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Supplier: Mentor, a Siemens Business
Description: Real-Time OS deployed on more than 3 billion devices Nucleus is the first real time operating system integrated with power management features (DVFS, deep sleep modes, and power/clock gating), enabling engineers to take full advantage of the latest power saving
- Deployment: Standalone
- Operating System: Linux
- Source Code: Proprietary
- Use: Professional
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Supplier: ELMA Electronic Inc.
Description: Elma’s Low Power Data Acquisition System – LpDAS - is a small, lightweight, conduction cooled embedded computing solution for rugged environments. LpDAS can be configured to support a variety of avionic communication standards including ARINC 429, ARINC 825, MIL-STD-1553
- Application Software Included: Yes
- Datalogger / Recorder: Yes
- Form Factor: Stand Alone / Benchtop
- User Interface: Computer Programmable
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Supplier: Intelligraphics, Inc.
Description: In its simplest form, Firmware is software running on an embedded system. It may be flashed or burned into a ROM or downloaded from a host. It differs from FPGA, CPLD, or other silicon based solutions in that there is a processor that is running code, not just a fixed logic gate array
- Deployment: Standalone
- Licensing: Perpetual
- Use: Professional
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Supplier: Intelligraphics, Inc.
Description: and QCA4004 are full-featured, dual-band, single stream 802.11n solutions that serve as a highly integrated Wi-Fi link with an energy efficient on board power amplifier (PA) and LNA. RF switches are also integrated for the 2.4 GHz band. The QCA4002 and QCA4004 are optimized for low
- Deployment: Standalone
- Licensing: Perpetual
- Use: Professional
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Supplier: Lingto Electronic Limited
Description: QN908X: ULTRA-LOW-POWER BLUETOOT
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Supplier: Lingto Electronic Limited
Description: ULTRA LOW POWER BLUETOOTH LE SOC
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Supplier: Advantech
Description: UBX-310, an intelligent, fanless embedded system powered by Intel® low power processor with multiple I/O interface. The new generation Intel® processor brings 300% improvement on processing power and 300% on graphics performance than previous generation
- Processor: Intel®, Other
- RAM: 16 GB
- Type: Desktop / Tower
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Supplier: Infineon Technologies AG
Description: Cortex®-M0 core with an NFET driver. This System-on-Chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 302 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Infineon Technologies AG
Description: core with an NFET driver. This System-on-Chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 302 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Infineon Technologies AG
Description: with an NFET driver. This System-on-Chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for optimized
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 347 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Infineon Technologies AG
Description: an NFET driver. This System-on-Chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for optimized EMC
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 302 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Microchip Technology, Inc.
Description: . Additional Features Bluetooth 5 Certified 1.9V~3.6V (VDD) operating range Low-power consumption Average current: TX 3.87mA/RX 3.06mA with Buck,@ VBAT=3.0V and 18.75ms Connection Interval UART interface Main X’tal : 32MHz 256K
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Supplier: Acme Chip Technology Co., Limited
Description: LOW POWER SOC W/ VISION ACCELERA
- Clock Frequency: 213 to 500 MHz
- Operating Temperature: -40 to 257 F
- Processor Core: ARM
- RAM Size: 0.5120 MB
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Supplier: Acme Chip Technology Co., Limited
Description: LOW POWER SOC W/ FULL-FEATURED P
- Clock Frequency: 213 to 500 MHz
- Operating Temperature: -40 to 257 F
- Processor Core: ARM
- RAM Size: 0.5120 MB
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Supplier: Acme Chip Technology Co., Limited
Description: LOW POWER SOC W/ PROCESSING, IMA
- Clock Frequency: 213 to 745 MHz
- Operating Temperature: -40 to 257 F
- Processor Core: ARM
- RAM Size: 0.5120 MB
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Description: LOW-POWER SOC WITH LCD CONTROL
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Supplier: Microchip Technology, Inc.
Description: authorized Microchip representative if IC samples are required. Additional Features Bluetooth 5 Certified 1.9V~3.6V (VDD) operating range Low-power consumption Average current: TX 3.87mA/RX 3.06mA with Buck,@ VBAT=3.0V and 18.75ms Connection Interval
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Supplier: SIE Computing Solutions, Inc.
