Products & Services
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Supplier: CHINO Works America Inc.
Description: The equipment is semiconductor aging testing equipment to full-automatically execute burn-in processing and data measurement/judgment /analytical processing and also has tester function as well as temperature accelerating testing.
- Components / Products Tested: Active Components / Semiconductors, Boards - Loaded PCB, MEMS / Sensors, Optoelectronics / Fiber Optics, Passive Components, Power Supplies / Transformers
- DUT Interfacing / Adapters: Flying Prober / Scanner
- Features: Burn-in, Fault Diagnostics / Logic Analysis, Temperature Controller
- Options / Module Types: Measure Unit / Monitor, Source Module / Unit, Interface / Fixture System
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Supplier: FX PCB Co., Ltd.
Description: necessary step in the development process that you are making a Rogers PCB prototype or Fr4 PCB prototype to test your design, which can help you to know whether the material is ideal for your equipment. Rogers PCB Material Fr4 PCB Material Dielectric Constant
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Supplier: Haida International Equipment Co., Ltd.
Description: by the level very high temperatures and very low temperature environment can tolerate continuous, whereby chemical changes in the shortest time to test its thermal expansion and contraction caused or physical damage. Usage For electrical and electronic components, automation
- Configuration: Floor Mount
- Features: Programmable
- Temperature Control: Heating, Cooling
- Temperature Range: -50 to 175 C
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Supplier: Haida International Equipment Co., Ltd.
Description: Walk-in test rooms is suitable for the high temperature, low temperature resistance and moisture resistance test of the products such as inductance, PCB, battery, computer, mobile phone, printer, household appliance, auto parts and vehicle. Particularly walk in
- Configuration: Walk-In
- Humidity Range: 40 to 85 % RH
- Temperature Control: Heating, Cooling
- Temperature Range: 20 to 80 C
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Supplier: FX PCB Co., Ltd.
Description: Description Prototype PCB Assembly – Understanding Introduction Prototype PCB assembly refers to the process of assembling and testing printed circuit boards (PCBs) before larger-scale production. PCB assembly is a critical part of any electronic product
- Location: United States Only, East Asia / Pacific Only
- Supplier Capability: PCB Assembly
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Supplier: FX PCB Co., Ltd.
Description: testing the assembled PCB to ensure the functioning of the device comprehensively. Light PCB assembly is often used in the production of: consumer electronics automotive electronics medical devices and other electronic products. How to Choose a
- Location: United States Only, East Asia / Pacific Only
- Supplier Capability: PCB Assembly
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Supplier: FX PCB Co., Ltd.
Description: phones, X-rays, coronary heart monitors, CAT scans, MRI systems, temperature sensors, manipulate tower instrumentation, etc. Key features of single-sided rigid PCB They are easy to design They are the most cost-effective Moreover, they are suitable for low
- Materials of Construction: Specialty / Other
- Thickness: 0.0079 to 0.3150 inches
- Type: Rigid
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Supplier: Weiss Technik North America, Inc.
Description: PCB’s, blister packs or lipstick – tests to stabilize and optimize the quality of products are indispensable in research and laboratories. Our laboratory test chambers were designed for this purpose in particular and allow reproducible temperature and climatic
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Supplier: Aries Electronics, Inc.
Description: /contact on 0.40-0.45mm pitch OPERATING TEMPERATURE:-55°C [-67°F] min. to 150°C [302°F] max. MOUNTING CONSIDERATIONS See “PCB FOOTPRINT TOP VIEW” for requirements REQUIRES: four #2-56 screws and PEM nuts for mounting (not supplied
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 0.4000 to 0.4500 mm
- Features: Solderless, Clamshell Socket
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Supplier: Hitachi High-Tech America
Description: Oxford Instruments CMI511 is a temperature compensating gauge for measuring Plated Through Hole (PTH) Cu thickness using Eddy Current technology. The CMI511 system is a hand held, battery operated instrument capable of measuring Plated Through Hole Cu prior to and after etching. It operates
- Application: Coating Thickness
- Measurement Range: 0.0020 to 0.1020 mm
- NDT Probe Technology: Eddy Current, Specialty / Other
- Style / Type: Surface Probe
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Supplier: Aries Electronics, Inc.
