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Supplier: Epoxies Etc...
Description: 20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives, which downgrade physical, thermal, and electrical insulation properties.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: 20-3220 is a filled epoxy resin system that does not contain diluents, plasticizers, or other degrading adulterants. This system was formulated for the encapsulation and potting of miniaturized electronic components and high density circuit packages.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.11 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: 20-3001 is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Semiconductors / IC Packaging, Electronics
- Use: Encapsulant / Potting Compound
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Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
- Use: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
- Use: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: A new series of water clear casting resins that are mercury free, have high physical properties, and are available in multiple gel times. Exceptional clarity with refractive indices ranging from 1.502-1.585 Available in 10, 20 and 40 min. gel times
- Elongation: 13 %
- Filler Material: Unfilled
- Industry: Tooling / Molds
- Tensile Strength (Break): 6800 psi
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Supplier: Hengda Electronic Factory
Description: It adopts high-brand silicon steel sheet to produce ring core, with low dissipation and high efficiency. Special winding process ensures high reliability of transformer. The finishing of the shell is made, the dimensions are arbitrary adjustment. Epoxy resin vacuum
- Mounting / Form Factor: Chassis Mount
- Operating Frequency Range: 50 to 60 Hz
- Standards / Compliance: RoHS Compliant
- Transformer Types / Applications: Encapsulated Transformers, Electronics Transformer
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Supplier: ROW, Incorporated
Description: - Ideal for overall chemical resistance. Encapsulation Solid .020 wall of virgin FEP made from resin which meets or exceeds the requirements of L-P-389A and ASTM-D-2116. FDA compliant & USP Class VI approved.
- Gasket Type: Sanitary Gasket, Other
- Material: Silicone Rubber
- Operating Temperature: -75 to 400 F
- Thickness: 0.2500 inch
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Supplier: ROW, Incorporated
Description: - Ideal for overall chemical resistance. Encapsulation Solid .020 wall of virgin FEP made from resin which meets or exceeds the requirements of L-P-389A and ASTM-D-2116. FDA compliant & USP Class VI approved.
- Gasket Type: Sanitary Gasket, Other
- Material: Fluoroelastomer (FKM - Viton®, Fluorel®, etc.)
- Operating Temperature: -15 to 400 F
- Thickness: 0.2500 inch
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Supplier: Accuris
Description: COMPOUND, INSULATING, POTTING AND ENCAPSULATING, EPOXY RESIN
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Supplier: Dongguan Yili Electronics Co., Ltd.
Description: Our encapsulated transformers have their windings and core covered with epoxy resin in an enclosure to reduce noise and are impervious to water, moisture, and dust. They are available in a wide variety of primary and secondary voltage combinations.
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Description: A uniform method is established for determining the temperature classification of solidcast and resin-encapsulated power and distribution transformer insulation systems by testing rather than by chemical composition. These insulation systems are intended for use in transformers covered by
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Description: A uniform method is established for determining the temperature classification of solid- cast and resin-encapsulated power and distribution transformer insulation systems by testing rather than by chemical composition. These insulation systems are intended for use in transformers covered by
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Description: It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials.
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
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Supplier: Arnold Magnetic Technologies
Description: Arnold Magnetic Technologies offers composite and metallic encapsulation solutions for a wide range of permanent magnet systems and applications. While metallic sleeved magnet containment solutions are used extensively for magnet containment, Wraptite composite sleeves offer a superior
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Specialty / Other
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
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Supplier: DuPont Plastics, Polymers & Resins
Description: Zytel® FE5382 BK276 is a 33% glass fiber reinforced, heat stabilized, black polyamide 612 resin developed for electrical bobbins and encapsulation applications. From stockings to car parts to protecting sensitive electronic components, it's hard to imagine a world without
- Chemical / Polymer System Type: Polyimide
- Coeff. of Thermal Expansion (CTE): 0.6111 µin/in-F
- Elongation: 2.5 %
- Filler Material: Fiber Glass
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Description: Electrical, mechanical, and safety requirements of ventilated, non-ventilated, and sealed dry-type distribuion and power transformers or auto transformers (single and polyphase, with a voltage of 601 V or higher in the highest voltage winding) are described.