Description: The 681000-01 is a complete AdvancedTCA development system that is available with a six slot, Full Mesh backplane that supports the AdvancedTCA PICMG 3.1, 3.2, 3.3, 3.4, and 3.5 specifications. The 6861000-01 is a 8.75” (5U) high by 17” wide by 15.2” deep 19-inch
- Form Factor: AdvancedTCA
- Interfaces: Other
- Product Type: Chassis / System Platform, Other
- Slot Count: 6
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Supplier: Samsung Electro-Mechanics
Description: This product is developed by realizing complex functions into one system by mounting multiple ICs and passive components in a package. General Features Smaller Package size compared to individually-package d Ics Low Package Cost Superior
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Supplier: Teledyne DALSA
Description: CL is equipped with a low power, Gen3 Core i7 processor and high-speed system resources to effectively manage multi-camera applications. Each of the Camera link ports internally connect through independent high-speed data lanes to alleviate bandwidth bottlenecks often associated
- Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, ID Detection / Verification, Optical Character Recognition (OCR), Pattern Recognition,
- Data Storage: 60 GB
- Image Source: Area Scan Camera, Line Scan Camera
- Number of Cameras or Imagers Processed: 6
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Supplier: Teledyne DALSA
Description: Powerful performance at a low cost The GEVA 400 system offers excellent cost savings for multi-camera vision applications, such as final inspection of large assemblies. The four Power-over-Ethernet (PoE) compliant Gigabit camera ports are compatible with a wide range of Genie
- Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, ID Detection / Verification, Optical Character Recognition (OCR), Pattern Recognition,
- Data Storage: 256 GB
- Image Source: Area Scan Camera
- Number of Cameras or Imagers Processed: 4
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Supplier: Teledyne DALSA
Description: up to four times the performance of the GEVA 1000, the ruggedized GEVA-4000 provides a robust and highly capable industrial vision system for applications on the factory floor. GEVA-4000 is equipped with a low power, Gen3 Core i7 processor and high-speed system resources
- Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, ID Detection / Verification, Optical Character Recognition (OCR), Pattern Recognition,
- Image Source: Area Scan Camera
- Number of Cameras or Imagers Processed: 6
- System Type: Embedded / Vision Engine, Modular / PC-Based
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Supplier: Visual Sound, Inc.
Description: load "fingerprint" (identity and characteristics) data Comprehensive LoadSmart? load verification and SpeakerSafe? continuous loudspeaker performance monitoring Fully compatible with Dante? low-latency digital networking Fully compatible with Dolby Lake
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Supplier: MagicRAM, Inc.
Description: with SLC, pSLC or MLC NAND Flash Pin pitch 2.54mm/2.00mm Available in vertical & horizontal Support password protection Support low power mode Commercial (0°C to 70°C) and industrial (-40°C to 85°C) temperature
- Capacity: 1 to 64 GB
- Device Type: Solid State Disk, Removable Cartridge Hard Disk Drive
- Height: 0.2520 to 0.3780 inch
- Interface: USB, Other
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Supplier: Cirrus Logic, Inc.
Description: Linux®, Windows CE® and many other embedded operating systems. The ARM920T's 32-bit microcontroller architecture, with a five-stage pipeline, delivers impressive performance at very low power. The 16 KB instruction cache and 16 KB data cache provide zero-cycle latency to
- Clock Frequency: 166 MHz
- Data Bus: 32 Bit
- Interface: I2S, SPI, UART, USB
- Number of I/Os: 16 #
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Supplier: American Portwell Technology Inc.
Description: Compact, low-profile barebone Mini-ITX chassis system for digital signage, industrial automation, and simple function network device.
- Backplane Form Factor: Other
- Indicator Options: Power On/Off Indicator
- Mounting Style: Desktop
- Other Slot Type: Yes
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Supplier: Teledyne DALSA
Description: camera technology to significantly drive down system cost. The product’s rugged, fanless design reduces downtime and maintenance costs associated with deploying standard PC solutions in harsh industrial environments. GEVA 3000 is equipped with a low power, Gen3 Core i7 processor
- Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, ID Detection / Verification, Optical Character Recognition (OCR), Pattern Recognition,
- Data Storage: 60 GB
- Image Source: Area Scan Camera, Line Scan Camera
- Number of Cameras or Imagers Processed: 6
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Supplier: American Portwell Technology Inc.
