Semiconductor Die Bonder

Description: essential in semiconductor packaging, where the bonding wire must be placed accurately on micro-sized pads.· In wire bonding, especially ultrasonic bonding, reducing vibration in the bonding tool is critical to achieve precise bonding. Applications Used in Semiconductor die

Description: Overview The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single machine. The large 304 x 152mm work area provides users flexibility to work with many different work holder

• Automation: Automatic
• Wire Bonder Type: Wedge Bonder

Description: enables low temperature, high reliability copper to copper interconnects for Die-to-Die (D2D), Die-to-Wafer (D2W), and Wafer-to-Wafer (W2W) bonding. Product Features Novel One-Part Additive System NOVAFAB NANOTWIN Cu is a ready-to-use solution designed for use with soluble or

• Chemical / Composition: High Purity, Tin Plating

Description: Product Overview ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot life of over 24 hours at room temperature and maintains a 12-month shelf life when stored at

• Features: Die Bonding Adhesive / Compound, Electrically Conductive Compound (Adhesive, Grease), Film / Sheet, Grease / Paste
• Industry: Electronics, Semiconductors / IC Packaging
• Cure / Technology: Thermosetting / Crosslinking

Description: Indium Corporation’s “Power-Safe” NC-SMQ®75 is the world’s first and only solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach. The ultra-low flux residue, combined with a benign, low reactivity flux chemistry, enables power

• Features: Other
• Joining Process / Product Form: Paste

Description: Product Overview ALPHA Argomax 8021 Film offers a ready-to-laminate solution that removes the need for printing, dispensing, and drying process steps. Optimized for use in Die Transfer Film (DTF) processes, it supports a wide range of surfaces and is customized for fast, easy die and

• Thick Film Type: Conductor
• Applications: Die Bonding, Electronics / Microelectronics
• Material: Silver / Silver Alloy

Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The

• Use Temperature: -452.47 to 250 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
• Features: Anti-static / ESD Control, Die Bonding Adhesive / Compound, EMI / RFI Shielding Material, Electrical Insulating / Dielectric, Electrically Conductive, Liquid, Other, Specialty / Other, Unfilled
• Substrate Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer

Description: Product Overview ATROX® 800HT2V-P1: Variant of 800HT2VX optimized for specific dispense and flow characteristics in automated die attach systems.

• Features: Die Bonding Adhesive / Compound
• Industry: Electronics, Semiconductors / IC Packaging
• Cure / Technology: Thermosetting / Crosslinking

Description: Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2.

• Viscosity: 200,000 to 250,000 cP
• Use Temperature: -80 to 600 F
• Tensile Strength (Break): 9,000 to 10,000 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to electronic

• Use Temperature: -100 to 400 F
• Thermal Conductivity: 1.7307 to 2.0192 W/m-K
• Coeff. of Thermal Expansion (CTE): 12.780000000000001 to 15 µin/in-F
• Tensile Strength (Break): 6,500 psi

Description: Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures.

• Use Temperature: -80 to 550 F
• Thermal Conductivity: 2.2 to 2.9 W/m-K
• Coeff. of Thermal Expansion (CTE): 12,777,777.777777778 to 14,444,444.444444444 µin/in-F
• Tensile Strength (Break): 7,000 to 8,000 psi

Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following industries:

• Viscosity: 1,300 to 1,800 cP
• Use Temperature: 572 F
• Thermal Conductivity: 0.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 22.22222222222222 to 105.55555555555556 µin/in-F

Description: conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our

• Viscosity: 1,800 to 2,800 cP
• Use Temperature: 572 F
• Thermal Conductivity: 3.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 17.22222222222222 to 66.66666666666667 µin/in-F

Description: semiconductor devices, primarily for the protection and efficient delivery of materials such as solder or flux during the packaging process. They provide high mechanical strength, excellent thermal stability, and electrical insulation, ensuring the integrity of the semiconductor

• Wire Bonder Type: Wedge Bonder

Description: EFO wands are polished base on over decade years special experience. So it make the spark consistent and the direction from the same point always. Application Die bonding process, Wire Bonding, flip-chip bonding and MEMS packaging , High-Precision Electronics such as in LED.

