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Supplier: Epoxies Etc...
Description: 20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives, which downgrade physical, thermal, and electrical insulation properties.
- Use Temperature: -94 to 356 F
- Thermal Conductivity: 0.64902555 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Tensile Strength (Break): 7,000 psi
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Supplier: Epoxies Etc...
Description: Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Coeff. of Thermal Expansion (CTE): 27.77777777777778 µin/in-F
- Tensile Strength (Break): 5,700 psi
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Supplier: Epoxies Etc...
Description: and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to “dark cure.” Once exposed to UV light the UV Cure 60-7170 will continue to cure in the absence of light. This is advantageous when potting or joining
- Viscosity: 4,500 cP
- Use Temperature: -58 to 392 F
- Tensile Strength (Break): 6,200 psi
- Dielectric Strength: 425.0000000000001 kV/in
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Supplier: Epoxies Etc...
Description: 20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.
- Use Temperature: -58 to 275 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,000 psi
- Dielectric Strength: 459.9999999999999 kV/in
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Supplier: Accuris
Description: COMPOUND, INSULATING, POTTING AND ENCAPSULATING, EPOXY RESIN
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Supplier: Accuris
Description: Standard Test Method for Cure Behavior of Thermosetting Resins by Dynamic Mechanical Procedures using an Encapsulated Specimen Rheometer
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Supplier: Accuris
Description: Standard General Requirements for Dry-Type Distribution and Power Transformers Including Those with Solid-Cast and/or Resin-Encapsulated Windings
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Supplier: Accuris
Description: Trial-Use Standard Test Procedures for Thermal Evaluation of Insulation Systems for Solid-Cast and Resin-Encapsulated Power and Distribution Transformers
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Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
- Viscosity: 32,500 to 50,000 cP
- Industry: Electronics, Semiconductors / IC Packaging
- Features: Encapsulating / Potting, Specialty / Other
- Chemical System: Epoxy (EP)
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Supplier: Dongguan Yili Electronics Co., Ltd.
Description: Our encapsulated transformers have their windings and core covered with epoxy resin in an enclosure to reduce noise and are impervious to water, moisture, and dust. They are available in a wide variety of primary and secondary voltage combinations.
- Maximum Primary Voltage Rating: 115 to 230 volts
- Maximum Secondary Voltage Rating: 6 to 24 volts
- Category: Signal / RF Transformer
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Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
- Viscosity: 50,000 cP
- Industry: Electronics
- Features: Encapsulating / Potting, Specialty / Other
- Chemical System: Epoxy (EP)
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Supplier: ASTM International
Description: 1.1 This method covers the use of dynamic mechanical instrumentation for determination and reporting of the thermal advancement of cure behavior of thermosetting resin on an inert filler or fiber in a laboratory. It may also be used for determining the cure properties of filled resins
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Supplier: Bluestar Silicones USA Corp.
Description: Silicone Elastomer for encapsulating applications Properties Viscosity 7500 Hardness Sha 55 Description Bluesil V-1010 is a medium strength, two-component, tin catalyzed, room temperature cure silicone rubber. It is designed as a low viscosity, very flowable material for use as a potting and
- Use Temperature: -65 to 400 F
- Tensile Strength (Break): 400 psi
- Elongation: 105 %
- Features: Conformal / Encapsulating Coating
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Supplier: Bluestar Silicones USA Corp.