Description: FEATURES Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers Contacts are normally closed to eliminate dependence on plastic to sustain contact
- Contact / Pin Type: Solder Tail Pins
- Contact Plating: Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
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Supplier: Dyna-Graphics Corporation
Description: characteristics. Not only can they tolerate extreme temperatures and be water resistant, they can also withstand a wide variety of chemicals and solvents making them suitable for almost any industry. Touch Screens: We offer ITO Analog Resistive Touch Screens. Designed with 4-wire, 5-wire or 8
- Location: North America, United States Only, Midwest US Only
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability
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Description: . ? Minimum interface thickness can reach as low as 0.05 mm. ? High-temperature resistance up to 150?, with excellent dry-out resistance and no overflow. ? No preheating required before use. ? Complies with RoHS, Halogen-Free, and REACH environmental and safety
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 4 W/m-K
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Supplier: Aries Electronics, Inc.
Description: CONTACT CURRENT RATING: 1 amp OPERATING TEMPERATURES: -85°F to 257°F [-65°C to 125°C] Au plating, -85°F to 392°F [-65°C to 200°C] NiB (Spinodal) ACCEPTS LEADS: 0.014-0.026 [0.36-0.66] dia., 0.120-0.290 [3.05-7.37] long MOUNTING CONSIDERATIONS SUGGESTED PCB HOLE SIZE: 0.032 ±0.002 [0.81
- Contact / Pin Type: Solder Tail Pins
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
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Supplier: IDENTCO International
Description: labels feature a 2.0 mil ultra-aggressive permanent acrylic adhesive that, like the product’s printable materials, offers excellent resistance to harsh chemicals and high temperatures. Its adhesive power is equally impressive, with tests showing a 20-minute dwell with a peel adhesion
- Backing / Base: Specialty / Other
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Supplier: Hitachi High-Tech America
Description: The CMI 165 Copper Plating Gauge is a handheld coating thickness gauge that is specifically designed for PCB electronics manufacturers and copper platers who require quick, easy, accurate and repeatable measurements on hot or cold copper traces or panels.
- Application: Coating Thickness
- Measurement Range: 2.50E-4 to 0.2540 mm
- NDT Probe Technology: Eddy Current, Specialty / Other
- Special Features: Replaceable / Detachable Tip
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Supplier: Aries Electronics, Inc.
Description: FEATURES Aries Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers Contacts are normally closed to eliminate dependence on plastic to sustain contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 2.54 mm
- Current Rating: 1 amps
- Dielectric Withstanding Voltage: 1 kilovolts
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Supplier: Richardson RFPD
Description: 14-Bit, 80 MSPS Analog to Digital Converter is now available as a Standard Microcircuit Drawing (SMD). The 5962-0423001QXC is a high-speed, high-performance monolithic 14-bit ADC, which is 100% production tested at 70 MHz and 150MHz at -35°C to +85°C case temperature. Units are
- IC Package Type: QFP
- Resolution: 14 bits
- Sample Rate: 80000 kSamples/Sec
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Supplier: Molex Signal Tech Industrial Ltd.
Description: 5A continues current carrying capacity and capable -50 to 170deg C test environment. Proprietary contact design with wiping action at device pad to ensure consistent contact resistance. Minimal scrub action to the PCB pad. Features & Benefits Smiths Interconnect's Celsius
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: InfraTec GmbH
Description: E-LIT – Automated testing solution system allows non-contact failure inspection of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss can be measured with Lock-in Thermography. This is achieved by using the shortest
- Form Factor: Bench / Rack / Cabinet, Monitoring System
- Instrument Type: Flaw Detection
- Technology: Other
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Description: resulting from the accuracy of the measuring equipment, preparation method and specifications of the component manufacturers (components, PCB, solder paste, etc.). b) Distinction from existing standards The envelope profile given in this document does not represent a temperature-time
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Supplier: Richardson RFPD
Description: /repetitive unclamped inductive switching (UIS) Three-phase, 380/400 V RMS, 50Hz or 60 Hz input voltage 140 kHz switching frequency 780 V DC output voltage PCB layout with consideration for safety, current stress, mechanical stress, and noise immunity Open source software for digital control
- Category: Development Board
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Supplier: SAE International
Description: Compact PCB power relays were tested in repetitious on/off operations to define their reliability through a quantitative analysis of failure cycles and an investigation of relay property changes and contact erosion forms. Operation voltage was 14 V and relay temperature was 120
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Supplier: Master Bond, Inc.
Description: Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100°F to +500°F with a glass transition
- Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Composition: Unfilled
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Description: IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
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Supplier: HAVE, Inc.
Description: tabs for FASTON 0.187" x 0.02" (4.8 mm x 0.5 mm) or PCB-version with pins 1.6 mm x 0.5 mm (FASTON is a trademark of AMP Inc.) Solderability complies with IEC 68-2-20 Materials Contacts: Female: CuZn39Pb3 Male: CuSn8, 4 â•¡m Ag plated Housing Insulator: PA 6 30% GR Housing Flange: Zinc Diecast
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Supplier: Avel Lindberg, Inc.
