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  • Two Solutions to Static Problems in Semiconductor Die Bonder Operation
    One phase of the semiconductor manufacturing process involves a die bonding machine. Several manufacturers produce this type of equipment with similar designs for the actual bonding operation. A fine gold wire (approximately 2 mil. in diameter) is attached from the semiconductor component
  • Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing
    Die attach adhesives serve a critical role in semiconductor assembly and throughout the product lifecycle. Beyond their ability to form a tight bond between die and various substrates, these adhesives...
  • Understanding Low Outgassing Adhesives
    that a growing number of engineers with earthbound. applications are worrying about outgassing too, here's a. look at what to expect from low outgassing adhesives,. LOW encapsulants and sealants: OUTGASSING. ADHESIVES. One. Part. Two. Part. Epoxies Silicones UV. Curables. Bonding Potting

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