Description: Two-Component, Medium Viscosity, Addition Cure, Potting/Encapsulating Silicone Compound Properties Viscosity 44000 Hardness Sha 29 Description Bluesil V-217 is a clear, two component, medium viscosity, addition cure silicone compound. It is designed for potting and encapsulating
- Viscosity: 44,000 cP
- Features: Conformal / Encapsulating Coating, Encapsulating / Potting
- Industry: Electronics
- Form / Shape: Grease / Paste
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Description: A uniform method is established for determining the temperature classification of solid- cast and resin-encapsulated power and distribution transformer insulation systems by testing rather than by chemical composition. These insulation systems are intended for use in transformers covered by
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Description: A uniform method is established for determining the temperature classification of solidcast and resin-encapsulated power and distribution transformer insulation systems by testing rather than by chemical composition. These insulation systems are intended for use in transformers covered by
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Supplier: Arnold Magnetic Technologies
Description: materials include carbon fiber, Zylon fiber and glass fiber composites using a range of epoxy, cyanate ester and BMI-based resin systems. Our technology includes the winding of multi-filament tows directly over the rotor to be contained, or the production of sleeves which are pressed into
- Use Temperature: 338 F
- Industry: Aerospace, Automotive, OEM / Industrial
- Features: Encapsulant / Potting Compound, Other, Specialty / Other
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Supplier: EXACT Dispensing Systems
Description: encapsulating of connectors, coils and other electronic components. The vacuum process provides improved impregnation in difficult to reach areas (i.e. connection pins, under circuit boards) and ensures void free encapsulation. With the advent of quick setting resins a user can, in
- Height / Length: 24 inch
- Nominal Size: 18 inch, 24 inch
- Chamber / Component Type: Custom / Specialty Chamber
- Vacuum / Pressure Range: Rough / Low (< 760, > 1 torr)
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Supplier: MacDermid Alpha Electronics Solutions
Description: A durable two-part polyurethane encapsulation resin developed for electrical components exposed to extreme conditions. Product Overview UR5645 High Performance Polyurethane Resin has been specially developed for the encapsulation and potting of electronics, such as the next generation
- Use Temperature: 320 F
- Features: Automotive, Encapsulating / Potting, Marine
- Industry: Electronics, Semiconductors / IC Packaging
- Chemical System: Polyurethane (PU, PUR)
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Supplier: Wacker Chemical Corp.
Description: SILRES® MK POWDER is a solvent-free, solid methyl silicone resin whose high reactivity and heat resistance make it ideal as a binder for all kinds of laminates and moldings. SILRES® MK POWDER has the highest SiO² content of all WACKER silicone resins (after complete oxidation: approx.
- Industry: Electronics
- Features: Encapsulating / Potting, Photonics / Optoelectronics
- Form / Shape: Pellets / Solid Form
- Chemical System: Silicone
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Supplier: Ellsworth Adhesives
Description: ResinLab DPE092100-1 Epoxy Casting Resin Part A Gray is a two component epoxy casting system designed for high performance production potting and encapsulating where low shrinkage is required. Features a flowable viscosity, very low surface tension, low coefficient of thermal
- Viscosity: 700 to 15,000 cP
- Tensile Strength (Break): 6,000 psi
- Dielectric Strength: 400.00000000000006 kV/in
- Features: Encapsulating / Potting
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electronic encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 1 gal Pail.
- Thermal Conductivity: 0.9 W/m-K
- Tensile Strength (Break): 50 psi
- Dielectric Strength: 599.4400000000013 kV/in
- Features: Encapsulating / Potting, Thermal Compound / Heat Conductive
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Supplier: ROW, Incorporated
Description: virgin FEP made from resin which meets or exceeds the requirements of L-P-389A and ASTM-D-2116. FDA compliant & USP Class VI approved.
- Thickness: 0.25 inch
- Operating Temperature: -75 to 400 F
- Features: Other
- Gasket Type: Sanitary Gasket
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Supplier: ROW, Incorporated
Description: virgin FEP made from resin which meets or exceeds the requirements of L-P-389A and ASTM-D-2116. FDA compliant & USP Class VI approved.
- Thickness: 0.218 inch
- Operating Temperature: -15 to 400 F
- Material: Fluoroelastomer (FKM - Viton®, Fluorel®, etc.)
- Features: Other
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Supplier: Hapco, Inc.
Description: A new series of water clear casting resins that are mercury free, have high physical properties, and are available in multiple gel times. Exceptional clarity with refractive indices ranging from 1.502-1.585 Available in 10, 20 and 40 min. gel times. Extremely UV resistant. High physicals such
- Tensile Strength (Break): 6,800 psi
- Elongation: 13 %
- Viscosity: 600 cP
- Form / Shape: Liquid
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Supplier: Master Bond, Inc.