Description: Horizontal Fixing Option Vertical Fixing Option Toroidal Construction Thermally Protected Primary Fully Encapsulated to UL 94VO Dual Secondaries Low Magnetic Field Low Surface Temperature Low Induced Noise (Audible
- Maximum Primary Voltage Rating: 115 volts
- Maximum Secondary Voltage Rating: 9 volts
- Mounting / Form Factor: PC / PCB Mount
- Output Voltage: DC
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Supplier: Honeywell Sensing & IoT
Description: industry-leading Total Error Band and its being a combined humidity/temperature sensor. True, temperature-compensa ted digital I2C output: Typically allows the customer to remove the components associated with signal conditioning from the PCB to free up space and reduce costs
- Form Factor: Sensor / Probe
- Operating Temperature: -40 to 185 F
- Relative Humidity Accuracy: 4 %
- Relative Humidity Range: 10 to 90 %
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Supplier: Honeywell Sensing & IoT
Description: industry-leading Total Error Band and its being a combined humidity/temperature sensor. True, temperature-compensa ted digital I2C output: Typically allows the customer to remove the components associated with signal conditioning from the PCB to free up space and reduce costs
- Form Factor: Sensor / Probe
- Operating Temperature: -40 to 185 F
- Relative Humidity Accuracy: 4 %
- Relative Humidity Range: 10 to 90 %
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Supplier: Honeywell Sensing & IoT
Description: industry-leading Total Error Band and its being a combined humidity/temperature sensor. True, temperature-compensa ted digital I2C output: Typically allows the customer to remove the components associated with signal conditioning from the PCB to free up space and reduce costs
- Form Factor: Sensor / Probe
- Operating Temperature: -40 to 185 F
- Relative Humidity Accuracy: 4 %
- Relative Humidity Range: 10 to 90 %
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Supplier: Honeywell Sensing & IoT
Description: industry-leading Total Error Band and its being a combined humidity/temperature sensor. True, temperature-compensa ted digital I2C output: Typically allows the customer to remove the components associated with signal conditioning from the PCB to free up space and reduce costs
- Form Factor: Sensor / Probe
- Operating Temperature: -40 to 185 F
- Relative Humidity Accuracy: 4 %
- Relative Humidity Range: 10 to 90 %
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Supplier: TE Connectivity
Description: Body Features Primary Product Color : Red Configuration Features Number of Positions : 4 Number of Rows : 1 Number of Signal Positions : 4 PCB
- Contact Plating: Other
- Contacts Pitch: 2.5 mm
- Current Rating: 3 amps
- Mounting: Through-hole, Other
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Supplier: TE Connectivity
Description: Body Features Primary Product Color : Blue Configuration Features Number of Positions : 4 Number of Rows : 1 Number of Signal Positions : 4 PCB
- Contact Plating: Other
- Contacts Pitch: 2.5 mm
- Current Rating: 3 amps
- Mounting: Through-hole, Other
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Supplier: TE Connectivity
Description: & Tail Dimension : .64 MM [.025 INCH ] Termination Method to PCB : Through Hole - Solder Termination Post & Tail Length : 3.2 MM [.126 INCH ] Usage Conditions Operating Temperature Range : -30 - 105 DEGC [-22 - 221 DEGF ]
- Contact Plating: Other
- Contacts Pitch: 2.5 mm
- Current Rating: 3 amps
- Mounting: Through-hole, Other
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Supplier: TE Connectivity
Description: & Tail Dimension : .64 MM [.025 INCH ] Termination Method to PCB : Through Hole - Solder Termination Post & Tail Length : 3.2 MM [.126 INCH ] Usage Conditions Operating Temperature Range : -30 - 105 DEGC [-22 - 221 DEGF ]
- Contact Plating: Other
- Contacts Pitch: 2.5 mm
- Current Rating: 3 amps
- Mounting: Through-hole, Other
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP42HT-2 is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding chemical resistance. It is widely used in medical devices because of its ability to
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrical Insulation / Dielectric
- Coeff. of Thermal Expansion (CTE): 19.44 to 22.22 µin/in-F
- Composition: Unfilled
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrical Insulation / Dielectric
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Richardson RFPD
Description: and ADC header pins Single Power Module Solution 21 mOhm six-pack module All Silicon Carbide MOSFETs Integrated temperature sensor Baseplateless package with isolated alumina substrate Specifications
- Category: Development Board
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, thermal, and mechanical properties, which makes them used for high frequency, high-power, and high-reliability applications. It is a very necessary step in the development process that you are making a Rogers PCB prototype or Fr4 PCB prototype to test your design, which can (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
to protect the hot spots and ensure the components operate within a safe temperature. To meet the layer stacking, the Multilayer PCB manufacturing process is more complex. It includes layer stacking, drilling, metallization, etching, and other steps. This lamination process can meet the (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
changed. Rigid PCBs have utilization in GPS equipment, pc, laptops, capsules, cell phones, X-rays, coronary heart monitors, CAT scans, MRI systems, temperature sensors, manipulate tower instrumentation, etc. Key features of single-sided rigid PCB They are easy to (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
