Thixotropic Epoxy Adhesives

Description: 10-3005 NS and 10-3046 NS are two component fast curing epoxy adhesives. These high bond strength adhesives are 100% solids and therefore contain no solvents. 10-3005 NS and 10-3046 NS epoxy systems form tough bonds to metals, polyesters, glass, wood, ceramics, and other

• Use Temperature: -76 to 266 F
• Dielectric Strength: 419.99999999999983 kV/in
• Dielectric Constant (Relative Permittivity): 4
• Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates, Metal, Plastic, Wood / Wood Product

Description: 10-3001 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3001 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the

• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 30,000 psi
• Dielectric Strength: 550.0000000000008 kV/in
• Dielectric Constant (Relative Permittivity): 3.11

Description: Parker LORD® 310A-B Epoxy Adhesive is a two component, thixotropic epoxy system that is used for bonding rubber, plastics, urethanes, and metals. It is typically used for automotive body panels, bond disk drives, vibration damping mounts, and down-hole oil field

• Viscosity: 230,000 to 820,000 cP
• Tensile Strength (Break): 4,650 psi
• Elongation: 2 %
• Features: Epoxy (EP)

Description: Parker LORD® 310 Modified Thixotropic Epoxy Adhesive A/B Gray is a two component, thixotropic epoxy system that is used for bonding rubber, plastics, urethanes, and metals. It is typically used for automotive body panels, bond disk drives, vibration damping mounts,

• Viscosity: 230,000 to 820,000 cP
• Tensile Strength (Break): 4,650 psi
• Elongation: 2 %
• Features: Epoxy (EP)

Description: ADHESIVE, EPOXY, ONE PART, THIXOTROPIC

Description: 10-3797 is a one component, fast curing structural adhesive. This epoxy system is a non-sag thixotropic product that cures quickly at low temperatures. 10-3797 is a 100% solids system and therefore contains no solvents. This adhesive is a great choice for structural

• Tensile Strength (Break): 4,200 psi
• Features: Electrical Insulating / Dielectric, Epoxy (EP), Liquid, Unfilled
• Industry: Electronics, OEM / Industrial
• Cure / Technology: Single Component System, Thermosetting / Crosslinking

Description: 10-3037 is a thixotropic and general purpose 100% solids epoxy adhesive. This adhesive is easily applied and will not sag or drip. High tensile strength is developed in one day at room temperature.

• Tensile Strength (Break): 38,000 psi
• Dielectric Strength: 484.99999999999903 kV/in
• Dielectric Constant (Relative Permittivity): 0.1
• Substrate Compatibility: Ceramic / Glass, Metal, Wood / Wood Product

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera

• Viscosity: 11,000 to 20,000 cP
• Use Temperature: 662 F
• Coeff. of Thermal Expansion (CTE): 30 to 89.44444444444444 µin/in-F
• Substrate Compatibility: Ceramic / Glass

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Viscosity: 11,000 to 17,000 cP
• Use Temperature: 617 F
• Coeff. of Thermal Expansion (CTE): 23.88888888888889 to 128.33333333333334 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.21

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Viscosity: 11,000 to 20,000 cP
• Use Temperature: 662 F
• Coeff. of Thermal Expansion (CTE): 28.333333333333332 to 99.44444444444444 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.46

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Viscosity: 9,000 to 15,000 cP
• Use Temperature: 617 F
• Coeff. of Thermal Expansion (CTE): 23.88888888888889 to 128.33333333333334 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.21

Description: Henkel Loctite EA E-04 is a two component, thixotropic, toughened epoxy adhesive designed for bonding structural metal, glass, magnet, and plastics. 50 mL Cartridge.

• Applied Thickness / Gap Fill: 0.1968505 inch
• Viscosity: 77,500 cP
• Thermal Conductivity: 0.2 to 2 W/m-K
• Dielectric Strength: 300 to 450.00000000000006 kV/in

Description: Ther-O-Bond 1600 produces a stable, durable, high-impact bond, with good heat transfer characteristics. It is a thixotropic (smooth paste) thermally conductive epoxy system used for staking thermistors, diodes, resistors, integrated circuits and other heat sensitive components to

Description: ELANTAS PDG Sterling™ E A50 T-7B Epoxy Adhesive is a two component epoxy resin system. It is thixotropic for minimal flow, and heat or room temperature cure. 6g Kit.

• Viscosity: 500 to 700 cP
• Tensile Strength (Break): 175 to 2,000 psi
• Features: Epoxy (EP)
• Cure / Technology: Two Component System

Description: Master Bond EP5LTE-100 is a flowable, one part epoxy with a low coefficient of thermal expansion and a high Tg.

• Viscosity: 20,000 to 160,000 cP
• Use Temperature: -76 to 347 F
• Thermal Conductivity: 0.58 to 0.86 W/m-K
• Coeff. of Thermal Expansion (CTE): 4.444444444444445 to 6.666666666666666 µin/in-F

Description: Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling.