Description: Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The
- Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Tensile Strength (Break): 7,600 psi
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electronic encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 5 gal Pail.
- Thermal Conductivity: 0.9 W/m-K
- Tensile Strength (Break): 50 psi
- Dielectric Strength: 599.4400000000013 kV/in
- Features: Encapsulating / Potting, Thermal Compound / Heat Conductive
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Description: Electrical, mechanical, and safety requirements of ventilated, non-ventilated, and sealed dry-type distribuion and power transformers or auto transformers (single and polyphase, with a voltage of 601 V or higher in the highest voltage winding) are described.
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Description: A uniform method is established for determining the temperature classification for the insulation systems for open-wound, solid-cast and resin-encapsulated power and distribution transformers by testing rather than by chemical composition. These insulation systems are intended for use in
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Supplier: ELANTAS North America LLC
Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Use Temperature: 266 F
- Thermal Conductivity: 0.2 to 0.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 47.22222222222222 to 138.88888888888889 µin/in-F
- Viscosity: 12,500 cP
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Supplier: MacDermid Alpha Electronics Solutions
Description: Enhanced flow properties aid potting of tight units and delicate electronics with effective heat dissipation and thermal performance. Product Overview SC4004 is a thixotropic silicone potting compound developed for the Indian electronics market. Its thixotropic nature provides excellent flow
- Industry: Electronics, Semiconductors / IC Packaging
- Features: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Chemical System: Silicone
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Supplier: Hengda Electronic Factory
Description: It adopts high-brand silicon steel sheet to produce ring core, with low dissipation and high efficiency. Special winding process ensures high reliability of transformer. The finishing of the shell is made, the dimensions are arbitrary adjustment. Epoxy resin vacuum irrigation, moisture-proof,
- Operating Frequency Range: 50 to 60 Hz
- Power Rating (VA): 1,000 VA
- Features: AC, Encapsulated Transformers
- Mounting: Chassis Mount
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Supplier: Techsil Limited
Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely
- Features: Electronics (PCB / SMT Assembly)
- Use: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Featured Products Top
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EP21NS is a two part, moderate viscosity, nanosilica filled epoxy system for bonding, sealing, coating and encapsulation. It has a nanosilica filler that imparts dimensional stability and abrasion resistance. Product advantages include a convenient one to one mix ratio by weight, a long working life. moderately high viscosity, flowable, noteworthy abrasion resistance, and exceptional electrical properties at 16 GHz. (read more)
Browse Electrical and Electronic Resins Datasheets for Master Bond, Inc. -
Ducoya G021 is a PMDA-ODA high-performance polyimide with 15% graphite encapsulated into the polymer. This combination is optimised for low wear and low friction tribological applications. This high-performance formula with exceptionally low wear and low friction qualities has been (read more)
Browse Specialty Polymers and Resins Datasheets for Duvelco Limited -
reduce many of the obstacles companies face through encapsulation and dispersion of additives that require unique handling and dispersion processes. Potential Application Areas: Mechanical Performance Wear & Abrasion (read more)
Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
ELANTAS PDG, Inc. manufactures custom casting resins to match your specifications. Follow us on: Facebook (read more)
Browse Casting Resins Datasheets for ELANTAS North America LLC -
from harsh conditions such as humidity, extreme temperatures, mechanical loads, vibration and corrosive chemicals. The ELANTAS family of conformal coatings, potting resins and encapsulants is specially formulated to provide optimum protection and (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
enabling safe and reliable performance. The ELAN-tim® thermal interface materials can help with the heat management. The Gap Filler and Casting & Potting materials show high functionality due to their high thermal conductivity and can be used to encapsulate the components (read more)
Browse Casting Resins Datasheets for ELANTAS North America LLC -
coating focusing on protective, floor and anti-friction coatings. Here ELANTAS is offering a comprehensive portfolio of chemistries for special coating applications such as polyamideimides, hydrolyzed polyamideimides, silicone-modified polyester resins, saturated polyesters, epoxies (read more)
Browse Resins and Compounds Datasheets for ELANTAS North America LLC -
Constant Voltage Transformers Liquid Electrical Insulation Resin Solutions Constant voltage (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
resins and casting materials. This makes ELANTAS the preferred supplier for the electrical insulation industry and the main supplier to large international customers. Business Lines The Division covers the markets through its business lines. The “Wire (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
development, continual development of insulating materials and processes, and the fact that ELANTAS has production facilities around the world, the division has established a leading international position for itself and is the world‘s leading manufacturer of wire enamels, impregnating resins and (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC
Conduct Research Top
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Are Encapsulation Resins Suitable for EV Applications?
