Epoxy Resin

Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

• Cure Type / Technology: Specialty / Other
• Features: Encapsulating / Potting
• Industry: Electronics, Semiconductors / IC Packaging
• Viscosity: 32500 to 50000 cP

Description: It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured,

• Cure Type / Technology: Single Component System, Specialty / Other
• Elongation: 4 %
• Substrate / Material Compatibility: Composites, Metal
• Use Temperature: -67 to 356 F

Description: It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It

• Cure Type / Technology: Two Component System, Room Temperature Curing
• Industry: Electronics
• Use Temperature: -40 to 302 F
• Viscosity: 9000 to 12000 cP

Description: Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It can quickly provide customers with high-throughput applications, such as attaching light

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Specialty / Other
• Industry: Electronics
• Viscosity: 8700 cP

Description: General Polymers 3561 EPOXY RESIN GLAZE is a high solids, two component epoxy resin systems used for general purpose decorative aggregate and heavy duty industrial flooring systems. 3561 EPOXY RESIN GLAZE possess good chemical resistance, with excellent

• Chemistry: Glaze / Glass Enamel, Epoxy, Inorganic (Ceramic, Conversion, Glaze), Resin Base / Polymer Binder
• Features: Chemical / Oil Resistant, Other
• Form: Liquid
• Industry: OEM / Industrial, Other

Description: These phenolic novolac resins are used as curing agents for epoxy resins in molding compounds, copper clad laminates, electrical applications and potting.

• Chemical / Polymer System Type: Phenolics (Melamine, Furan)
• Filler Material: Unfilled
• Industry: Industrial
• Resins & Compounds: Liquid

Description: These ThreeBond adhesives use epoxy resin as their main component. They are excellent for a myriad of purposes including general purpose adhesion and sealing, and for electronic device bonding, filling, repair, casting and impregnation. Epoxy resins, also known as

• Cure Type / Technology: Single Component System
• Industry: Automotive
• Substrate / Material Compatibility: Rubber / Elastomer
• Viscosity: 28000 cP

Description: General Polymers 3526 LOW TEMPERATURE MULTIPURPOSE EPOXY RESIN is a two-component, high solids epoxy resin designed for use in concrete toppings, slurries, machine grouting, beam repair and preservation of concrete where rapid cure, moisture tolerance and chemical

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Features: Anti-Static / ESD Control, Chemical / Oil Resistant, Conductive, Weather / UV Resistant
• Form: Liquid
• Substrate / Surface: Concrete / Masonry

Description: General Polymers 3561C CONDUCTIVE / SPARKPROOF EPOXY RESIN GLAZE is a high solids, two-component conductive epoxy resin used as the binder resin and grout coats for the TPM® #115 Conductive / Sparkproof Flooring system. 3561C CONDUCTIVE / SPARKPROOF EPOXY

• Chemistry: Glaze / Glass Enamel, Epoxy, Inorganic (Ceramic, Conversion, Glaze), Resin Base / Polymer Binder
• Features: Anti-Static / ESD Control, Chemical / Oil Resistant, Conductive
• Form: Liquid
• Industry: Electronics, Other

Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.

• Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Other

Description: 10-3031 is a two component electronic grade epoxy system. This material provides excellent chemical and heat resistance. It is available in a standard and low viscosity.

• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Industry: Electronics, OEM / Industrial
• Use Temperature: -40 to 320 F
• Viscosity: 11600 cP

Description: 10-3032R is a high bond strength epoxy adhesive and sealant. This system has a non-critical mix ratio and adjustable flexibility. 10-3032R is also safe to use due to the absence of harmful solvents and toxic chemicals in the formulation.

• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Industry: OEM / Industrial

Description: high-temperature requirements, phenolic resin systems have advantages over polyesters, epoxies, and vinyl esters. Cured phenolic resins from GP Chemicals are formulated to be inherently fire-resistant, demonstrate low smoke generation and high-temperature resistance. Phenolic

• Filler Material: Aramid Fiber
• Form: Casting Resin

Description: This is a one component insulating epoxy. It is low in viscosity (400cps) and suitable for electronic applications requiring high dielectric properties. This system does not contain volatile organic compounds (VOC’s) and is designed for coating and impregnating applications.

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Dielectric Strength: 9.06E7 V/m
• Features: Dielectric, Protective
• Form: Liquid

Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at

• Chemical / Polymer System Type: Specialty / Other
• Composition: Single Component System, Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking
• Features: Electrical Insulation / Dielectric Material, Thermal Insulation / Heat Insulating

Description: These products consist of multiple plies of various papers impregnated with specialty epoxy resin systems and laminated under heat and pressure to produce a thermoset composite. Both papers and resins can be modified to change the finished properties of the final product, and

• Form / Shape: Film / Sheet
• Industry: Electronics
• Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved
• Polymer Matrix Type: Epoxy

Description: Macropoxy® HS HIGH SOLIDS EPOXY is a VOC compliant epoxy polyamide mastic designed for application to properly prepared steel surfaces. May be used as a one or two coat, direct-to-metal protective coating. Can be applied to marginally prepared surfaces. Long-term durability

• Chemistry: Resin Base / Polymer Binder, Epoxy, Other
• Cure / Dry Temperature: 50 to 100 F
• Industry: Marine, OEM / Industrial, Other
• Operating / Use Temperature: 50 to 100 F

