Products & Services
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Supplier: Esprix Technologies
Description: Type: Automotive Flux - Brazing Aniline Hydrochloride d-Camphoric Acid Cyclohexylamine Hydrochloride Cyclohexylamine Hydrobromide DBD = 2,3–Dibromo–2-Butene - 1,4-Diol Dibromo-Styrene((1,2 -Dibromoethyl
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: A Flux for Every Brazing Need. Flux is critical to the brazing and soldering process because it minimizes the oxidation that may form on both the brazing filler metal and the materials being joined. Numerous formulations of flux are available for virtually all metal
- Fluxes & Cleaners: Brazing Flux
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Supplier: Waldom Electronics
Description: LIQUID TYPE 2 OZ US FLUID CAPACITY CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: LIQUID TYPE 16 OZ US FLUID CAPACITY CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: PASTE TYPE 2 OZ US FLUID CAPACITY STEEL METAL USED ON CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: PASTE TYPE MILKY WHITE PASTE COLOR 2 OZ FLUID CAPACITY 1.1 SPECIFIC GRAVITY GC[T] BRAND USED FOR WATER REMOVABLE, BASE TYPE ROSIN CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Indium Corporation’s new WF-9955 soldering flux is an updated version of Indium’s best-selling WF-9942, designed to conform to the more rigorous standards of J-STD-004B Type ORL0. It has no intentionally added halogens, no rosin, and exhibits exceptional hole fill as well as pin
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Indium Corporation’s new WF-9958 soldering flux is an updated version of Indium’s best-selling WF-9942, designed to conform to the more rigorous standards of J-STD-004B Type ORM0. It has no intentionally added halogens, no rosin, and exhibits exceptional hole fill as well as pin
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Mildly activated rosin flux-cored solder wire classified as Type ROL0 flux under IPC J-STD-004. Product Overview Kester 285 consists of high-quality, purified rosin combined with a synergistic blend of activating agents. This flux was formerly classified as
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: applications. While effective on many types of assemblies, it excels in providing excellent hole fill on high-density component assemblies. ALPHA EF-6808HF exhibits low bridging, icicles, and solder balls in both SnPb and Pb-free processes. The flux residues are uniform,
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: is classified as Type ROL0 flux under J-STD-004B specifications. Kester 268 is zero-halogen and halide-free with no intentional addition of bromine and chlorine, conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications. Low Occurrence of
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: DigiKey
Description: SRA #99-LF TYPE RMA ROSIN SOLDER
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: DigiKey
Description: SRA #99-LF TYPE RMA ROSIN SOLDER
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: DigiKey
Description: SRA #99-LF TYPE RMA ROSIN SOLDER
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: DigiKey
Description: SRA #99-LF TYPE RMA ROSIN SOLDER
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Pb and Pb-free applications Introduction WS-364 Interconnect Flux is a high viscosity paste-type flux designed for use in BGA bumping and board level attachment. It can also be used wherever a water-soluble flux with excellent cleanability is desired.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Halogen / Halide Free: Yes
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Supplier: Indium Corporation
Description: Suitable for Sn/Pb, Pb-Free, and high lead-containing applications Designed for Flip-Chip applications Introduction WS-366 Interconnect Flux is a high viscosity paste-type flux designed for use in BGA bumping and board level attachment. It can also be used wherever a
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Techsil Limited
Description: . Non-corrosive, non-hygroscopic, halide free and RoHS compliant. Product Benefits Superior fluxing ability Instant wetting After soldering, the rosin residue is non corrosive, non conducting, moisture resistant, and fungus resistant For precision application of rosin flux, in a
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Techsil Limited
Description: MG Chemicals 835 Rosin Flux contains a type RA rosin-activated flux, composed of pure white-water gum rosin, a unique solvent system and very effective activators. The superior fluxing remains consistent throughout the entire aeration process and provides fast wetting
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Chemtronics Circuitworks no clean flux is another quality product from Chemtronics. Additional, and potentially important, information was collected about this product: Flux Type: Lead Free
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Chemtronics Circuitworks no clean flux is another quality product from Chemtronics. Additional, and potentially important, information was collected about this product: Flux Type: Lead Free
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: ESAB Welding and Cutting Products
Description: Features Soldering flux used with Aquasafe solder for joining copper and dissimilar metals in drinking water lines. Flux performs to specification Fed O-F-506 Type 1, Form A. The optimum working temperature range is 200-600°F (93-315°C).
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: ESAB Welding and Cutting Products
Description: Features Clear liquid soldering flux particularly suited for corrosion resistant steels such as 316, 321, 347 and 430. Active to 430°F. Performs to Fed AA51145, Type II, Form B
- Fluxes & Cleaners: Brazing Flux
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Supplier: Accuris
Description: Flux - Soldering (Organic Type)
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Supplier: Accuris
Description: Flux, Solder (Activated Rosin Type)
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Supplier: RS Components, Ltd.