One of the biggest areas of concern for designers is the issue of heat impacting on battery performance, particularly as drivers crossing over from traditional fuel vehicles to electric will expect no compromise in performance from their new electric/hybrid vehicle. Discover how resin systems can
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Conformal Coatings vs Encapsulation Resins - Making an informed choice for Electronic Protection
At Electrolube, a question that we are often asked is: "Which is better to protect my PCB in a harsh environment, a conformal coating or a resin?" Phil Kinner discusses the Pro's and Cons of each protective material and how to best select your material.
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Resins: Stay Cool! Let's Take Down the Heat and Increase Environmental Responsibility
Electrolube's Senior Technical Manager, Beth Turner, describes where resins are currently playing a vital role in the modern world, while also offering an insight into their thermal conductivity, suitability for RF applications and exploring a new era of bio-based encapsulation resins that not only
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How PCB Board Encapsulation Epoxy Resin Adhesive Can Help Your Electronics Last Longer
, which can lead to damage or failure. This is where PCB Encapsulation Epoxy comes in.
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
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LED Lighting Manufacturing
LED modules are typically encapsulated with plural component reactive resins to protect both the LED lights as well as associated circuitry. Many display. products are used in harsh outdoor environments, making the encapsulation process critical.
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Explosion Protection Methods
Encapsulation is a type of protection in which the parts that can ignite an explosive atmosphere are enclosed in a resin. The resin must be sufficiently resistant to environmental influences so that the explosive atmosphere cannot be ignited by either sparking or heating, which may occur within
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Effectively Insulating Electronics Under Heavy Load Conditions
"Insulation" describes the complete encapsulation or filling of electronic components with suitable casting resins. In addition to protecting the components from external influences, this process also helps to improve their performance and mechanical, thermal and electrical properties as well
More Information Top
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Handbook of Adhesive Chemical and Compounding Ingredients
Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, conveyor belting, cables, furniture foam, PVC and rubber goods, adhesives, coatings, and sealants .
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Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, conveyor belting, cables, furniture foam, PVC and rubber goods, adhesives, coatings, and sealants .
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Handbook of Green Chemicals
CAS 21645-51-2; EINECS/ELINCS 244-492-7 Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, .
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Handbook of Fillers, Extenders, and Diluents
Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, conveyor belting, cables, furniture foam, PVC and rubber goods, adhesives, coatings, and sealants .
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Handbook of Paint and Coating Raw Materials Volume 1 and 2
Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, conveyor belting, cables, furniture foam, PVC and rubber goods, adhesives, coatings, and sealants .
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Preparation of polyamide resin‐encapsulated melamine cyanurate/melamine phosphate composite flame retardants and the fire‐resistance to glass fiber‐reinforced ...
Figure 2 The relationship between the encapsulated resin content and the particle size of EMCMP.
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Direct Encapsulation of Organic Light-Emitting Devices (OLEDs) Using Photo-Curable co-Polyacrylate/Silica Nanocomposite Resin
The transmittance of encapsulation resins was obtained by an HP8453 UV-visible spectrometer with scan- ning wavelength ranging from 190 to 1200 nm.
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Handbook of Textile Processing Chemicals
Analysis: Al2O3 (65.1%), water (34.5%), Na2O (0.2%) CAS 21645-51-2; EINECS/ELINCS 244-492-7 Uses: Flame retardant/smoke suppressant filler for plastics and rubber indus- tries, glass-fiber reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking …
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