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Supplier: SemiNex Corporation
Description: Medical - Professional / 1470nm Multi Chip Module
- Laser Output: Continuous Wave
- Laser Power: 18000 milliwatts
- Laser Type: Laser Diodes
- Operating Current Range: 17000 milliamps
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Supplier: Telit IoT Solutions, Inc.
Description: Multi-constellation GNSS module with integrated high performing 9 x 9 mm SMT antenna Compliant with GPS and GLONASS standards SMT mounting not requiring holes on host PCB Ready for Galileo Low power processing core delivers current optimized multi
- Features: RoHS Compliant
- IC Package Type: QFN
- Interface: UART, Other
- Supply Voltage: 3 V, 3.3 V, 3.6V
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Supplier: Telit IoT Solutions, Inc.
Description: The Jupiter SC872-A is a multi-constellation smart GNSS module with embedded 20 x 20 mm antenna. The SC872-A is packaged in a 21 x 22 mm double side PCB with a GNSS antenna on one side and all the remaining components on the opposite side. The SC872-A is provided with embedded Flash
- Features: RoHS Compliant
- IC Package Type: Other
- Interface: UART
- Supply Voltage: 3.3 V, 3.6V, 5 V
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Supplier: OptiSpac, Inc.
Description: chip layout stage, and the passive circuit components can be further integrated if necessary. If necessary, the package should be verified through microwave simulation after being designed.
- Materials: Copper, Tungsten, Other
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Supplier: Telit IoT Solutions, Inc.
Description: Telit LE modules family are the latest generation of multiband multi-channel radio module with advanced propriotary embedded stack easy to integrate and use in point-to point or star network communication. LE70-915 modules operate in 915 MHz band with 500 mW Output power
- Supply Voltage: Other
- TJ: -40 to 85 C
- Technology: GPRS
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Supplier: Telit IoT Solutions, Inc.
Description: The HE910 is our most compact multi-band HSPA+ LGA module series, with built-in GPS and GSM/EGPRS fallback at 28x28mm. As a member of the xE910 LGA unified form factor family the HE910 series is pin-to-pin compatible with LTE, HSPA, GSM/GPRS and CDMA/EVDO xE910 family counterparts.
- Data Rate: 5760 to 21000 kbps
- Device Type: Modem
- Features: RoHS Compliant
- IC Package Type: LGA
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Supplier: Qorvo
Description: The QPG6200M is the industry’s most reliable and robust wireless multi-standard System-on-Chip. Featuring Qorvo’s ConcurrentConnectTM technology, the QPG6200M supports the latest standards for Matter (over Thread), Zigbee, Bluetooth® Low Energy and Bluetooth® Mesh in a truly concurrent
- Applications: Mobile / Wireless Systems
- Features: RoHS
- Form Factor / Package: Other
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Supplier: Qorvo
Description: The QPG6200J is the industry’s most reliable and robust wireless multi-standard System-on-Chip. Featuring Qorvo’s ConcurrentConnectTM technology, the QPG6200J supports the latest standards for Matter (over Thread), Zigbee, Bluetooth® Low Energy and Bluetooth® Mesh in a truly concurrent
- Applications: Mobile / Wireless Systems
- Features: RoHS
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Supplier: Qorvo
Description: The QPG6200N is the industry’s most reliable and robust wireless multi-standard System-on-Chip. Featuring Qorvo’s ConcurrentConnectTM technology, the QPG6200N supports the latest standards for Matter (over Thread), Zigbee, Bluetooth® Low Energy and Bluetooth® Mesh in a truly concurrent
- Applications: Mobile / Wireless Systems
- Features: RoHS
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Supplier: Qorvo
Description: The QPG6200L is the industry’s most reliable and robust wireless multi-standard System-on-Chip. Featuring Qorvo’s ConcurrentConnect™ technology, the QPG6200L supports the latest standards for Matter (over Thread), Zigbee and Bluetooth® Low Energy in a
- Applications: Mobile / Wireless Systems
- Features: RoHS
- Form Factor / Package: Surface Mount Technology (SMT), Other
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Supplier: Gantner Instruments, Inc.