Description: Chisel tip marker provides exact delivery of flux to surface. Suitable for soldering applications where water soluble flux is required. Applies a neutral pH organic water soluble flux for rapid soldering. Chisel tip marker provides exact delivery of flux to
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Supplier: RS Components, Ltd.
Description: Pen for precise removal, repair and rework of surface mount devices and any soldering assembly application requiring additional flux. Fine control allows minimal flux application resulting in negligible post-soldering residue. Pens contain non-flammable flux with
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Supplier: ESAB Welding and Cutting Products
Description: Features Clear liquid general purpose soldering flux for use with all soft solders on stainless steels, copper alloys, gold, silver and galvanized steel. Active at 430°F. Performs to Fed AA51145, Type 1 Form B
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: RS Components, Ltd.
Description: A quick drying, (5 to 10 min at 20° C) mildly activated flux in a 200 ml aerosol for use when removing and replacing surface mount components. The application of spray flux to solder joints will aid reflow when heating to remove components. Can also be used as an anti-tarnish
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Supplier: RS Components, Ltd.
Description: Ideal for BGA rework applications requiring No-Clean Flux. Formulated for No-Clean applications. Syringe applicator provides exact delivery of flux to surface. Long tack time. Extended shelf life. Refrigeration not required. Noncorrosive, halide and halogen free. Meets IPC requirements
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Supplier: ESAB Welding and Cutting Products
Description: Features White powder flux for removing oxides of aluminum and zinc based alloys. Active to 700°F. Performs to AWS A5.31, Type FB1-A
- Approvals / Conformance: AWS
- Fluxes & Cleaners: Brazing Flux, Soldering Flux / Rosin, Welding Flux
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Supplier: Henkel Corporation - Electronics
Description: SnPb, Water WashSnPb water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time, greatly extended abandon times and good soldering activity over a wide range of reflow profile types
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Accuris
Description: Testing Method for Resin Type Soldering Flux
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Supplier: Nordson EFD
Description: for low-temperature and high-temperature reflow and leaded and lead-free alloys in all flux types and alloy particle sizes. Whether soldering electrical connections in recessed areas on PCBs or tabbing and stringing solar cells, EFD makes pastes that exceed soldering
- Approvals / Conformance: Other
- Form / Shape: Paste
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Description: Specifies a qualitative method for assessing the solubility in a selected solvent. The method applies to all fluxes of type 1, as defined in ISO 9454-1.
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Supplier: Henkel Corporation - Industrial
Description: surfaces finishes including immersion Ag and OSP Cu. Colorless residues for easy post-reflow inspection Suitable for fine pitch, high speed printing up to 200mm/s (6"/s) Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582. Halogen-free flux classification:
- Form / Shape: Paste
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Supplier: Henkel Corporation - Industrial
Description: medium to large boards and compatible with many Pb-free alloys. Options and Configurations Alloy: 90iSC, SAC0307, SAC305, SAC387 Particle Size: Type 3, 4, 4.5 (4A), 5 Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582
- Form / Shape: Paste
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Supplier: Henkel Corporation - Industrial
Description: surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. 4 hours between print abandon time even on small CSP apertures. Very low hot slump. Colorless residues for easy post-reflow inspection Suitable for fine pitch, high speed printing up to 150mm/s (6"/s) Halide free
- Form / Shape: Paste
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Supplier: Henkel Corporation - Industrial
Description: performance, allowing for very shiny solder joints. LOCTITE GC 10 is suitable for use with industry standard SAC alloys. Options and Configurations Alloy: 97SC (SAC305) Particle Size: Type 3, 4, 4.5 (4A), 5 Halogen-free flux: passes IC with
- Form / Shape: Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: requirements of QPL listing for Federal Specification QPL-571-28-89 for Type RA flux-cored solder wire. It is also appropriate for commercial electronic operations modeled after Military Specifications. These include applications in the computer, aerospace, telecommunications,
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Description: ISO 9455-16:2013 specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their
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preps surfaces before the main act (solder) takes the spotlight. Whether you are fixing a headphone jack or sealing a leaky pipe, flux helps remove hidden dirt. This dirt includes oxides and oils that can disrupt smooth connections. This guide breaks down flux types for real (read more)
Browse Welding, Brazing, and Soldering Equipment Datasheets for ODG (Origin Data Global) -
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
MacDermid Alpha Electronics Solutions introduces ALPHA® SF828-MBB. Designed for soldering small?surface areas of wire and delivering excellent?peel force and high machine cleanliness, this is our latest liquid flux for the photovoltaic market. ALPHA (read more)
Browse Fluxes Datasheets for MacDermid Alpha Electronics Solutions -
Ultra-Low voiding performance Excellent electromigration characteristics Good coalescence and wetting performance Excellent solder joint and flux residue cosmetics Zero-halogen, No halogens (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