• Automation: Automatic
• Wire Bonder Type: Wedge Bonder

Description: -50 °C to +200 °C, 1.6 x 1.2 mm, bondable Au-Pads, metallized backside. Its improved thermal conductivity makes it ideal for various applications in the semiconductor and microelectronics industries, medical devices, aerospace and defense, industrial instrumentation, e-mobility and automotive

• Operating Temperature: -58 to 392 F
• Nominal Resistance: 1,000 R₀ @ 0° C
• Length: 0.04724412 inch
• Width / Diameter: 0.06299216 inch

Description: Wafer production technology requires extreme precision components, whether for reticle stages, wafer stages or imaging technologies. ZYGO is a leading supplier of stage positioning components, serving the semiconductor industry and emerging EUV technologies through multiple custom orders. Our

Description: The need for high-temperature solders is growing as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as a result of increased power ratings. Indalloy®182 (80Au/20Sn eutectic solder) has been the workhorse for

• Features: Other
• Joining Process / Product Form: Preform

Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum adhesive

• Viscosity: 8,500 cP
• Thermal Conductivity: 9.23 W/m-K
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Liquid, Thermal / Heat Conductive
• Industry: Electrical Power / HV, Electronics, OEM / Industrial, Semiconductors / IC Packaging

Description: tension, making it adaptable to different die sizes, shapes, and bonding techniques.Thermal Stability: Withstands the temperature fluctuations associated with semiconductor packaging processes, such as die attach and wire bonding, without deforming or losing

Description: 1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies. 1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner

Description: 1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies. 1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner

Description: IEC 60749-34:2010 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases

Description: IEC 60749-34:2010 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases

Description: Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die & lid attach material.Requires low heat assist for cure. Ideal for applications requiring low-heat curing.

• Use Temperature: -55 to 155 F
• Thermal Conductivity: 1 W/m-K
• Tensile Strength (Break): 3,000 psi
• Dielectric Strength: 381.0000000000008 kV/in

Description: Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. Requires heat assist.

• Viscosity: 40,000 cP
• Use Temperature: -60 to 180 F
• Tensile Strength (Break): 3,200 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.

• Viscosity: 20,000 to 30,000 cP
• Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
• Substrate Compatibility: Ceramic / Glass
• Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric, Gel, Other, Thermal / Heat Conductive, Unfilled

Description: conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our

• Viscosity: 1,800 to 3,300 cP
• Use Temperature: 572 F
• Thermal Conductivity: 12.1 to 22.7 W/m-K
• Coeff. of Thermal Expansion (CTE): 22.77777777777778 to 90 µin/in-F

Description: conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our

• Viscosity: 3,500 to 6,000 cP
• Use Temperature: 527 F
• Thermal Conductivity: 10.9 to 23 W/m-K
• Coeff. of Thermal Expansion (CTE): 29.444444444444443 to 44.44444444444444 µin/in-F

Description: LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material

• Viscosity: 10,900 cP
• Thermal Conductivity: 0.6 W/m-K
• Coeff. of Thermal Expansion (CTE): 20 µin/in-F
• Features: Electrically Insulating / Dielectric

Description: TELICA, a cutting-edge multi-axes platform, is revolutionizing semiconductor back-end applications with its dual gantry architecture, offering unmatched accuracy and throughput for advanced die bonding applications and more. TELICA is a multi-axes platform designed for

• Stroke or X-Axis Travel: 0 to 29.527575 inch
• Y-Axis Travel: 0 to 31.49608 inch
• Z-Axis Travel: 1.181103 inch
• Rated Speed: 78.74015748031496 in/sec

Description: cost reduction. Bond wire is 200um for up to 20A current Larger source lead frame connection for wire bonding Package: PG-TDSON-8-4 Same thermal and electrical performance as a DPAK with the same die size. Exposed pad provides excellent thermal transfer (varies by die size) Two

• V_GS(off): 3 volts
• r_DS(on): 0.0122 ohms
• T_J: -55 to 175 C
• Features: Automotive, MOSFET, Other

Description: cost reduction. Bond wire is 200um for up to 20A current Larger source lead frame connection for wire bonding Package: PG-TDSON-8-4 Same thermal and electrical performance as a DPAK with the same die size. Exposed pad provides excellent thermal transfer (varies by die size) Two

• V_GS(off): 3 volts
• r_DS(on): 0.0155 ohms
• T_J: -55 to 175 C
• Features: Automotive, MOSFET, Other

Description: packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement. Innovation Center applications engineers develop your process in-house or devise a Research & Development

• Industry / Application: Aerospace / Avionics, Automotive, Electronics / Semiconductors, Instruments / Sensors, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech, Telecommunications
• Services: Design / Development, Low Volume Production, Testing / Inspection, Turnkey Product Manufacturing
• Features: East Asia / Pacific Only, North America, Other, Southwest US Only, United States Only
• Capabilities: Electronic Manufacturing, Semiconductor Foundry

Description: NextPower-S3 technology delivers 'superfast switching with soft body-diode recovery' Low QRR, QG and QGD for high efficiency, especially at higher switching frequencies Low spiking and ringing for low EMI designs High reliability clip bond and solder die attach Mini Power SO8 package; no

• MOSFET Operating Mode: Enhancement
• Features: MOSFET, Other