Graphene Laboratories, Inc.
Description: and fillers. G6E-SG™ epoxy has good electrical conductivity. A heating oven is recommended for faster curing times. Uses for G6E-SG™ epoxy include photovoltaic cells, EMI / RFI shielding, medical device assembly and repair, etc. FEATURES: · Silver
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 302 F
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Supplier: Graphene Laboratories, Inc.
Description: substrate. A heating oven is strongly recommended for curing. Uses for G6E-NS10™ epoxy include electronic circuits, EMI / RFI shielding assembly and repair, etc. FEATURES: · Silver-Carbon Filled (Non-Magnetic) · Good Electrical Conductivity
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 302 F
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Supplier: Graphene Laboratories, Inc.
Description: Circuit Board Manufacture / Repair · Radio Frequency Identification (RFID) tags · EMI / RFI Shielding · Electrical Sensors / Transducers · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 302 to 356 F
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Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 6.5 W/m-K
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Supplier: Graphene Laboratories, Inc.
Description: -Magnetic) · Very Good Electrical Conductivity · Resistant to Temperature Variations · Impact / Shock Resistant · Corrosion Resistant TYPICAL APPLICATIONS: · PCB Manufacture / Repair · EMI / RFI Shielding
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 302 F
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Supplier: Techsil Limited
Description: mechanical shocks; and provides the low resistivity needed for many operating conditions. Primarily used a cold solder, 8330 allows for quick cold soldering repairs and is effective at bonding heat sinks to other components and PCBs. It also provides excellent EMI/RFI shielding and is
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: repairs and is effective at bonding heat sinks to other components and PCB's. 8331 also provides excellent EMI/RFI shielding and is very effective at filling seams between metal plates. Product Benefits Electrical resistivity: 0.007 O·cm Thermal conductivity: 0
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.94
- Dissimilar Substrates: Yes
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Flexible / Dampening, Laminating / Composites, Anti-static / ESD Control
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B:
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Encapsulating / Potting, Flexible / Dampening, Laminating / Composites, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Master Bond, Inc.
Description: Featuring exceptional abrasion and chemical resistance, Supreme 45HTQ is a two component, quartz filled epoxy system for bonding, sealing and casting applications. It effectively withstands exposure to petrochemicals, acids, bases and solvents, while retaining its outstanding performance
- Coeff. of Thermal Expansion (CTE): 16.67 to 19.44 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.5
- Dielectric Strength: 400 to 450 kV/in
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Supplier: DigiKey
Description: RF EMI Powder ECCOSTOCK® FFP Epoxy-Based Powder X X
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Supplier: Quarktwin Technology Ltd.
Description: RF EMI Powder ECCOSTOCK® FFP Epoxy-Based Powder X X
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Supplier: VPT, Inc.
Description: 55 dB minimum attenuation at 500kHz Rugged epoxy encapsulated V-SHIELD® package Fully compatible with aqueous cleaning processes Integral six-sided metalized EMI shield Dual-sided thermal conduction 2000 V Isolation
- Approvals: MIL-SPEC
- Filter Type: DC
- Minimum Insertion Loss: 55 to 65 dB
- Operating Temperature: -55 to 105 C
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding
- Features: Thermal / Heat Conductive
- Industry: Military / Government (MIL-SPEC / GG)
- Thermal Conductivity: 6.5 W/m-K
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Description: Cuming Microwave manufactures a range of epoxy and silicone-based rigid and castable absorbers, loaded with high magnetic loss carbonyl iron and ferrite fillers. The proper filler and loading level can produce a very lossy material in UHF, microwave or millimeter wave frequencies. Unlike
- Chemical / Polymer System Type: Silicone, Epoxy
- Features: EMI / RFI Shielding
- Material Type / Grade: Thermoset
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Supplier: Equipto Electronics Corporation
Description: Painted to meet your specification. The model shown has a durable epoxy paint Fully EMI/RFI shielded Built to protect critical electronics in any weather conditions Custom sizes to fit your needs I
- Features: EMI/RFI Coating, Hinged Cover
- Material: Steel
- NEMA Rating: Type 6
- Shape: Rectangular
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Supplier: ARC Technologies, Inc.
Description: Materials: Fiberglass Epoxy Quartz Epoxy Quartz PBD (polybutadiene--high temp) Carbon fiber Spectra Resin Transfer Molding Convolute Winding Composites Fabrication: Layup / Vacuum Bag
- Material Type / Grade: EMI / RFI Shielding
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Description: Sprayable absorber is ideally suited for broadband, specular, off-normal, and surface wave attenuation. Silicone or urethane binder systems should be selected for dynamic applications, epoxy should be selected when a hard coating is needed or chemical resistance is desired. Sprayable
- Application: EMI / RFI Shielding
- Form / Shape: Foam Spray
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Supplier: APITech
Description: Designed for three-phase, four-line power systems, these high-performance power line filters provide excellent attenuation for high voltage impulse and have current ratings from 5 to 150 amps available. Its metal case provides effective EMI shielding and they are epoxy molded
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Supplier: RS Components, Ltd.
Description: changes, salt fog and humidity. The silver copper powder is non-magnetic,Cost effective,Does not scratch or fade,Can be cured at room temperature,Volume resistivity of 0.0018 â?¦ï??cm,Strong chemical resistance High-frequency EMI/RFI shielding in harsh
- Chemistry: Epoxy, Silver
- Form: Liquid, Other
- Industry: Automotive, Military Specification
- Operating / Use Temperature: -40 to 248 F
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Supplier: RS Components, Ltd.