Description: Compact, low-profile barebone Mini-ITX chassis system with 1-slot PCI expansion for digital signage, industrial automation, and simple function network device.
- Backplane Bus / Standard: PCI
- Backplane Form Factor: Other
- Indicator Options: Power On/Off Indicator
- Mounting Style: Desktop
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Supplier: InnoDisk USA Corporation
Description: Features Excellent data transfer speed Low power consumption S.M.A.R.T. & i-S.M.A.R.T. supported Intelligent system for error recovery Mechanical design for anti-vibration
- Features: Embedded
- Memory Size: 8 to 256 GB
- Memory Type: Solid State Drive
- Transfer Speed: 220 to 240 MB/sec
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Supplier: FLSmidth
Description: Key Benefits Reclaim rates of 800 t/h and more Greater than 99% reclaim efficiency Low power consumption Low maintenance Complete material recovery with a pneumatic reclaim system Material that’s stuck in storage is
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Supplier: Sauereisen, Inc.
Description: Sauereisen Low Expansion Cement No. 29 is an inorganic cement used for embedding heating elements, insulating thermocouples, coating resistors and coils, and mechanically sealing parts where high resistance to electricity, chemicals and thermal shock is required. A strong resistance to
- Coeff. of Thermal Expansion (CTE): 4.6 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Constant (Relative Permittivity): 5 to 7
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Supplier: Aaeon Systems Inc.
Description: The AEC-6420 is an extension of the model AEC-6410 and its debut will complete the product line of the BOXER Lite series. The unit features the Intel Atom N270 processor, which offers low power consumption and a condensed size and SODIMM DDRII 400/533 system memory (up to 2GB).
- Operating Temperature: 32 to 113 F
- Processor: Intel®
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Supplier: Radicom Research, Inc.
Description: features 2nd Ring-Detect that provides a method for Ring detection with zero modem power. Host is given modems 2nd opto isolator's uncommitted open collector. Upon detection of ring signal, system can control power to modem, ideal for low power or battery
- Product Type: Modem / Fax Module
- Technology: PC/104
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Supplier: Aaeon Systems Inc.
Description: The AEC-6911 is the first product of the "BOXER" product line and unfolds a new era of developing an embedded controller based on the fanless design and mobile low power consumption processor. The AEC-6911 supports the Intel® AtomTM N270 processor with 1.6 GHz and DDRII SDRAM
- Operating Temperature: 5 to 131 F
- Processor: Intel®
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Supplier: Radicom Research, Inc.
Description: Hardware Fax: V.17, V.29 Class 1/1.0 and Class 2 Call waiting detection Type I and Type II Caller ID detection Automatic Auto Answer Storable AT commands Low power consumption mode 63 embedded and upgradeable country profiles Line in
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Supplier: SIE Computing Solutions, Inc.
Description: /bechto p horizontal AdvancedTCA shelf with five front accessible slots and five usable rear transition slots, that allow for a variety of configurations. The 6861000 is designed to support DC inputs. A front pluggable, evacuated cooling scheme provides low MTTR and high reliability.
