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Supplier: Aries Electronics, Inc.
Description: FEATURES 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board
- Contact Plating: Nickel Plating, Other
- Mounting: Through-hole
- Number of Contacts: 8
- Operating Temperature: 105 C
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Supplier: Aries Electronics, Inc.
Description: FEATURES 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board. GENERAL
- Contact Plating: Gold Plating, Nickel Plating
- Current Rating: 3 amps
- Military Standards: Other
- Mounting: Through-hole
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Supplier: ROHM Semiconductor USA, LLC
Description: ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.
- IF: 150000 mA
- RoHS Compliant: Yes
- Tj: -55 to 150 C
- VF: 1.3 volts
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Supplier: Aries Electronics, Inc.
Description: FEATURES Lead-Free RoHs/WEEE-compliant 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without
- Contact Plating: Gold Plating, Nickel Plating
- Military Standards: Other
- Mounting: Through-hole
- Number of Contacts: 8
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Supplier: Utmel Electronic Limited
Description: MOSFET 150V 7L JEDEC GREEN EMC
- PD: 3800 milliwatts
- Packing Method: Tape Reel, Other
- TJ: -55 to 175 C
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Supplier: Micropac Industries, Inc.
Description: High reliability, rugged package, stability over wide temperature range
- Collector Emitter Breakdown Voltage: 35 volts
- Isolation Voltage: 1000 volts
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -55 to 125 C
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Supplier: Micropac Industries, Inc.
Description: Qualified to MIL-PRF-19500/486, rugged package, high gain, high voltage
- Collector Emitter Breakdown Voltage: 35 volts
- Isolation Voltage: 1000 volts
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -55 to 125 C
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Supplier: Micropac Industries, Inc.
Description: Certified to MIL-PRF-19500/548, rugged package, high gain, high voltage
- Collector Emitter Breakdown Voltage: 40 volts
- Isolation Voltage: 1000 volts
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -55 to 125 C
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Supplier: Micropac Industries, Inc.
Description: DSCC approved 8302401EX, faraday shield for high common mode rejection
- Collector Emitter Breakdown Voltage: 20 volts
- Isolation Voltage: 1500 volts
- Mounting Option: Through Hole (Plug-in)
- Operating Temperature: -55 to 125 C
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Supplier: Accuris
Description: JEDEC Module Sideband Bus (SidebandBus)
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Supplier: Aries Electronics, Inc.
Description: FEATURES Convert surface-mount QFP packages to a 13x13 PGA footprint Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged
- Contact / Pin Type: Wire Wrap Pins
- Contact Plating: Nickel Plating, Other
- Mounting: Through-hole
- Number of Contacts: 132
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Supplier: Accuris
Description: Monotonic Bend Characterization of Board-Level Interconnects
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Supplier: Texas Instruments
Description: SN74SSQE32882 JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test
- Gate Type: Buffer / Driver
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Supplier: Texas Instruments
Description: JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
- Gate Type: Buffer / Driver
- Operating Temperature: 0.0 to 85 C
- Package Type: Other
- Supply Voltage: 1.5 V
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Supplier: Texas Instruments
Description: JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
- Gate Type: Buffer / Driver
- Operating Temperature: 0.0 to 85 C
- Package Type: Other
- Supply Voltage: 1.5 V
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Supplier: Texas Instruments
Description: JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
- Gate Type: Buffer / Driver
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Supplier: Accuris
Description: JEDEC Dictionary of Terms for Solid-State Technology
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Supplier: Accuris
Description: Index of Terms and Abbreviations Defined in JEDEC Publications
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Supplier: DigiKey
Description: SO 08 .15 JEDEC
- Operating Temperature: -40 to 125 C
- Package Type: SOIC, Other
- Slew Rate (SR): 2 V/µs
- Supply Current (IS): 1.8 milliamps
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Supplier: DigiKey
Description: SO 08 .15 JEDEC
- Operating Temperature: -40 to 125 C
- Package Type: SOIC, Other
- Rail-to-Rail Output: Yes
- Slew Rate (SR): 30 V/µs
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Supplier: ODG (Origin Data Global)
Description: SO 20 .30 TO JEDEC M
- IC Package Type: SOIC / SOP, Other
- Operating Temperature: -40 to 150 C
- Regulator Category: Linear Regulator
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Description: JEDEC DDR5 TEMPERATURE SENSOR WI
- Input (Supply) Voltage: 1.7 to 1.98 volts
- Operating Temperature: -40 to 125 C