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Description: Superseded by IEEE Std C57.12.01-2005 Electrical, mechanical, and safety requirements of ventilated, nonventilated, and sealed dry-type distribution and power transformers or autotransformers, single and polyphase, with a voltage of 601 V or higher in the highest voltage winding, are described.
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Features: Optical Grade / Material
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Supplier: Accuris
Description: Standard Test Method for Cure Behavior of Thermosetting Resins by Dynamic Mechanical Procedures using an Encapsulated Specimen Rheometer
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Supplier: MacDermid Alpha Electronics Solutions
Description: A durable two-part polyurethane encapsulation resin developed for electrical components exposed to extreme conditions. Product Overview UR5645 High Performance Polyurethane Resin has been specially developed for the encapsulation and potting of electronics, such as the
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Two Component System
- Industry: Semiconductors / IC Packaging, Electronics
- Use: Encapsulant / Potting Compound
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Supplier: EXACT Dispensing Systems
Description: encapsulating of connectors, coils and other electronic components. The vacuum process provides improved impregnation in difficult to reach areas (i.e. connection pins, under circuit boards) and ensures void free encapsulation. With the advent of quick setting resins a user can,
- Chamber / Component Type: Custom / Specialty Chamber
- Height / Length: 24 inch
- Nominal Size (OD / Width): 18 inch, 24 inch
- Vacuum / Pressure Range: Rough / Low (< 760, > 1 torr)
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Supplier: EXACT Dispensing Systems
Description: potting or encapsulating of connectors, coils and other electronic components. The vacuum process provides improved impregnation in difficult to reach areas (i.e. connection pins, under circuit boards) and ensures void free encapsulation. With the advent of quick setting resins
- Mounting: Machine Mounted, Robotic
- Type: Dispense Only
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Supplier: Bluestar Silicones USA Corp.
Description: Silicone Elastomer for encapsulating applications Properties Viscosity 7500 Hardness Sha 55 Description Bluesil V-1010 is a medium strength, two-component, tin catalyzed, room temperature cure silicone rubber. It is designed as a low viscosity, very flowable material for use as a potting and
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: Thermosetting / Crosslinking
- Elongation: 105 %
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Supplier: Master Bond, Inc.
Description: Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Compound Type: Casting Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F
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Supplier: Bluestar Silicones USA Corp.
Description: Two-Component, Medium Viscosity, Addition Cure, Potting/Encapsulatin g Silicone Compound Properties Viscosity 44000 Hardness Sha 29 Description Bluesil V-217 is a clear, two component, medium viscosity, addition cure silicone compound. It is designed for potting and encapsulating
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Form: Grease / Paste
- Industry: Electronics
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Supplier: Wacker Chemical Corp.
Description: SILRES® MK POWDER is a solvent-free, solid methyl silicone resin whose high reactivity and heat resistance make it ideal as a binder for all kinds of laminates and moldings. SILRES® MK POWDER has the highest SiO² content of all WACKER silicone resins (after complete oxidation
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System
- Industry: Electronics, Photonics / Optoelectronics
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Supplier: Ellsworth Adhesives
Description: ResinLab DPE092100-1 Epoxy Casting Resin Part A Gray is a two component epoxy casting system designed for high performance production potting and encapsulating where low shrinkage is required. Features a flowable viscosity, very low surface tension, low coefficient of thermal
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Features: Encapsulating / Potting
- Tensile Strength (Break): 6000 psi
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Supplier: Wacker Chemical Corp.