Description: The Q.series EC C101 combines powerful System-on-a-Chip computing with the flexibility of EtherCAT communication. This unique design greatly simplifies the implementation of reliable high-speed multi-axis servo control solutions. It has never been so easy to create an integrated
- Communication Standards: RS422, Other
- Configuration: Rack Mount
- D/A Resolution: 18 bits
- Maximum Output Voltage: 10 volts
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Supplier: Accuris
Description: MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M X 32-BIT (64Mb), RADIATIONHARDENED, SRAM, MULTI-CHIP MODULE
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Supplier: Utmel Electronic Limited
Description: 8-bit Microcontrollers - MCU ATtiny87 & ATA6624 multi-chip-module
- Data Bus: 8 Bit
- IC Package Type: Other
- Internal RAM Size: 0.5120 KB
- Life Cycle Stage: Other
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Supplier: Sensirion
Description: perfectly fitting for small and middle-sized companies. Based on Sensirion’s experience and expertise in environmental sensing, the SVM30 is optimized for easy design-in and sensing performance. The SVM30 is a multi-gas, humidity and temperature sensor combo module containing a SGP30
- Features: Temperature Measurement
- Measurement Type: Trace
- Number of Gases Sensed: Multi Gas
- Operating Humidity: 0.0 to 100 %
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Supplier: Infineon Technologies AG
Description: The Automotive Multi Motor Evaluation Kit addresses modern automotive application challenges with sophisticated motor control solutions from Infineon. It is an ideal start into the world of Infineon’s offering for motor control for applications where more than one motor is controlled
- Bus Width: 32-Bit
- Category: Development Board
- Supported System: Other
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Supplier: Accuris
Description: MICROCIRCUIT, MEMORY, DIGITAL, CMOS/SOI, 512K X 32-BIT (16M), RADIATION-HARDENED, LOW VOLTAGE SRAM, MULTI-CHIP MODULE
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Supplier: Accuris
Description: MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M X 32-BIT (64Mb), RADIATION-HARDENED, SRAM, MULTI-CHIP MODULE
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Supplier: ECO Light LED
Description: With its compact size, this LED module is a great backlight module for channel letters, halo lighting, sign lighting, or any other RGB application that requires a smaller yet efficient LED module. This product easily conforms to circular and curved layouts. A total of three 5050
- Color: Blue, Green, Multi-Colored, Red
- Optical Power Output: 720 milliwatts
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Supplier: ECO Light LED
Description: to circular and curved layouts. Don't let the small size of this LED module fool you; it is more than capable to handle all your lighting needs with a max output of 0.72W per LED chip. See more Click For Product Data Sheet
- Color: Blue, Green, Multi-Colored, Red
- Optical Power Output: 720 milliwatts
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Supplier: Richardson RFPD
Description: AirPrime XS1110 Ultra-Low Power Multi-GNSS Module The XS1110 supports tracking of GPS+Glonass, GPS+BeiDou, or GPS+Galileo satellite system combinations to deliver superior positioning accuracy within <1.5m, consuming up to 50% less power than standard GNSS modules. Unlike other
- Supply Voltage: 1.8 V
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Supplier: ECO Light LED
Description: This LED module is a great entry-level backlight module for channel letters, halo lighting and sign lighting. This product easily conforms to circular and curved layouts. A total of three 5050 SMD chips provide ample lighting with a max power requirement of 0.72W per
- Color: Blue, Green, Multi-Colored, Red
- Optical Power Output: 720 milliwatts
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Supplier: ECO Light LED
Description: This LED module is a great entry-level backlight module for channel letters, halo lighting and sign lighting. This product easily conforms to circular and curved layouts. A total of four 5050 SMD chips provide ample lighting with a max power requirement of 1.44W per
- Color: Blue, Green, Multi-Colored, Red
- Optical Power Output: 1400 milliwatts
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Supplier: Richardson RFPD