• Applied Thickness / Gap Fill: 0.001 to 0.003 inch
• Viscosity: 25,000 to 50,000 cP
• Use Temperature: -80 to 300 F
• Tensile Strength (Break): 100 to 200 psi

Description: It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured,

• Viscosity: 65,000 to 120,000 cP
• Use Temperature: -67 to 356 F
• Elongation: 4 %
• Substrate Compatibility: Composites, Metal

Description: INSTAbond® 811NT A higher viscosity, thixotropic, version of INSTAbond® 811. Excellent adhesion to most substrates. Offsets/Replaces: Huntsman Fastweld 10

• Features: Epoxy (EP)
• Cure / Technology: Two Component System

Description: Devcon 2 Ton epoxy is an extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, woods, concrete, glass etc. 2 Ton Epoxy is a general purpose material which dries to a clear product to achieve an extremely strong rigid bond

• Features: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: Devcon 2 Ton Epoxy is extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, wood, concrete, glass etc. General purpose. It dries clear to achieve an extremely strong rigid bond with excellent thixotropic and void filling

• Features: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: INSTAbond®A894 is a two component; ambient cure epoxy compound designed for structural aerospace metal to metal bonding applications, in particular, aircraft grade aluminum substrates (2024 and 7075) and titanium. Designed after the requirements of MMM-A-132 and MMM-A-134 military

• Features: Epoxy (EP)

Description: Thixotropic, heat-cured, industrial grade structural epoxy adhesive paste with tough, strong bonds with excellent peel resistance and impact strength. LOCTITE® EA E-214HP is a light gray, thixotropic, heat-cured, industrial grade structural epoxy adhesive

• Features: Epoxy (EP)
• Cure / Technology: Single Component System

Description: LOCTITE ABLESTIK 57C, Epoxy, Assembly LOCTITE® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the TDS for alternate cure schedules. Electrically conductive Thermally conductive

• Use Temperature: 76 to 248 F
• Thermal Conductivity: 1.75 W/m-K
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic
• Features: Epoxy (EP)

Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper

• Use Temperature: 221 to 500 F
• Thermal Conductivity: 1.03844088 to 1.38458784 W/m-K
• Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
• Tensile Strength (Break): 2,000 to 2,700 psi

Description: This epoxy is used to permanently attach test samples or temperature sensors to sample holders. It is a 100% solid, two component, low temperature curing, silver-filled epoxy which features very high electrical and thermal conductivity combined with excellent strength and

Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™

• Viscosity: 110,000 to 120,000 cP
• Use Temperature: 77 to 302 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other

Description: APPLICATIONS: · PCB Manufacture / Repair · EMI / RFI Shielding · Display Packaging / Bonding · Electronics Manufacture / Repair · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100

• Viscosity: 150,000 to 155,000 cP
• Use Temperature: 77 to 302 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other

Description: Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications.

• Applied Thickness / Gap Fill: 0.003 to 0.006 inch
• Viscosity: 35,000 to 95,000 cP
• Use Temperature: -100 to 350 F
• Thermal Conductivity: 0.72 to 1.44 W/m-K

Description: LOCTITE ABLESTIK NCA 2340, Acrylated Epoxy, Assembly, Dual Cure Adhesive LOCTITE® ABLESTIK NCA 2340 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This product is formulated to temporarily cure when exposed to UV light,

• Viscosity: 35,000 cP
• Coeff. of Thermal Expansion (CTE): 33.888888888888886 µin/in-F

Description: 3M™ Scotch-Weld™ Urethane Adhesive DP605 NS is a semi-rigid, non-sag, two-part urethane. 1:1 mix ratio, 5 minute work life and handling strength in 20 minutes. 3M™ Scotch-Weld™ EPX™ Plus II applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP605 NS has high viscosity for non-sag

• Thermal Conductivity: 0.1748042148 W/m-K
• Coeff. of Thermal Expansion (CTE): 67.22222222222221 to 121.66666666666666 µin/in-F
• Elongation: 100 %
• Dielectric Strength: 639.9999999999991 kV/in

Description: 1.1 This specification covers totally reactive epoxy resins supplied as liquids or solids which can be used for castings, coatings, tooling, potting, adhesives, or reinforced applications. The addition of hardeners in the proper proportions causes these resins to polymerize into

Description: TB2273D from ThreeBond is a thixotropic single component epoxy resin adhesive that has high temperature curing capabilities suitable for instant induction curing with HF-coils. After curing the hardened material has excellent electrical and mechanical properties such as good

• Cure / Technology: Thermosetting / Crosslinking

Description: Tuffbond® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Ceramic / Inorganic Cement, Encapsulating / Potting, Epoxy (EP), Specialty / Other

Description: (Known as ECCOBOND 285 ) LOCTITE ABLESTIK 285 is a highly filled, thermally conductive, thixotropic epoxy paste with low CTE.

• Industry: Electronics
• Cure / Technology: Room Temp. Cure / Vulcanizing, Two Component System
• Features: Specialty / Other

Description: Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured material is flame retardant. Meets the flammability requirements of F.A.R. 25.853 (a).

• Use Temperature: -67 to 212 F
• Industry: Aerospace, OEM / Industrial
• Features: Epoxy (EP), Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Grease / Paste, Leveling / Filling Compound, Other
• Cure / Technology: Single Component System, Thermosetting / Crosslinking