Epoxy Resin Kit

Description: EPOXY COATING KIT (EPOXY RESIN SYSTEM)

Description: ResinLab Armstrong™ Epoxy Resin Adhesive A661 is a two component epoxy that is used to bond with most wood, plastics, ceramics, and metals. It cures at room temperature and has good shear strength. Part A: 48 g (1 oz) Flint Jar, Part B: 25 g (2 oz) Tube.

• Tensile Strength (Break): 2,800 psi
• Elongation: 2 %
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic, Wood / Wood Product
• Chemical System: Epoxy (EP)

Description: A kit consisting of two components, epoxy resin and hardener. Note: For use with STRONGWELL Fiberglass products. Available Sizes Kit (E502 Quart) Kit (E504 1/2 Gallon)

• Substrate Compatibility: Ceramic / Glass
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: ResinLab Armstrong™ Epoxy Resin Adhesive C-7 with Activator W is a two component, medium viscosity epoxy that is used to bond glass, thermoplastics, concrete, ceramics, rubber, and metals. It has the ability to have a flexible or rigid bond depending on the mix ratio. C7: 53 g

• Viscosity: 21,000 to 23,000 cP
• Elongation: 6.3 to 16.4 %
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: ResinLab EP1350 Black is a two component, low viscosity, high performing epoxy encapsulant designed for electronic potting and encapsulating. Features a very high Tg, low CTE, and superior electrical insulation properties in extreme conditions. Highly filled providing low shrinkage upon cure

• Thermal Conductivity: 0.73 W/m-K
• Elongation: 10 to 15 %
• Tensile Strength (Break): 2,500 psi
• Dielectric Strength: 425.00000000000006 kV/in

Description: ResinLab EP1350 Black is a two component, low viscosity, high performing epoxy encapsulant designed for electronic potting and encapsulating. Features a very high Tg, low CTE, and superior electrical insulation properties in extreme conditions. Highly filled providing low shrinkage upon cure

• Thermal Conductivity: 0.73 W/m-K
• Elongation: 10 to 15 %
• Tensile Strength (Break): 2,500 psi
• Dielectric Strength: 425.00000000000006 kV/in

Description: PIPE, FITTINGS, AND ADHESIVE KITS, GLASS-REINFORCED THERMOSETTING EPOXY RESIN FOR SHIPBOARD PIPING SYSTEMS

Description: PIPE, FITTINGS, AND ADHESIVE KITS, GLASS- REINFORCEMENT THERMOSETTING EPOXY RESIN FOR SHIPBOARD PIPING SYSTEMS

Description: 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that does not contain any solvents. Its’ convenient 1:1 mix ratio and lack of fillers make it an ideal material for

• Use Temperature: -58 to 302 F
• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 5,700 psi
• Dielectric Strength: 557.9999999999993 kV/in

Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use Temperature: 500 F
• Industry: Aerospace, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Die Bonding Adhesive / Compound, Electrical Insulating / Dielectric, Filled, Gap Filling Sealant / FIP Gasket, Laminating / Composites, Liquid, Non-corrosive Cure
• Substrate Compatibility: Dissimilar Substrates

Description: Pipe,Fittings, and Adhesive Kits, Glass Reinforced Thermosetting Epoxy Resin for Shipboard Piping Systems

Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)

Description: The Desco Statguard epoxy ESD / anti-static primer is another quality product from Desco.

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Type: Primer

Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)

Description: The Desco Statguard epoxy ESD / anti-static coating is another quality product from Desco. Use caution when purchasing products in this category as some may be flammable. This particular ESD / anti-static coating is not flammable.

• Chemistry: Epoxy, Resin Base / Polymer Binder

Description: The Desco Statguard epoxy ESD / anti-static coating is another quality product from Desco. Use caution when purchasing products in this category as some may be flammable. This particular ESD / anti-static coating is not flammable.

• Chemistry: Epoxy, Resin Base / Polymer Binder

Description: Loctite Nordbak ceramic epoxy comes in gray and is packaged 25 lb per inner, 1 per case. Can be used with metal. Designed to have impact-resistant properties. This product requires a specific mix ratio for proper use. Requires a 2:1 mix ratio. Cure time should always be considered on any

• Operating / Use Temperature: 250 F
• Chemistry: Epoxy, Resin Base / Polymer Binder

Description: This specification covers two-component colored systems composed of a resin and a miscible hardener supplied in kit form.

Description: This specification covers two-component colored systems composed of a resin and a miscible hardener supplied in kit form.

Description: DURA-PLATE 2300 is a three component, epoxy modified cementitious resurfacer containing Portland Cement, hydrophobic thixotropes, fiber reinforcement, graded silica sand and other abrasion resistant aggregates. It is used for resurfacing, patching and filling voids (bugholes) in concrete and

• Wet / Applied Thickness: 0.0625 to 0.5 inch
• Cure / Dry Temperature: 77 F
• Operating / Use Temperature: 40 to 95 F
• Substrate: Concrete / Masonry

Description: Elecolit® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room

• Features: Electrically Conductive Compound
• Industry: Electronics
• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: This specification covers a silver-filled epoxy resin in a suitable vehicle and a curing agent, supplied in kit form.

Description: Techsil® EP25676 is a two part thermally conductive epoxy resin system with a low mix viscosity. Once mixed, this system is grey in color with a long pot life and can be cured at ambient or elevated temperatures. The flexibility of the resin and the very high filler loading make

Description: SCOTCHCASTELECTRICAL RESIN 281 (

• Chemical System: Epoxy (EP)

Description: Key Features High peel strength Outstanding adhesion to rubbers Excellent thermal cycling resistance Withstands 1,000 hours 85°C/85% RH Product Description Master Bond EP21TDC-4 is a two component, very flexible epoxy for high performance bonding, sealing and coating. It has a non-critical

• Viscosity: 9,000 to 300,000 cP
• Use Temperature: -100 to 250 F
• Elongation: 100 to 150 %
• Industry: Aerospace, Electrical Power / HV, Electronics, OEM / Industrial, Semiconductors / IC Packaging

Description: Two component waterbase epoxy primer for protecting concrete surfaces. May be used in areas where high humidity and moisture are encountered. Wearcoat 1020 offers good resistance to acids and alkalies. It is supplied as a two component kit which is mixed prior to use. Wearcoat 1020 is

• Coverage: 250.00000000000003 ft²
• Cure / Dry Temperature: 70 F
• Dispensing Method: Brush / Roll-on, Sprayable
• Features: Coating, Protective

Description: OMEGA's TT300 cement is a heat-cured, 2-part epoxy adhesive that can be used to bond polyimide-backed strain gages for strain measurement up to 200C (392F). Each TT300 kit includes 2 bottles of resin and hardener that are pre-measured to ensure proper mixing proportions. To use,

• Use Temperature: -65.2 to 179.6 F
• Cure / Technology: Air Setting / Film Drying, Single Component System
• Chemical System: Cyanoacrylate

Description: Is a syntactic foam kit that produces a multi-sphere foam with a typical density of 26 - 29 pcf (pounds per cubic foot). The rated service depth of the foam is 3,300 feet (1,000 m). The kit consists of three parts: Part A: Epoxy resin mixed with hollow glass microspheres.

• Bulk Density: 26 lbs/ft³
• Applications: Acoustics / Sound Proofing, Structural / Composites
• Form / Shape: Casting Resin / Two-part (A+B Liquids)
• Material / Composition: Ceramic Foam