- Package Type / Mounting: Other
- Sensor Type: Temperature Sensor
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Supplier: DigiKey
Description: SO 14 .15 TO JEDEC MS-012
- Operating Temperature: -40 to 125 C
- Package Type: SOIC, Other
- Rail-to-Rail Output: Yes
- Slew Rate (SR): 30 V/µs
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Supplier: Lingto Electronic Limited
Description: SO 20 .30 TO JEDEC M
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Supplier: Data I/O Corporation
Description: The FLX500™ is a compact, self-contained automated system for programming memory and microcontroller devices. At home on the desktop, in the lab, or on the production line, the FLX500 drastically reduces quality problems inherent in manual gang programming. Now the benefits of automation are
- Devices Supported: EPROM, EEPROM, FLASH, Microcontrollers
- File Format Supported: Binary, JEDEC
- Number of Sockets: 8
- Operating Humidity: 5 to 90 %
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Supplier: ODG (Origin Data Global)
Description: MBB IPC/JEDEC 4MIL 12X20" 100/PK
- Device Type: ESD Suppressor
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Supplier: ODG (Origin Data Global)
Description: MBB IPC/JEDEC 4MIL 14X16" 100/PK
- Device Type: ESD Suppressor
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Supplier: ODG (Origin Data Global)
Description: MBB IPC/JEDEC 4MIL 10X30" 100/PK
- Device Type: ESD Suppressor
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Supplier: DigiKey
Description: IC Socket Adapter SOIC To JEDEC Through Hole
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Supplier: BPM Microsystems
Description: Patented solution to guard against passing blank parts, ideal for design
- Devices Supported: CMOS, PROM, BPROM, EPROM, EEPROM, FLASH, PLD, EPLD, CPLD, PALs, GALs, Microcontrollers, PIC, Flash, SRAM-based FPGA, Antifuse FPGA, Other
- Features: CE / FCC Certified?, Warranty, Software Updates
- File Format Supported: Intel® Hex, Intel® Extended Hex, Intel® 32-bit Hex, Motorola® S-Record, Binary, JEDEC, ASCII, POF, Other
- Number of Devices Supported: 23000
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Supplier: J.S.T. Corporation
Description: Socket for DDR/DDR2 S.O.DIMM 200 circuits complying with JEDEC(MO-224).
- Connector Type: Card Edge Connector
- Current Rating: 0.3000 amps
- Voltage Rating: 25 volts
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Supplier: Rochester Electronics
Description: SN74SSQE32882 JEDEC SSTE32882-compliant 28-bit to 56-bit registered buffer with address-parity test
- IC Package Type: BGA, Other
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Supplier: Advanced Interconnections Corp.
Description: Adapters for Jedec .050" (1.27mm) Pitch PLCC's (Leaded Type A) feature our own patented Murphy Circuits®.
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 2.54 mm
- Features: Machined Pins
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Supplier: VAST STOCK CO., LIMITED
Description: High Speed Optocouplers HIGH SPEED JEDEC OPTOCPLR/SOLID STATE
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Supplier: VAST STOCK CO., LIMITED
Description: MOSFET 150V 7L JEDEC GREEN EMC
- Transistor Type: MOSFET
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. Product is rapidly transferred between the hot and cold chamber creating a temperature shock of the specimens. These thermal shock chambers meet a variety of test specifications including Mil-Std 810, Mil-Std 883, IEC 60068-2-14, JEDEC and a variety of commercial test standards (read more)
Browse Environmental Test Chambers and Rooms Datasheets for Weiss Technik North America, Inc. -
?Performance Validation ? 25% better thermal transfer than JEDEC standard heatsinks (tested @ 15W/in² heat flux) ? 5000+ hr salt spray certified for industrial environments (ASTM B117) ? -40°C to 150°C operational range with <3% thermal resistance (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
compatibility • Wide 2.7 to 5 V supply voltage range • 200 nS switching time • Ultra-miniature, MLPD (6-pin, 1.1 x 0.7 x 0.45 mm) package (MSL1, 260 °C per JEDEC J-STD-020) Applications: • WiFi 6E T/R switches • WLAN (read more)
Browse RF Switches Datasheets for Richardson RFPD -
Features Tight parameter distribution Available as singles, pairs, and dual pairs Packages rated MSL1, 260 per JEDEC J-STD-020 Skyworks GreenTM products are compliant with all applicable (read more)
Browse Diodes Datasheets for Skyworks Solutions, Inc. -
JESD78, Class II ESD protection: HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2,000 V CDM ANSI/ESDA/JEDEC JS-002 Class C3 exceeds 1,000 V Specified from -40°C to +85°C (read more)
Browse Serial Cables Datasheets for DigiKey -
called out in the EIA/IPC/JEDEC joint standard J-STD-002. Learn how traditional solderability tests may over-reject acceptable aged material. Discover an allowable alternative that more closely simulates board attach, providing a practical solution to this (read more)
Browse Uncategorized Products Datasheets for Rochester Electronics -
for AI server hot-swap functions. With top-side and bottom-side cooling options, these MOSFETs in CCPAK provide high power density and reliable solutions. All devices are supported by JEDEC registration and Nexperia’s interactive datasheets for seamless integration (read more)
