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Supplier: Epoxies Etc...
Description: 10-3001 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3001 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.11
- Dielectric Strength: 550 kV/in
- Dissimilar Substrates: Yes
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera
- Coeff. of Thermal Expansion (CTE): 30 to 89.44 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Industry: Medical / Food (Sanitary / FDA), Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
- Substrate / Material Compatibility: Ceramic / Glass
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Coeff. of Thermal Expansion (CTE): 23.89 to 128 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.21
- Industry: Electronics, Optical Grade / Material, Photonics / Optoelectronics
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Coeff. of Thermal Expansion (CTE): 23.89 to 128 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.21
- Industry: Electronics, Medical / Food (Sanitary / FDA), Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Coeff. of Thermal Expansion (CTE): 23.89 to 128 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.21
- Industry: Optical Grade / Material, Photonics / Optoelectronics
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Supplier: Epoxies Etc...
Description: 10-3005 NS and 10-3046 NS are two component fast curing epoxy adhesives. These high bond strength adhesives are 100% solids and therefore contain no solvents. 10-3005 NS and 10-3046 NS epoxy systems form tough bonds to metals, polyesters, glass, wood, ceramics, and other
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4
- Dielectric Strength: 420 kV/in
- Dissimilar Substrates: Yes
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Supplier: Ellsworth Adhesives
Description: Parker LORD® 310 Modified Thixotropic Epoxy Adhesive A/B Gray is a two component, thixotropic epoxy system that is used for bonding rubber, plastics, urethanes, and metals. It is typically used for automotive body panels, bond disk drives, vibration damping mounts,
- Cure Type / Technology: Two Component System
- Elongation: 2 %
- Tensile Strength (Break): 4650 psi
- Viscosity: 230000 to 820000 cP
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Supplier: Ellsworth Adhesives
Description: Parker LORD® 310A-B Epoxy Adhesive is a two component, thixotropic epoxy system that is used for bonding rubber, plastics, urethanes, and metals. It is typically used for automotive body panels, bond disk drives, vibration damping mounts, and down-hole oil field
- Cure Type / Technology: Two Component System
- Elongation: 2 %
- Tensile Strength (Break): 4650 psi
- Viscosity: 230000 to 820000 cP
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Supplier: Accuris
Description: ADHESIVE, EPOXY, ONE PART, THIXOTROPIC
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Description: It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured,
- Cure Type / Technology: Single Component System, Specialty / Other
- Elongation: 4 %
- Substrate / Material Compatibility: Composites, Metal
- Use Temperature: -67 to 356 F
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Supplier: Epoxies Etc...
Description: 10-3037 is a thixotropic and general purpose 100% solids epoxy adhesive. This adhesive is easily applied and will not sag or drip. High tensile strength is developed in one day at room temperature.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 0.1000
- Dielectric Strength: 485 kV/in
- Features: Electrical Insulating / Dielectric
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Supplier: Master Bond, Inc.
Description: Master Bond EP5LTE-100 is a flowable, one part epoxy with a low coefficient of thermal expansion and a high Tg.
- Coeff. of Thermal Expansion (CTE): 4.44 to 6.67 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Elongation: 1 %
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Supplier: Epoxies Etc...
Description: 10-3797 is a one component, fast curing structural adhesive. This epoxy system is a non-sag thixotropic product that cures quickly at low temperatures. 10-3797 is a 100% solids system and therefore contains no solvents. This adhesive is a great choice for structural
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric
- Industry: Electronics, OEM / Industrial
- Tensile Strength (Break): 4200 psi
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Supplier: Master Bond, Inc.
Description: Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling.
- Applied Thickness / Gap Fill: 1.00E-3 to 0.0030 inch
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Dielectric Constant (Relative Permittivity): 4.7
- Dissimilar Substrates: Yes
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA E-04 is a two component, thixotropic, toughened epoxy adhesive designed for bonding structural metal, glass, magnet, and plastics. 50 mL Cartridge.
- Applied Thickness / Gap Fill: 0.1969 inch
- Cure Type / Technology: Two Component System
- Dielectric Strength: 300 to 450 kV/in
- Thermal Conductivity: 0.2000 to 2 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: Thixotropic, heat-cured, industrial grade structural epoxy adhesive paste with tough, strong bonds with excellent peel resistance and impact strength. LOCTITE® EA E-214HP is a light gray, thixotropic, heat-cured, industrial grade structural epoxy adhesive
- Cure Type / Technology: Single Component System
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Supplier: GS Polymers, Inc.
Description: One part, thixotropic adhesive, chemical resistance, heat cure
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Filled
- Industry: OEM / Industrial
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 57C, Epoxy, Assembly LOCTITE® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the TDS for alternate cure schedules. Electrically conductive Thermally conductive
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Thermal Conductivity: 1.75 W/m-K
- Use Temperature: 76 to 248 F
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA 0151 is a two component, thixotropic epoxy paste adhesive that has a long pot life and can either cure at room temperature or with heat. 2.6 lb Kit.