using a solder containing lead. 2. MAKE SURE YOU HAVE THE RIGHT FLUX At Ambrell, we recommend using flux cored aluminum braze rings. However, the rule of thumb is to make sure that the recommended temperature for the flux you select is similar to the melting point of (read more)
Browse Induction Heaters Datasheets for Ambrell Induction Heating Solutions -
resistance, and thermal stability up to 572°F (300°C). With enhanced printability, aggressive adhesives, and multiple finish options including ESD-safe formats, Apex ensures barcode clarity and adhesion even under extreme stress. Third-party testing confirms 72% better flux solder (read more)
Browse Label Materials Datasheets for Polyonics -
equipment Process Control: Adjust soldering temperatures for lead-free solder (10–20°C higher than leaded solder). And don’t allow to the use of restricted substances in fluxes or cleaning agents. Equipment Cleaning: Clean the residues to prevent historical contamination (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
boards. Designed for use in logic-level applications. Sealed body construction prevents contact contamination and allows time- and money-saving automated soldering and cleaning. Molded-in, epoxy sealed, or ultrasonically welded terminals lock out flux, solvents, and other (read more)
Browse Toggle Switches Datasheets for NKK Switches -
Soldering iron Rosin core solder Flux Cotton swabs or brushes Isopropyl alcohol or flux remover Now that you have all the materials you’ll need, let’s get started! Prepare the components: You must (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
. These solvents effectively remove accumulated contaminants and residues from soldering fluxes that other solvents cannot dissolve. Offering a safer toxicity profile and being more environmentally friendly than traditional solvents, AMOLEA AS-300 and AS-300AT series cleaning agents are used (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc.
Conduct Research Top
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Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
This paper touches on identifying favorable flux properties, down-selecting low solids fluxes for lead-free selective wave soldering, the selective soldering process itself, and testing criteria. Topics reviewed will be the flux selection, optimizing the selective soldering process by varying
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Risk Mitigation in Hand Soldering
Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection, operator experience and skill, control
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Key Considerations for Implementing Solder Bearing Lead Applications
With conventional soldering processes, the two metal components to be joined are first brought into position and mechanically held in place. Then flux and solder are applied to the conjoined parts, typically by a dipping process. When the circuit is dipped into a flux pot, care must be taken
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Tech Brief: Recommendations for Soldering Terminal Leads to MOV Varistor Discs (.pdf)
to bring them to reflow temperature. Disc and terminal lead should be pressed together lightly during the whole soldering process to help expel flux residues and excess solder from the interface. Trapped flux residue can result in bubbling of the solder, which leaves voids between silver electrode
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No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience
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Voiding Performance with Modified SAC Alloys for Automotive Applications in BTC Assemblies
under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint, such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination, as well as profile and board
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Brazing a carbide to a stainless steel shaft for a gripper [MEC]
A three-turn helical coil is used to braze the carbide to the stainless steel shaft. A silver solder washer is placed over the post on the shaft, the carbide is placed on the washer and flux is applied...
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Fluorosolvent Cleaning Solutions vs. Traditional Metal Cleaning Solvents
Many metal parts and components need to be cleaned and degreased before they are assembled or shipped. All contaminants need to be removed, including dirt, oil, fingerprints, solder paste residue and electronics flux.
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Component Connection Failure Root Causes on ENIG PCBs
the finish, the bonding and soldering method, flux cleaning, reflow and curing, wire-bonding and any other operations that are used to apply components to the surface of circuit boards.
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Compliant Tail (Press-Fit) Contacts in Mil Circular Connectors (.pdf)
The commercial world has long utilized compliant pin technologies to insert connectors on to printed circuit boards. These connectors were designed for ease assembly and to reduce the need for fluxes required during soldering. The technology was typically confined to rectangular high-density
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Principles of Soldering
An alterna- tive classification of soldering flux types , de- vised by the International Organization for Stan- dardization, is given in Table 3.5.
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ZPRSO2004P103
An alternative classification of soldering flux types , devised by the International Organization for Standardization, is given in Table 3.5.
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Wafer-Level Chip-Scale Packaging
Certain manufacturing standards, such as those written by the IPC—Association Connecting Electronics Industries—require cleaning regardless of the solder flux type used to ensure a thoroughly clean board.
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Study on rapid thermal cycling by inducted heating for microstructure of single SnAgCu solder joint
SnAgCu solder balls were manually placed on the substrate before it was coated with soldering flux ( type : NC-559-UV).