Description: NP130 (NEMA FR-4) consists of a woven glass fabric substrate combined with a halogenated epoxy resin system. It is produced to printed circuit board quality standards, is flame retardant and meets or exceeds the requirements of MIL-I-24768/27, Type GEE-F, and IPC 4101, sheet 21

• Coeff. of Thermal Expansion (CTE): 5.56 to 6.67 µin/in-F
• Dielectric Strength: 650 to 670 kV/in
• Form / Shape: Film / Sheet
• Industry: Electronics, General Industrial

Description: GP® 7565 resin is used as a crosslinker for hydroxyl containing polymers such as epoxies, polyesters, vinyls and acrylics. GP 7565 resin provides outstanding chemical resistance. It can be emulsified into water-based epoxy resins. It is used where light colored

• Chemical / Polymer System Type: Epoxy, Phenolics (Melamine, Furan)
• Compound Type: Liquid
• Industry: Industrial
• Material Type / Grade: Thermoset

Description: NP512 combines a woven glass fabric and an epoxy resin system. The product provides high flexural, impact, and tensile strength at room temperatures along with a very high flexural modulus. NP512 is suitable for applications requiring enhanced flexural modulus and physical strength

• Dielectric Strength: 750 to 800 kV/in
• Form / Shape: Film / Sheet
• Industry: Electronics, General Industrial
• Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved

Description: NP511 (NEMA G-11) combines a woven glass fabric and a high temperature epoxy resin system (Tg over 180°C) that is non-brominated. The product provides consistent quality and good electrical properties under dry and humid conditions, as well as high flexural, impact, and bond strength

• Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
• Dielectric Strength: 700 to 720 kV/in
• Form / Shape: Film / Sheet
• Industry: Electronics, General Industrial

Description: RESIN, EPOXY

Description: A two pack thixotropic epoxy resin product for the repair of cracked concrete and masonry by the injection process.

• Features: Caulk / Grout, Leveling / Filling Compound

Description: 20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652 is easily machined and exhibits outstanding adhesion to metals, ceramics and plastics. When cured with Catalyst

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Dielectric Constant (Relative Permittivity): 4.8

Description: INSTAbond® 811 General purpose, two-part, fast-setting, five-minute epoxy. Quick green strength, machinable, flowable. Offsets/Replaces: Loctite Fixmaster Epoxy, Huntsman Araldite 2012, 3M Fastbond 10; Devcon 5 Minute Epoxy

• Cure Type / Technology: Two Component System

Description: NuAire’s Epoxy Resin countertops hold higher thermal properties than polypropylene and are less likely to scratch. Our countertops are highly corrosive-resistant, stain resistant, and hold a low moisture absorption rate.

• Material: Other
• Specialized Application: Laboratory
• Type: Casework System
• Use: Industrial

Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.

• Coeff. of Thermal Expansion (CTE): 10 to 41.67 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 4.5 to 5.5
• Dielectric Strength: Over 381 kV/in

Description: INSTAbond® 804 A two component aluminum filled epoxy paste adhesive. Bonds to steel, porcelain, concrete and wood. In addition, it can be sanded, filed or machined to a featheredge without loss of bond strength. It can also be sawed, ground, taped drilled or threaded with conventional tools.

• Cure Type / Technology: Two Component System
• Features: Filled

Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV

• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Features: Encapsulating / Potting
• Index of Refraction: 1.51
• Industry: Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging

Description: Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties.

• Chemical / Polymer System Type: Epoxy (EP)
• Dielectric Constant (Relative Permittivity): 3.5
• Dielectric Strength: 380 kV/in
• Form: Liquid

Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width. The glass transition temperature is over 150°C, which helps to improve the

• Coeff. of Thermal Expansion (CTE): 9.44 to 36.11 µin/in-F
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 4.5 to 5.5
• Dielectric Strength: Over 381 kV/in

Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.

Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.

Description: Plastics -- Epoxy resins -- Determination of degree of crosslinking of crosslinked epoxy resins by differential scanning calorimetry

Description: PROVIDING POWERFUL PROTECTION FOR SUBSTRATES WHILE MINIMIZING ENVIRONMENTAL IMPACTAs a pioneer in ultra-thick film epoxy resin coatings, Kansai Paint has released a heavy-duty anticorrosion coating that protects infrastructures from the dangers of a harsh natural environment. In

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Features: Protective
• Surface Location / Orientation: Exterior

Description: This specification covers a polyglycidyl ether of a bisphenol A Novalac prepolymer in the form of a solid.

Description: This specification covers an alicyclic diepoxy carboxylate prepolymer in the form of a low-viscosity liquid.

Description: This specification covers an alicyclic diepoxy carboxylate prepolymer in the form of a low vicosity liquid.

Description: This specification has been "CANCELLED" by the Aerospace Materials Division, SAE, as of October 1995.

Description: Parker LORD® Thermoset 300 Epoxy Adhesive Resin Part A Black is a filled epoxy resin used with thermoset hardeners to obtain a variety of handling and cured properties. It offers shock resistance, excellent thermal conductivity, and lower coefficient of thermal expansion

• Cure Type / Technology: Two Component System
• Viscosity: 68000 cP