Description: The XA1110 supports tracking of GPS+Glonass or GPS+Glonass+Galileo satellite system combinations to deliver superior positioning accuracy of <2.5m (with SBAS). Based on MediaTek's latest MT3333 engine, it’s the smallest integrated antenna multi-GNSS module on the market with an ultra
- Supply Voltage: 1.8 V
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Supplier: Richardson RFPD
Description: The XM1110 supports tracking of GPS+Glonass, GPS+BeiDou, GPS+Galileo or GPS+Glonass+Galileo satellite system combinations to deliver superior positioning accuracy of <2.5m (with SBAS). Based on MediaTek’s latest MT3333 engine, it’s the smallest multi-GNSS module on the market with
- Supply Voltage: 1.8 V
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Supplier: Richardson RFPD
Description: The XM1110 supports tracking of GPS+Glonass, GPS+BeiDou, GPS+Galileo or GPS+Glonass+Galileo satellite system combinations to deliver superior positioning accuracy of <2.5m (with SBAS). Based on MediaTek’s latest MT3333 engine, it’s the smallest multi-GNSS module on the market with
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Supplier: TOP-electronics USA
Description: Quectel EC25-A, Mini PCIe Multi-mode LTE Module, Cat.4 (ATT Network) The EC25-A Mini PCIe is in the standard PCI Express® MiniCard form factor (miniPCIe) and is certified for use with the following North American networks: Canada: Rogers/Telus. USA
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Supplier: TOP-electronics USA
Description: Quectel EC25-V Mini PCIe Multi-mode LTE Module, Cat.4 (Verizon) The EC25-V Mini PCIe is in the standard PCI Express® MiniCard form factor (miniPCIe). The Quectel EC25-V is an LTE category 4 module optimized specially for M2M and IoT applications. Adopting the 3GPP Rel. 11 LTE
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Supplier: TOP-electronics USA
Description: Quectel EC25-E, Multi-mode LTE Module, Cat.4 (European Networks) The EC25 series is Quectel’s new generation of LTE category-4 modules, optimized specially for M2M and IoT applications. Adopting the 3GPP Rel. 10 LTE technology, it delivers 150Mbps downlink and 50Mbps uplink data
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Supplier: TOP-electronics USA
Description: Quectel EC25-V, Multi-mode LTE Module, Cat.4 (Verizon Network) The EC25 series is Quectel’s new generation of LTE category-4 modules, optimized specially for M2M and IoT applications. Adopting the 3GPP Rel. 10 LTE technology, it delivers 150Mbps downlink and 50Mbps uplink data
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Supplier: Knowles Precision Devices
Description: Compact SMD Chip Polyterm® Termination Option Sn-Pb Termination Option Applications: Down-Hole Drilling Automotive – ICE (Internal Combustion Engine) Automotive – xEV (Electric Vehicles) High Temperature Modules Industrial Equipment
- Applications: Other
- Capacitance Range: 1.00E-6 to 18 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 25 to 4000 volts
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Supplier: Knowles Precision Devices
Description: A range of High Capacitance value BME MLC chip capacitors, in stable Class II dielectrics X7R and X5R, with a spread of capacitance values offered up to 100µF. Comparable circuit designs can be achieved at typically a third to a fifth of the capacitance values because of the low ESR
- Applications: RF / Microwave Capacitors
- Capacitance Range: 0.0068 to 100 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 4 to 100 volts
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Supplier: Knowles Precision Devices
Description: while suppressing EMI and RFI interference. Manufactured to customer SCD. Vertical Mount Capacitor A vertical surface mount of a single large capacitor using specially designed and developed leads to allow for board space savings. High Energy Modules Specifically
- Applications: High Voltage Capacitor
- Electrostatic Capacitors: Ceramic
- Technology: Multilayer
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Supplier: ODG (Origin Data Global)
Description: IC MULTI ACTIVE DIE
- IC Package Type: Other
- Technology: Other
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Supplier: ODG (Origin Data Global)
Description: IC MULTI BB FREQ DIE
- IC Package Type: Other
- Technology: Other