Description: SILRES® H44 is a powdered silicone resin with excellent solubility in various organic solvents and good compatibility with organic resins. Special features solvent-free, solid phenylmethyl polysiloxane resin high solubility in organic solvents fast
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System
- Industry: Electronics, Photonics / Optoelectronics
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Supplier: Accuris
Description: Trial-Use Standard Test Procedures for Thermal Evaluation of Insulation Systems for Solid-Cast and Resin-Encapsulated Power and Distribution Transformers
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR CURE BEHAVIOR OF THERMOSETTING RESINS BY DYNAMIC MECHANICAL PROCEDURES USING AN ENCAPSULATED SPECIMEN RHEOMETER - INCLUDES STANDARD + REDLINE (PDF)
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant polyurethane UL94-approved resin. Soft enough for dig-out work, it remains flexible over a wide temperature range. Product Overview UR5044 Flame Retardant Polyurethane Resin is a UL94-approved two-part system developed for potting and encapsulation of electronics
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Two Component System
- Features: Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Interface (Thermally Conductive)
- Industry: Semiconductors / IC Packaging, Electronics
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP39MHT is a low viscosity, two component, epoxy resin system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to an exceptionally tough and thermally stable thermosetting polymer featuring outstanding
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.95
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Supplier: MacDermid Alpha Electronics Solutions
Description: Ultra high-performance polyurethane offering exceptional protection in various environments with excellent electrical properties. Product Overview UR5118 is a highly water-resistant, RF polyurethane resin developed as an ultra-high-performan ce encapsulation and potting
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Industry: Semiconductors / IC Packaging, Electronics
- Use: Encapsulant / Potting Compound
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Supplier: Bluestar Silicones USA Corp.
Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protec tion of electronical systems and production of moulding parts Good heat stability in confined
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 5 µin/in-F
- Composition: Two Component System
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 1 gal Pail.
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 599 kV/in
- Tensile Strength (Break): 50 psi
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrical Insulation / Dielectric Material, Thermal Compound / Interface (Thermally Conductive), Specialty / Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: Enhanced flow properties aid potting of tight units and delicate electronics with effective heat dissipation and thermal performance. Product Overview SC4004 is a thixotropic silicone potting compound developed for the Indian electronics market. Its thixotropic nature provides excellent flow
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Ellsworth Adhesives
Description: Resin Designs 51606MV Urethane Encapsulant Clear is a two component, room temperature curing polyurethane that is used for encapsulation and potting applications. It is high performance and moisture resistant. 2:1 mix ratio by volume. 50 mL Mixpac.
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Elongation: 200 %
Find Suppliers by Category Top
Featured Products Top
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EP21NS is a two part, moderate viscosity, nanosilica filled epoxy system for bonding, sealing, coating and encapsulation. It has a nanosilica filler that imparts dimensional stability and abrasion resistance. Product advantages include a convenient one to one mix ratio by weight, a long working life. moderately high viscosity, flowable, noteworthy abrasion resistance, and exceptional electrical properties at 16 GHz. (read more)
Browse Electrical and Electronic Resins Datasheets for Master Bond, Inc. -
Ducoya G021 is a PMDA-ODA high-performance polyimide with 15% graphite encapsulated into the polymer. This combination is optimised for low wear and low friction tribological applications. This high-performance formula with exceptionally low wear and low friction qualities has been (read more)
Browse Specialty Polymers and Resins Datasheets for Duvelco Limited -
reduce many of the obstacles companies face through encapsulation and dispersion of additives that require unique handling and dispersion processes. Potential Application Areas: Mechanical Performance Wear & Abrasion (read more)
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ELANTAS PDG, Inc. manufactures custom casting resins to match your specifications. Follow us on: Facebook (read more)
Browse Casting Resins Datasheets for ELANTAS North America LLC -
from harsh conditions such as humidity, extreme temperatures, mechanical loads, vibration and corrosive chemicals. The ELANTAS family of conformal coatings, potting resins and encapsulants is specially formulated to provide optimum protection and (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
enabling safe and reliable performance. The ELAN-tim® thermal interface materials can help with the heat management. The Gap Filler and Casting & Potting materials show high functionality due to their high thermal conductivity and can be used to encapsulate the components (read more)
Browse Casting Resins Datasheets for ELANTAS North America LLC -
coating focusing on protective, floor and anti-friction coatings. Here ELANTAS is offering a comprehensive portfolio of chemistries for special coating applications such as polyamideimides, hydrolyzed polyamideimides, silicone-modified polyester resins, saturated polyesters, epoxies (read more)
Browse Resins and Compounds Datasheets for ELANTAS North America LLC -
Constant Voltage Transformers Liquid Electrical Insulation Resin Solutions Constant voltage (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
resins and casting materials. This makes ELANTAS the preferred supplier for the electrical insulation industry and the main supplier to large international customers. Business Lines The Division covers the markets through its business lines. The “Wire (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
development, continual development of insulating materials and processes, and the fact that ELANTAS has production facilities around the world, the division has established a leading international position for itself and is the world‘s leading manufacturer of wire enamels, impregnating resins and (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC
Conduct Research Top
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Are Encapsulation Resins Suitable for EV Applications?