- Material: Steel
- Rack Component Size: Standard 19" Rack
- Rack Height: 5 U
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Description: -architecture processing unit that includes a built-in DSP engine and a floating point unit. As an extension of the ultra-low-power MSP microcontroller family, the MSP432 features ultra-low power consumption and integrated digital and analog hardware peripherals. The MSP432 is a
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Supplier: Swissbit AG
Description: in legacy embedded CompactFlash applications. The C-350 CF Card ensures optimized backward compatibility to legacy systems. The series offers low densities from 32 MB to 256 MB using highly reliable SLC Flash with 100’000 program / erase cycles. Swissbit’s most recent CF
- Features: Embedded, Ruggedized
- Memory Type: CompactFlash®, Other
- Transfer Speed: 19 MB/sec
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Supplier: Swissbit AG
Description: in legacy embedded CompactFlash applications. The C-350 CF Card ensures optimized backward compatibility to legacy systems. The series offers low densities from 32 MB to 256 MB using highly reliable SLC Flash with 100’000 program / erase cycles. Swissbit’s most recent CF
- Features: Embedded, Ruggedized
- Memory Type: CompactFlash®, Other
- Transfer Speed: 19 MB/sec
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Supplier: Swissbit AG
Description: in legacy embedded CompactFlash applications. The C-350 CF Card ensures optimized backward compatibility to legacy systems. The series offers low densities from 32 MB to 256 MB using highly reliable SLC Flash with 100’000 program / erase cycles. Swissbit’s most recent CF
- Features: Embedded, Ruggedized
- Memory Type: CompactFlash®, Other
- Transfer Speed: 19 MB/sec
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Supplier: Swissbit AG
Description: in legacy embedded CompactFlash applications. The C-350 CF Card ensures optimized backward compatibility to legacy systems. The series offers low densities from 32 MB to 256 MB using highly reliable SLC Flash with 100’000 program / erase cycles. Swissbit’s most recent CF
- Features: Embedded, Ruggedized
- Memory Type: CompactFlash®, Other
- Transfer Speed: 22 MB/sec
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Featured Products Top
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processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL. With its machine and deep learning capabilities, the new ultra low power conga-SMX8-Plus module allows industrial embedded systems to see and analyze their surroundings for (read more)
Browse Single Board Computers (SBC) Datasheets for congatec -
The LVEP050-TO5 is a high-performance piezoelectric accelerometer designed for ultra-low power consumption and easy integration into wireless accelerometers and other battery-powered applications – with the longevity and performance characteristics of an industrial accelerometer (read more)
Browse Accelerometers Datasheets for Wilcoxon Sensing Technologies -
conditions. Ideal for Diverse Applications: Embedded Systems: Revolutionize your embedded systems with the versatility and power of Intel FPGA, enabling advanced functionality and future-proofing your designs (read more)
Browse Field-Programmable Gate Arrays (FPGA) Datasheets for Nova Technology(HK) Co.,Ltd -
various application scenarios. Ideal for Embedded Systems: Categorized under Integrated Circuits (ICs) > Embedded - FPGAs, the Cyclone® IV E offers outstanding performance, suitable for a variety of embedded systems, meeting the needs of different projects (read more)
Browse IC Interfaces Datasheets for VAST STOCK CO., LIMITED -
optimize the camera’s operations to ensure power efficiency. Algorithms can decide when to record, analyze, or transmit data, thereby conserving energy. Additionally, AI chipsets designed specifically for embedded systems are optimized for energy efficiency, ensuring that the camera works longer on a (read more)
Browse Smart Cameras Datasheets for e-con Systems™ Inc -
Enterpoint Raggedstone4 Cyclone-V Altera SoC Based Development Board employs a powerful dual-core ARM® Cortex™-A9 processor, a user programmable FPGA fabric and the Linux™ operating system to offer a very cost-effective computing platform with high efficiency and low power. Raggedstone4 is aimed at applications needing a hardware acceleration function, a custom I/O or interface. (read more)
Browse Electronic Development Boards Datasheets for Mouser Electronics -
pads where SMD components can be mounted. How embedded cavities are used There are various uses of cavities that enable new approaches to designs, particularly when low profile assemblies are needed, or thermal management is a challenge. There are several design (read more)
Browse PCB Design and Layout Services Datasheets for Summit Interconnect -
range: -40ºC ~ +85ºC Programmable frequency output of 32.768 kHz, 1024 Hz or 1 Hz Timer output function with adjustable period Applications: IoT Computers Servers Embedded systems Ultra-low power Digital clocks (read more)
Browse IC Clocks Datasheets for ECS Inc. International -
standard in processing power for next-generation embedded designs. Delivering superior graphics and multimedia processing, and compute performance up to 3.6 TFLOPS with thermal design power (TDP) as low as 12W and as high as 54W, AMD Ryzen™ Embedded V1000 SOCs equip system designers to achieve (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
Applications: The MK64FN1M0VLL12 is a versatile solution suitable for various applications, including but not limited to: IoT (Internet of Things) Devices Embedded Systems Low-Power Sensors USB-Enabled Devices (read more)
Browse Microcontrollers (MCU) Datasheets for Shenzhen Shengyu Electronics Technology Limited
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Low Power Design Basics: How to Choose the Optimal Low Power MCU for Your Embedded System (.pdf)
evaluating the power efficiency of different MCU alternatives: Total Power Consumed = Active Mode Power + Standby (sleep) Mode Power + Wake-up Power. Using this formula we'll analyze each factor and how it relates to choosing a low power MCU for your embedded system.