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Description: Specifications Full ezLCD Command Set 5.6" 320X240, 16 bit Color TFT LCD, capable of 65,536 simultaneous colors Integrated Resistive Touch Screen Dedicated LCD Controller Chip Full Speed USB Interface (via Mini-USB connector
- Applications: Computer Applications
- Display Type: Graphic Display
- Features: Built-in Controller
- Technology: AMLCD, Thin Film Transistor (TFT)
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Description: RF TXRX MODULE MULTI CHIP
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Supplier: ODG (Origin Data Global)
Description: IC MULTI X2 ACTIVE DIE
- IC Package Type: Other
- Technology: Other
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Supplier: Lingto Electronic Limited
Description: MULTI-MODE DATA MODEM
- IC Package Type: Other
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Supplier: Sensirion
Description: The SGM60xx is Sensirion’s next generation series of gas meter modules for residential smart gas metering applications. It is equipped with the next generation CMOSens® flow chip, combined with Sensirion’s long experience in flow sensing. The SGM60xx series is available
- Number of Gases Sensed: Multi Gas
- Operating Temperature: -13 to 131 F
- Specific Gas Types: Methane (CH4) / Natural Gas
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Description: IC MULTI BB FREQ DIE
- Device Type: Other
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Supplier: Lingto Electronic Limited
Description: MULTI-MODE WIRELSS DATA MODEM
- IC Package Type: QFP, Other
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Featured Products Top
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. Thermal Design_Case Study A Application : Medical Pad IP54 Waterproof Temperature on Chassie must below 40 deg C Multi-chips heat source Thermal module solution (read more)
Browse Edge Connectors Datasheets for Rego Electronics Inc. -
QPF0219 is a multi-chip Front-End Module (FEM) designed for 2-18 GHz Wide-Band radar applications. The FEM integrates a T/R switch, a limiter, a low-noise amplifier and a power amplifier. Transmit power is 10 W saturated with 20% PAE and large signal gain is 13 dB, small signl is 19d (read more)
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Optimized layout for multi-SiC MOSFET and diode chips assembly in phase leg topology Symmetrical design to accept up to 12 SiC MOSFET chips in parallel per switch All die in parallel with their own gate series resistor for homogenous current balancing High (read more)
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Low power consumption, supporting operation from coin cell batteries Compact 3 x 3 x 0.75 mm Multi-Chip Module (MCM) package ideal for IoT and industrial applications (read more)
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GHz frequency range varies by only ±0.5 dB, making the MMA053AA die ideal for EW, ECM, radar, and test & measurement applications. The MMA053AA amplifier features compact die size and I/Os that are internally matched to 50 Ohm, facilitating easy integration into multi-chip modules. (read more)
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available RF Power Amplifier product portfolio for wireless infrastructure that spans multiple levels of integration, including; discrete transistors, multistage IC’s, and multi-chip modules (MCM), as well as leveraging GaN and Silicon LDMOS from the latest cutting edge NXP fabs (read more)
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optical inspection RoHS2 compliant (Directive 2015/863/EU) Applications Ideal for chip-on-board, chip-on-flex, multi-chip modules, and wire-bond encapsulation. Compatible with Dymax UV/LED spot lamps, flood lamps, and conveyor systems that provide balanced UV and visible wavelengths for fast, deep cures. (read more)
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Statistical Process Control Applied to Automated Dispense of Silver Filled Epoxy for Commercial Millimeter Wave Multi Chip Module (.pdf)
, to produce the first volume low cost 28 Ghz Commercial Millimeter Wave Multi Chip Module Reciever.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Oregon R &D unit for software, wireless products Alpha claims low-cost multi-chip module for high-frequency communications Workstation shipments drop due to memory shortages, says IDC MPU startup Transmeta files IPO Agilent sales jump 28% with surge in test, semiconductors Winbond's sales grow 63.6%