Browse Metal-Oxide Semiconductor FET (MOSFET) Datasheets for Nexperia B.V. -
125 volts with liner removal or label removal/repositioning. These products are ANSI/ESD S20.20, ESD S541, IEC 61430 and JEDEC JESD 625B compliant (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Polyonics -
code shadowing to RAM Interfaces: Quad SPI and JEDEC xSPI-compatible Octal and HYPERBUS™ Automotive grade: AEC-Q100 qualified and proven at extreme temperatures (-40°C to +125°C) Enhanced reliability: Supports ECC (SECDED) along with CRC protection over (read more)
Browse FLASH Memory Chips Datasheets for Infineon Technologies AG -
applications such as data loggers, industrial controllers, boot media, smart metering devices, and embedded IoT systems. Compliant with the JEDEC e.MMC 5.1 standard, the M1100 family is housed in a (read more)
Browse Memory Modules Datasheets for Swissbit AG
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App Note: Guidelines for Pb-Free Soldering of Fairchild Components Based on JEDEC (R) J-STD 20D / IEC EN 61760-1:2006
This app note presents Fairchild's recommendation for a starting point for SMT and wave solder profiles.
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Achieving High-Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
In this study, the reliability of low-Ag SAC alloy doped with Mn (SACm (R)) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
for business this week, Japan's Renesas Technology Inc. has also reeled in its 300-mm silicon foundry unit--Trecenti Technologies Inc. JEDEC may offer its own seal of approval The JEDEC Solid State Technology Association
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (March 29) Heard on the Beat (March 29) JEDEC forms new IC standards group to make 802.11 WLANs fly ARLINGTON, Va. -- Will the wireless local-area networking (WLAN) market finally take off? JEDEC here is attempting to make the WLAN market fly by confirming the formation of a new
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Avago Introduces 18 GHz and 26.5 GHz Low-Noise E-pHEMT in 0402 Compatible Packages Produced by Advanced Wafer-Scale Packaging Technology (.pdf)
the size and performance advantage of bare die assembly and the reliability of encapsulated devices, while permitting automated assembly processes and low production costs. According to the IPC/JEDEC J-STD-012 definition, a chip scale package is a single-die, surface-mountable pack¬age with an area
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Chinese consumer electronics firms pursue GSM cell phones Hitachi's reply to Rambus: you violated antitrust act, Jedec rules Motorola to de-emphasize SRAMs in favor of network-specific memories On Semi widens power-management line with new voltage converters GenRad acquires two imaging
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Rambus targeted by FTC probe The Federal Trade Commission has launched a preliminary investigation of Rambus Inc. for possible antitrust violations stemming from the company's dealings with the JEDEC standards deliberation body. Semiconductor Alert! (Jan. 29-Feb. 2) Commentary & analysis of week's
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
In a rare move, the JEDEC standards body is considering a specification that would result in a modified, or look-alike, DDR-II memory chip aimed at graphics cards. IEDM sees strained, fully depleted future The 48th International Electron Devices Meeting, planned for Dec. 8-11 in San Francisco, may
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http://dspace.mit.edu/bitstream/handle/1721.1/41026/43034251-MIT.pdf?sequence=2
Standard designs have been established, for example, by the JEDEC (Joint Electronic Device Engineering Council) [88].
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http://dspace.mit.edu/bitstream/handle/1721.1/37674/124507392-MIT.pdf?sequence=2
Table 3.10: JEDEC Membership 2005 .
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More standardization skullduggery
… secret informant (designated Secret Squirrel) inside the Joint Electronic Devices Engi- neering Council ( JEDEC ) standard-setting group …
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ZCP2009ISTFA182
Instrumental Discrepancy and Relation of Stress Condition between ESD Association and JEDEC Standards on ESD CDM Test …
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Tape and Reel Information - RF Modules
ESD-SURFACE RESISTIVITY SHALL BE ≤ 1 X 10 8 OHMS/SQUARE PER EIA, JEDEC TNR SPECIFICATION.
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The effect of copper trace routing on the drop test reliability of BGA modules
The JEDEC drop test has become a popular method for the assessment of the dynamic mechanical reliability …
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High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics
Various test board assemblies have been drop tested in 00 JEDEC and 900 vertical drop orientations.
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Thermal characterization of plastic ball grid array packages via infrared thermography
… via IRT were found to be equal to those obtained by thermocouple techniques using standard JEDEC methods.