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Balancing Performance and Power Efficiency in Embedded Systems
Optimizing embedded systems for low power consumption requires developers to find a balance between performance and power usage. However, achieving this balance can mean compromising product capability and reliability. There are three areas in which these compromises can affect performance: analog
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Clock Design Using Low Power/Cost Techniques
Typical embedded control applications place demands such as low power consumption, small size, low cost and reduced component count onto the microcontroller. This application note implements a 24-hour digital clock, alarm and 99 minute 59 second count down timer, yet operates on two ?AA? batteries
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An Introduction to Microchip's Low Power Devices (.pdf)
Power consumption has always been an important consideration for the design of any electrical system. This includes the embedded systems at the heart of countless modern devices and the microcontrollers that make most of these systems work- The expansion of embedded systems into markets
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How to Pick the Right Microcontroller Based on Low-Power Specifications
Choosing the right ultra-low-power microcontroller (MCU) for your next embedded design can be a confusing task when you compare claimed current consumption specifications in a myriad of data sheets provided by MCU vendors. In many cases, developers initially scan the first page of a data sheet
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Power-saving techniques lead to ultra-low-power processors for battery operated devices
processors, system performance need not be sacrificed. to achieve ultra-low power consumption. Embedded system designers can have it both ways and, in the end, bring to market much. more competitive battery-operated products.
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The Impetus Behind Advances in Industrial and Embedded Optical Communications
There is an insatiable demand for ever-greater communications bandwidth in industrial and embedded computing settings where distance, low power and small configurations matter. Specific enabling technologies such as FPGAs and advances in transceivers, connectors and receivers support the rapid
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Low Voltage Booster Energy Harvesting
the promise of powering embedded systems with energy harvesting. While potentially useful sources such as thermoelectric generators and single photovoltaic cells can generate potential energy, they tend to produce moderate current at very low voltages, which make the capture and usage of energy from
More Information Top
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High Performance Computing — HiPC 2002
In: International Conference on Super- computing, Barcelona, Spain (1995) 338–347 659 [34] Grun, P., Dutt, N., Nicolau, A.: Access pattern based local memory customization for low power embedded systems .
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System-on-Chip: Next Generation Electronics
Taking a look at the market, it is clear that heterogeneous multi-processor plat- forms are conquering the world of low power embedded systems : ST Nomadik [4], .
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Memory Design and Exploration for Low Power, Embedded Systems
In this paper, we describe a procedure for memory design and exploration for low power embedded systems .
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A Survey of Techniques For Improving Energy Efficiency in Embedded
Computing Systems
[50] D. Wu, B. M. Al-Hashimi, and P. Eles, “Scheduling and mapping of conditional task graph for the synthesis of low power embedded systems ,” in Computers and Digital Techniques, IEE Proceedings, vol.
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Embedded and Ubiquitous Computing
This work was extended to target low power embedded systems , hence low power partitioning is only byproduct of their work.
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Embedded System Design: Topics, Techniques and Trends
Lekatsas H, Henkel J., and Wolf W.: Code compression for low power embedded systems design.
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Transactions on High-Performance Embedded Architectures and Compilers I
Lekatsas H., Henkel J. and Wolf W. (2000) ‘Arithmetic coding for low power embedded system design’, Proceedings of the Conference on Data Compression, March, p. 430.
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Power Aware Design Methodologies
H. Lekatsas, W. Wolf, “Code compression for low power embedded systems ,” ACM/IEEE Design Automation Conference, pp. 294--299, June 2000.