One of the biggest areas of concern for designers is the issue of heat impacting on battery performance, particularly as drivers crossing over from traditional fuel vehicles to electric will expect no compromise in performance from their new electric/hybrid vehicle. Discover how resin systems can
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Conformal Coatings vs Encapsulation Resins - Making an informed choice for Electronic Protection
At Electrolube, a question that we are often asked is: "Which is better to protect my PCB in a harsh environment, a conformal coating or a resin?" Phil Kinner discusses the Pro's and Cons of each protective material and how to best select your material.
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Resins: Stay Cool! Let's Take Down the Heat and Increase Environmental Responsibility
Electrolube's Senior Technical Manager, Beth Turner, describes where resins are currently playing a vital role in the modern world, while also offering an insight into their thermal conductivity, suitability for RF applications and exploring a new era of bio-based encapsulation resins that not only
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How PCB Board Encapsulation Epoxy Resin Adhesive Can Help Your Electronics Last Longer
, which can lead to damage or failure. This is where PCB Encapsulation Epoxy comes in.
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
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LED Lighting Manufacturing
LED modules are typically encapsulated with plural component reactive resins to protect both the LED lights as well as associated circuitry. Many display. products are used in harsh outdoor environments, making the encapsulation process critical.
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Explosion Protection Methods
Encapsulation is a type of protection in which the parts that can ignite an explosive atmosphere are enclosed in a resin. The resin must be sufficiently resistant to environmental influences so that the explosive atmosphere cannot be ignited by either sparking or heating, which may occur within
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Effectively Insulating Electronics Under Heavy Load Conditions
"Insulation" describes the complete encapsulation or filling of electronic components with suitable casting resins. In addition to protecting the components from external influences, this process also helps to improve their performance and mechanical, thermal and electrical properties as well
More Information Top
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Handbook of Adhesive Chemical and Compounding Ingredients
Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, conveyor belting, cables, furniture foam, PVC and rubber goods, adhesives, coatings, and sealants .
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Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, conveyor belting, cables, furniture foam, PVC and rubber goods, adhesives, coatings, and sealants .
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Handbook of Green Chemicals
CAS 21645-51-2; EINECS/ELINCS 244-492-7 Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, .
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Handbook of Fillers, Extenders, and Diluents
Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, conveyor belting, cables, furniture foam, PVC and rubber goods, adhesives, coatings, and sealants .
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Handbook of Paint and Coating Raw Materials Volume 1 and 2
Uses: Flame retardant, smoke suppressant, filler for plastics, rubber, glass fiber-reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking, conveyor belting, cables, furniture foam, PVC and rubber goods, adhesives, coatings, and sealants .
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Preparation of polyamide resin‐encapsulated melamine cyanurate/melamine phosphate composite flame retardants and the fire‐resistance to glass fiber‐reinforced ...
Figure 2 The relationship between the encapsulated resin content and the particle size of EMCMP.
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Direct Encapsulation of Organic Light-Emitting Devices (OLEDs) Using Photo-Curable co-Polyacrylate/Silica Nanocomposite Resin
The transmittance of encapsulation resins was obtained by an HP8453 UV-visible spectrometer with scan- ning wavelength ranging from 190 to 1200 nm.
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Handbook of Textile Processing Chemicals
Analysis: Al2O3 (65.1%), water (34.5%), Na2O (0.2%) CAS 21645-51-2; EINECS/ELINCS 244-492-7 Uses: Flame retardant/smoke suppressant filler for plastics and rubber indus- tries, glass-fiber reinforced plastics, encapsulation resins , exterior cladding and tiles, cultured onyx, carpetbacking …
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