high temperatures and high-frequency performance, and FR4 PCBs, made from glass-reinforced epoxy laminate material, are commonly used for their good insulating properties and relatively low cost In addition to the material choice, PCBs can also differ in (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for FX PCB Co., Ltd. -
Key Testing Items for the RoHS PCB RoHS testing must cover homogeneous materials (i.e., indivisible single materials) in PCBs, with a focus on solder (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
Understand unforgiving natural conditions, counting tall temperatures, mugginess, and mechanical push. Expanded life expectancy compared to conventional PCBs. Lightweight Plan Combining adaptability with a lightweight structure, these PCBs are culminate (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
Obtain UL Certification for PCBs To obtain UL certification, PCB manufacturers must undergo a rigorous testing and inspection process: Material Testing – Flame resistance, temperature endurance, electrical performance (read more)
Browse Electrical and Electromechanical Assembly Services Datasheets for Summit Interconnect -
Obtain UL Certification for PCBs To obtain UL certification, PCB manufacturers must undergo a rigorous testing and inspection process: Material Testing – Flame resistance, temperature endurance, electrical performance (read more)
Browse Prototyping Services Datasheets for Summit Interconnect -
Constant (Dk): A stable and tightly controlled Dk across frequency and temperature is critical to impedance control and signal integrity. Lower Dk increases propagation velocity, but stability and tolerance matter most. Designers should specify Dk values, tolerances, and test frequencies per IPC (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Summit Interconnect -
): A stable and tightly controlled Dk across frequency and temperature is critical to impedance control and signal integrity. Lower Dk increases propagation velocity, but stability and tolerance matter most. Designers should specify Dk values, tolerances, and test frequencies per IPC-4101/4103 slash (read more)
Browse PCB Design and Layout Services Datasheets for Summit Interconnect
Conduct Research Top
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UltraPad (R) Silicone Press Pad with Excellent Mar Resistance (Press Pads for Flex and Rigid Flex PCB Lamination)
of the potential to cause lamination induced defects in the PCB. A test method is developed to quantify mar resistance in this paper. The factors for mar resistance such as temperature, pressure, time, press pad thickness, and crosslink density of silicone rubber are analyzed. This paper also introduces
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FAQs > Diodes
Maximum Storage and Operating Temperature. Using parallel resistors and capacitors across diodes. Dimensions - nominal, max., and min. MTBF for MD90FF18 and similar diodes. Space level diodes. Mounting K25UF epoxy diode to PCB. Polarity testing. High Temp Plastic Diodes. I 2T. Series and parallel
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Analysis of Field Loads in Automotive ECUs and MEMS Sensors
Fig. 8: Measured car speed and PCB temperature during test drive and soak phase .
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
A real time low tem- perature test of PCBs will provide useful information about their behavior.
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Design of high-temperature SiC three-phase AC-DC converter for >100°C ambient temperature
So, the high- temperature PCB is tested again with -55~180°C cycling profile and the results showed no significant changing after 200 thermal cycling times.
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Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections
The mechanism of failures can be specified with high probability at the basis of plotted curves, and information about test conditions (such as momentary acceleration, strain in specific location on the surface of tested PCB or temperature in the climatic chamber).
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Cryptographic Hardware and Embedded Systems - CHES 2013
We used a TestEquity Model 107 temperature chamber to fully enclose the test PCB during temperature variation testing.
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Development of a novel PCB-based voice coil actuator for opto-mechatronic applications
Thermal Test Results ( PCB Temperature .
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Temperature-dependent elimination of 2,4,6,2′, 4′-pentachloro[U-14 C]biphenyl inNereis virens (Polychaeta)
The two ap- proaches have the same result: among the four tested temperatures , PCB elimination is optimum at 12~ .
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Liquid crystal polymer as a substrate material for flip chip ACA interconnections
Table 4 Failure percentages for the FR-4 PCB during Temperature cycling test A FR-4 .
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Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection
The results are presented so that the dependency of the component operating temperature on the test PCB construction and the effect of using different PCB modeling strategies on prediction accuracy are both highlighted.
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Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints
• Thickness of gold plating, the nature of the component substrate, and the solder volume in the joint all need to be considered carefully for high- temperature test of the PCB .