Description: Aluminium extrusion case for Europe board and special format. Type 121 equipped with openings provides access to connectors. The external surface is protected with a black RAL 9005 epoxy powder paint. Types 21 and 22 are designed for wall mounting with fixtures that are ordered separately
- Depth: 7.28 inch
- Features: EMI/RFI Coating
- Height: 1.77 inch
- Ingress Protection(IP) Rating Against Foreign Objects: Type 4
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Supplier: RS Components, Ltd.
Description: Aluminium extrusion case for Europe board and special format. Type 121 equipped with openings provides access to connectors. The external surface is protected with a black RAL 9005 epoxy powder paint. Types 21 and 22 are designed for wall mounting with fixtures that are ordered separately
- Depth: 4.13 inch
- Features: EMI/RFI Coating
- Ingress Protection(IP) Rating Against Foreign Objects: Type 4
- Ingress Protection(IP) Rating Against Moisture: Type 0
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Supplier: Henkel Corporation - Electronics
Description: ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Form: Film / Sheet
- Industry: Electronics
- Thermal Conductivity: 1 W/m-K
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Supplier: Voltage Multipliers, Inc.
Description: 10kV • 5mA • 11W Designed for critical HeNe laser applications, the LPS series of DC input power supplies features low ripple current, high efficiency, excellent stability, and short circuit protection. Parts may be ordered in a range of input voltage and output current combinations. Available
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Supplier: RS Components, Ltd.
Description: The two-part MG Chemicals 8331S is an economical, slow cure silver conductive epoxy adhesive designed to give good electrical and thermal conductivities. The conductive adhesive provides excellent EMI/RFI shielding. Package Type = Syringe Package Size = 15 g Cure Time = 50 min
- Features: Electrically Conductive
- Use Temperature: -40 to 302 F
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Supplier: VPT, Inc.
Description: Rugged epoxy encapsulated V-SHIELD® package Fully compatible with aqueous cleaning processes -55 °C to +105 °C operation Integral six-sided metalized EMI shield Dual-sided thermal conduction 2000 V isolation Fixed frequency
- DC Input Voltage: 11 to 60 volts
- DC Output Current: 0.0 to 12.1 amps
- DC Output Power: 50 watts
- DC Output Voltage: 3.3 to 15 volts
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VMI’s LPS Series is designed for critical HeNe laser applications and features options that include: Low Ripple (including EMI shielding), Remote Enable, CDRH Delay, and (read more)
Browse Power Supplies Datasheets for Voltage Multipliers, Inc. -
feedthrough is engineered to meet customer-specific electrical, mechanical, and environmental requirements while supporting high-pressure applications, EMI shielding, cryogenic temperatures, and stringent military or industrial standards. Douglas Electrical’s in-house engineering, customization (read more)
Browse Military (MIL-SPEC) Connectors Datasheets for Douglas Electrical Components -
CircuitSeal™ is a hermetic sealing and encapsulation process that protects connectors, circuit boards, and electronic assemblies using a low-outgassing, chemically inert epoxy. By fully encapsulating components such as rigid and flex PCBs, hybrid circuits, and flat flex cables, it creates (read more)
Browse Wire to Board Connectors Datasheets for Douglas Electrical Components -
"Flex-pin" contacts are permanently installed and encapsulated in the insulators with epoxy. Meanwhile, Omnetics manufacturing team can terminate many wires and cable types, while maintaining the design characteristics you are in search of. Custom cable harnesses outfitted with back shells, EMI (read more)
Browse Cable Harness and Wire Harness Services Datasheets for Omnetics Connector Corporation
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A high performance electromagnetic interference shielding epoxy composite with multiple conductive networks in the matrix
Fig. 3 Preparation procedure diagram of EMI shielding epoxy composites .
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Electromagnetic wave shielding and microwave absorbing properties of hybrid epoxy resin/foliated graphite nanocomposites
The electromagnetic wave shielding effectiveness ( EMI ) of ep- oxy /FGN nanocomposites versus FGNs content at fixed fre- quency 5 GHz is depicted in Figure 4.
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Enhanced microwave shielding and mechanical properties of high loading MWCNT–epoxy composites
Few studies have been reported on CNT– epoxy composites as EMI shielding material.
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Epoxy adhesive for EMI shielding | News | The Engineer
Epoxy adhesive for EMI shielding .
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Chomerics introduces electrically conductive silver epoxy coatings for EMI shielding
Chomerics introduces electrically conductive silver epoxy coatings for EMI shielding .
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Dielectric properties of graphite‐based epoxy composites
Microwave experiments (see Fig. 5) show that the only but really effective additive for producing EMI shielding with graphite– epoxy resin composites is exfoliated graphite.
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EM compliance of narrow band input mux filters by using EMI screened components
In case of non-availability of quality components, the components may be treated with a suitable EMI shielding material like silver epoxy or conductive RTV compound and by doing EMI screening, improved components may be selected for use in the package.
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Effect of length of carbon nanotubes on electromagnetic interference shielding and mechanical properties of their reinforced epoxy composites
The effect of length of MWCNTs on the mechanical, electrical, and electromagnetic interference ( EMI ) shielding properties of MWCNTs/ epoxy nanocomposites is investigated.
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Highly Aligned Graphene/Polymer Nanocomposites with Excellent Dielectric Properties for High‐Performance Electromagnetic Interference Shielding
EMI Shielding Efficiencies of rGO/ epoxy Nanocomposites .
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EMI shielding performance study of tri-layer nano stealth composites
EMI shielding effectiveness of CNT/ epoxy nanocomposites .