- Cure Type / Technology: Two Component System
- Dielectric Strength: 1080 kV/in
- Elongation: 2.4 %
- Industry: Photonics / Optoelectronics
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Paper / Paperboard, Plastic, Rubber / Elastomer, Wood / Wood Product
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced stress
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Viscosity: 247500 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 83CJ, Epoxy, Assembly LOCTITE® ABLESTIK 83CJ adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures. LOCTITE ABLESTIK
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: GS Polymers, Inc.
Description: Two part, 1:1, general purpose adhesive, thixotropic and fast curing
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dissimilar Substrates: Yes
- Industry: OEM / Industrial
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Paper / Paperboard, Porous Surfaces
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Supplier: Techsil Limited
Description: thixotropic and void filling properties. Devcon 2 Ton Epoxy is 100% reactive and contains no solvents, its adhesive bond is resistant to weathering, solvents and wide variations in temperature. You can bond or pot electronic components and assemblies, and this product is very
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: Devcon 2 Ton Epoxy is extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, wood, concrete, glass etc. General purpose. It dries clear to achieve an extremely strong rigid bond with excellent thixotropic and void filling
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: ITW Devcon 1 minute epoxy is a super-fast general purpose thixotropic epoxy adhesive for applications requiring a fast fix! This clear, quick curing formula is excellent for bonding metals, fiberglass, and ceramics. It works at a lightning fast speed and is perfect for
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 811NT A higher viscosity, thixotropic, version of INSTAbond® 811. Excellent adhesion to most substrates. Offsets/Replaces: Huntsman Fastweld 10
- Cure Type / Technology: Two Component System
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 302 F
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Supplier: ACCRAbond, Inc.
Description: INSTAbond®A894 is a two component; ambient cure epoxy compound designed for structural aerospace metal to metal bonding applications, in particular, aircraft grade aluminum substrates (2024 and 7075) and titanium. Designed after the requirements of MMM-A-132 and MMM-A-134 military
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Lake Shore Cryotronics, Inc.
Description: This epoxy is used to permanently attach test samples or temperature sensors to sample holders. It is a 100% solid, two component, low temperature curing, silver-filled epoxy which features very high electrical and thermal conductivity combined with excellent strength and
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Supplier: Hernon Manufacturing, Inc.
Description: Tuffbond® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line
- Features: Encapsulating / Potting
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial
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Description: Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured material is flame retardant. Meets the flammability requirements of F.A.R. 25.853 (a).
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Flame Retardant (e.g. UL 94 Rated), Leveling / Filling Compound
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Other
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Supplier: RS Components, Ltd.
Description: Resistance properties:- ,Chemical - Good,Heat - Good,Water - Good,Impact - Good Colour - Beige/Neutral. Thixotropic with good gap filling properties. Non sagging up to 10mm thickness. Ideal for bonding dissimilar substrates Material Compatibility = Ferrous Metal, Glass Fibre Reinforced
- Use Temperature: 149 to 212 F
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Description: 3M™ Scotch-Weld™ Urethane Adhesive DP605 NS is a semi-rigid, non-sag, two-part urethane. 1:1 mix ratio, 5 minute work life and handling strength in 20 minutes. 3M™ Scotch-Weld™ EPX™ Plus II applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP605 NS has
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 67.22 to 122 µin/in-F
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.1
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FXSG™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG™ is well suited for bonding of dissimilar
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc. -
variety of chemicals, particularly to water, oil, fuels and solvents. Supreme 12AOHT-LO is a thixotropic paste with a smooth consistency that is easy to handle. As a single component epoxy, it doesn’t require any mixing and offers an “unlimited” working life at room (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc.
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Structural Composite Materials
Two-part high-viscosity thixotropic epoxy adhesives are normally used for these types of repairs.
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Structural adhesives—characteristics and application
The thixotropic epoxy adhesive was in- jected into the bond interface by means of a series of holes equally spaced around the cylinder.
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New Approaches to Building Pathology and Durability
…had loss of greater than 5 % nominal section; • Treatment of armor with zinc-rich epoxy two component polyamide cured to provide cathodic protection to the carbon steel; • Application of adherence to structural thixotropic epoxy adhesive slowly picks bridge; •…
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Materials and Joints in Timber Structures
The former adhesive is a medium viscosity epoxy resin for the impregnation of FRP sheets, whereas the last is a thixotropic epoxy adhesive currently used in the restoration of timber structural elements.
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Wireless Sensor Networks for Developing Countries
The segments are joined together with high strength 2-part thixotropic epoxy adhesive to eliminate seepage and to provide significant strength while in tension from lateral force.
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Civil Engineering, Architecture and Sustainable Infrastructure II
The epoxy based adhesive consisted of two parts (i.e., epoxy resin binder and thixotropic epoxy adhesive ) which were mixed in the ratio of 3:1.
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Advances in Civil Structures
The epoxy based adhesive used in the wet lay-up technique consisted of two parts (i.e. epoxy resin binder and thixotropic epoxy adhesive ) which were mixed in the ratio of 3:1.
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Topics in Modal Analysis II, Volume 6
Two-part thixotropic epoxy adhesives were used in this experiment.
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A method for reducing encapsulation stress to ferrite pot cores
The core halves are bonded to each other, using a thixotropic epoxy adhesive , and to a pre-molded Diallyl Phthalate (DAP) contact pin assembly using the sealing compound polysulfide.