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Motorola SPS becomes Freescale Semiconductor IBM's 90-nm PowerPC chip boasts SOI, strained silicon Q-Star debuts digital IDDT module for ATE Matsushita to build PDP fab, plans to spend $850 million with Noreen Harned of ASML China's automotive chip market to hit $1.45 billion by 2007 Voice-over-IP
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
of transponders consists of a 10-Gbits transmitter and receiver, 16:1 electrical mux/demux components, and clock and data recovery (CDR) circuits all in the same module. Semiconductor Alert! (Aug. 28-Sept. 1) Chip-testing houses struggle to get new ATE systems SAN JOSE -- Faced with expanding lead times
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Commentary & analysis of week's chip news Japan's Ulvac rolls out wafer cleaning system METHUEN, Mass. -- Ulvac Technologies Inc. here has expanded its semiconductor equipment portfolio, announcing a new, low-cost cleaning system for 6- and 8-inch wafer fab applications. The new system, dubbed
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Using Serial RapidIO (R) to Optimize Baseband Interconnect in DSP-based 3G Base Stations
a significant portion of infrastructure cost. Open standards within the Node B allow costs to be reduced by enabling a more competitive environment and allowing multi-vendor solutions. The baseband card in a UMTS wireless base station (Figure 1) receives the digitized antenna data from the RF module
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A Microfluidic System for Biological Particle Enrichment Using Contactless Dielectrophoresis
. The electric field distribution and its gradient VE ¼ VðVfÞ. were modeled numerically in Comsol multi-physics 3.5 using. the AC/DC module (Comsol Inc., Burlington, MA). This is. done by solving for the potential distribution, 4, using the. Laplace's equation, V,ðsVfÞ ¼ 0, where s* is the complex
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Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Two die mounted via recessed bumps with capacitive coupling on a silicon multi chip module Solder bumps 3-metal MCM (bottom), and solder bumps.
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Wiring And Crosstalk Avoidance In Multi-chip Module Design
[4] R. Bruce, W. Meuli, and J. Ho, " Multi chip modules ," in Proceedings, 26th Design Automation Conference, Las Vegas, NV, June 1989,pp.
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Analysis of materials and structure tradeoffs in thin and thick film multi-chip packages
Fig. 1 shows a plot of the simulated size (in cm) of a multi chip module as a function of the number of chips it contains, and the number of logic circuits contained on each chip.
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Deformation and damage of materials of the structure and connecting technique
individually gehäustes semiconductor structure element multi chip module .
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Layout synthesis of electronic circuits
[7.2] Cho, J. D.; Sarrafzadeh, M.: The pin Redistribution problem in multi chip of module .
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Design of Systems on a Chip: Design and Test
An MCM [ Multi Chip Module ] is a way of packaging several unpackaged inte- grated circuits on a common substrate.
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Staged Attitude-Metrology Pointing Control and
Parametric Integrated Modeling for Space-based
Optical Systems
MACE Middeck Active Control Experiment MCM Multi Chip Module MIT Massachusetts Institute of Technology MOST Modular Optical Space Telescope OPD Optical Path Difference PADS Position and Attitude Determination System PPOP Precision Pointing Optical Payload SAM Sub Aperture Metrology SPHERES micro-satellite .
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MRS Online Proceedings Library - A New Polyimide for Multi-Chip Modules Applications - Cambridge Journals Online
It's inherent features in process ability, planarity, heat resistance, and patternability make it ideal for production use in multi chip modules .
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Capacitive coupling of data and power for 3D silicon-on-insulator VLSI
Capacitive coupling multi chip module for data and power is an enabling technology for 3D VLSI fabrication.