Semiconductor Die Bonder

Description: is essential in semiconductor packaging, where the bonding wire must be placed accurately on micro-sized pads.· In wire bonding, especially ultrasonic bonding, reducing vibration in the bonding tool is critical to achieve precise bonding. Applications Used

Description: RF-SOE Disk drives Large complex hybrids RF and microwave devices High frequency passive and active components MCM power connections Fine pitch devices Running stitch interconnects (die-to-die) Ribbon bonding Low profile wire bonds

• Automation: Automatic
• Type: Wedge Bonder

Description: structural integrity under high thermal and mechanical stress makes them ideal for precise, high-performance applications. Applications: Wire bonding, die attach, and molding in the semiconductor industry.

• Type: Wedge Bonder

Description: tip of EFO wands are polished base on over decade years special experience. So it make the spark consistent and the direction from the same point always. Application Die bonding process, Wire Bonding, flip-chip bonding and MEMS packaging , High-Precision Electronics such

• Automation: Automatic
• Type: Wedge Bonder

Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 17.22 to 66.67 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Unfilled
• Compound Type: Electrically Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following industries

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 22.22 to 106 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: BondSens - Platinum Temperature Sensors are manufactured according to DIN EN 60751 and have an operating temperature range of -50 °C to +150 °C. The miniaturized RTD is designed for automatic placement in high volume applications in DIE packages where long-term stability, a good

• Length: 0.0295 inch
• Nominal Resistance: 1000 R₀ @ 0° C
• Operating Temperature: -58 to 302 F
• Sensor Technology: Wire Wound

Description: Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Unfilled
• Compound Type: Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 12.78 to 15 µin/in-F
• Composition: Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures.

• Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 1.28E7 to 1.44E7 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum adhesive

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Features: Electrically Conductive

Description: PVIC ACE34030 electrically conductive die attach adhesive is designed for high reliability semiconductor or LED packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 35 to 147 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Indium Corporation’s “Power-Safe” NC-SMQ®75 is the world’s first and only solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach. The ultra-low flux residue, combined with a benign, low reactivity flux chemistry, enables power

• Approvals / Conformance: Other
• Form / Shape: Paste

Description: ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System, Filled
• Cure Type / Technology: Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 4.3

Description: Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die & lid attach material.Requires low heat assist for cure. Ideal for applications requiring low-heat curing.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Dielectric Constant (Relative Permittivity): 3.5 to 4.5

Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 26.67 to 58.89 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 26.67 to 112 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Ultra-low stress, thermally conductive die attach for high-power, exposed pad semiconductor applications. Product Overview ATROX® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility for stress-sensitive components.

• Compound Type: Electrically Conductive, Thermally Conductive
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
• Material Form: Die Bonding Adhesive / Compound

Description: current transfer within devices. Robust Bonding Strength Creates strong silver sinter bonds that enhance the reliability and lifespan of components, especially in power applications. Adaptability to High Power Densities Designed to support components with high power density, such as

• Industry: Electronics, Semiconductors / IC Packaging, Automotive
• Material Type: Die Bonding Adhesive / Compound, Grease / Paste

Description: A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages. Product Overview ATROX® 800HT2V: Earlier version of the 800HT2VX series, engineered for thermally demanding semiconductor die attach with good

• Cure Type / Technology: Thermosetting / Crosslinking
• Features: Electrically Conductive
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Die Bonding Adhesive / Compound

Description: Conductive die attach pastes offer excellent performance to meet today's high reliability standards. Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low

• Cure Type / Technology: Thermosetting / Crosslinking
• Features: Electrically Conductive
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Die Bonding Adhesive / Compound, Grease / Paste

Description: Wafer production technology requires extreme precision components, whether for reticle stages, wafer stages or imaging technologies. ZYGO is a leading supplier of stage positioning components, serving the semiconductor industry and emerging EUV technologies through multiple custom orders. Our

Description: 1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies. 1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner

Description: IEC 60749-34:2010 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases

Description: IEC 60749-34:2010 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases

Description: Dual Super S08 can replace multiple DPAKs for significant PCB area savings and system level cost reduction. Bond wire is 200um for up to 20A current Larger source lead frame connection for wire bonding Package: PG-TDSON-8-4 Same thermal and electrical

• Package Type: Other
• Packing Method: Tape Reel, Other
• Polarity: Other
• T_J: -55 to 175 C

Description: -service advanced packaging laboratories offering solutions for process development/optimiza tion, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement. Innovation Center applications engineers develop your process in-house or devise a

• Capabilities: Electronic Manufacturing, Semiconductor Foundry
• Industry Served: Aerospace / Avionics, Automotive, Electronics / Semiconductors, Instruments / Sensors, Medical / Health Care, Military / Defense, Pharmaceutical / Biotech, Telecommunications, Other
• Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only
• Services: Design / Development, Low Volume Production, Turnkey Product Manufacturing, Testing / Inspection

Description: High reliability clip bond and solder die attach Mini Power SO8 package; no glue, no wire bonds, qualified to 175 °C Exposed leads can be wave soldered; visual solder joint inspection and high quality solder joints Low parasitic inductance and resistance

• I_DSS: 50000 milliamps
• MOSFET Operating Mode: Enhancement
• P_D: 65000 milliwatts
• Package Type: Other

Description: LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material

• Coeff. of Thermal Expansion (CTE): 20 µin/in-F
• Features: Electrically Insulating / Dielectric
• Thermal Conductivity: 0.6000 W/m-K
• Viscosity: 10900 cP

Description: By spiral wrapping each successive layer slightly over the previous one, the tape fuses to itself over the component. Bonding only to itself, the permanent fusion begins within three minutes after contact. Once the amalgamation is cured, the protected area withstands exposure to

• Adhesive: Specialty / Other
• Backing: Rubber, Silicone
• Electrical Resistivity: 1.00E10 to 1.00E15 ohm-cm
• Performance Features: UV / Weather Resistant, Dielectric / Insulating, Permanent, Protective Tape, Thermally Insulating / Insulative

Description: low roughness ensuring ease of attachment and minimized thermal interface resistances Diamond is grown on 2� wafers that can be laser cut to any required size Flat, smooth diamond with Metallization solutions enabling die bonding, standard soldering and brazing

• Device: Passive Heat Sink
• Height: 0.1000 to 0.5000 mm
• Length: 1.5 to 30 mm
• Material: Mixed Material, Other Materials

Description: applications. The HTD Series utilizes thick film hybrid microcircuit technology that provides superior reliability in high temperature applications. Bare semiconductor die are integrated with passive components using thick film conductors on a ceramic substrate. Component attach and

• DC Input Voltage: 14 to 40 volts
• DC Output Current: 0.0 to 300 amps
• DC Output Power: 1.5 watts
• DC Output Voltage: 5 to 12 volts

Description: Dual Super S08 can replace multiple DPAKs for significant PCB area savings and system level cost reduction. Bond wire is 200um for up to 20A current Larger source lead frame connection for wire bonding Package: PG-TDSON-8-4 Same thermal and electrical

• Package Type: Other
• Polarity: Other
• Transistor Grade / Operating Range: Automotive
• Transistor Type: MOSFET

Description: TELICA, a cutting-edge multi-axes platform, is revolutionizing semiconductor back-end applications with its dual gantry architecture, offering unmatched accuracy and throughput for advanced die bonding applications and more. TELICA is a multi-axes platform designed for

• Actuation Type: Electrical
• Axis Configuration: X-Y-Z Axes
• Drive Specifications: Direct Drive, Other
• Features: Multi-position