Products & Services
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Description: One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.
- Features: Electronics, Specialty / Other
- Chemical System: Epoxy (EP)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's
- Viscosity: 5,000 cP
- Coeff. of Thermal Expansion (CTE): 19.444444444444443 µin/in-F
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to protect assembled chip packages on printed circuit boards. It features a high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), providing a high-reliability solution.
- Dielectric Strength: 533.4000000000011 kV/in
- Dielectric Constant (Relative Permittivity): 4.67
- Industry: Automotive, Electronics, Semiconductors / IC Packaging
- Features: Thermally Conductive
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Supplier: Protavic America, Inc.
Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high
- Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric Material, Gap Filling Sealant / FIP Gasket, Liquid, Specialty / Other, Thermal Insulation / Heat Insulating, Unfilled
- Industry: Electrical Power / HV, Electronics, OEM / Industrial, Semiconductors / IC Packaging
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
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Encapsulants and Potting Compounds - LOCTITE ECCOBOND UF 2800A reworkable underfill -- 8802603663361Supplier: Henkel Corporation - Electronics
Description: LOCTITE ECCOBOND UF 2800A reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is amber in color. It is only available for purchase and use in China
- Industry: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
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Encapsulants and Potting Compounds - LOCTITE ECCOBOND UF 2800B reworkable underfill -- 8802603728897Supplier: Henkel Corporation - Electronics
Description: LOCTITE ECCOBOND UF 2800B reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is black in color. It is only available for purchase and use in China
- Industry: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
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Supplier: Newark, An Avnet Company
Description: 3517 EPOXY UNDERFILL, 30CC SYRINGE
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: IPC International, Inc.
Description: DESCRIPTION "Underfill Selection and the Impact on Reliability" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011 by Dr. Brian Toleno, director of technical services and applications for Henkel. The author defines underfill and
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Supplier: Newark, An Avnet Company
Description: 3549 - REWORKABLE UNDERFILL - 30ML - IDH# 910487
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Supplier: Master Bond, Inc.
Description: Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
- Applied Thickness / Gap Fill: 0.005 to 0.015 inch
- Use Temperature: -60 to 350 F
- Thermal Conductivity: 1.3 to 1.44 W/m-K
- Coeff. of Thermal Expansion (CTE): 12,222,222.222222222 to 13,333,333.333333332 µin/in-F
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL UF3800 reworkable underfill ) A high reliability, good reworkability, room temperature dispensable underfill compatible with most common solder pastes.
- Coeff. of Thermal Expansion (CTE): 28.88888888888889 µin/in-F
- Viscosity: 375 cP
- Industry: Electronics (PCB / SMT Assembly)
- Chemical System: Epoxy (EP)
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Supplier: Master Bond, Inc.
Description: Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and
- Viscosity: 10,000 to 40,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 1.3 to 1.44 W/m-K
- Tensile Strength (Break): 5,000 to 7,000 psi
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Supplier: Master Bond, Inc.
Description: Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.
- Viscosity: 5,000 to 15,000 cP
- Use Temperature: -60 to 250 F
- Tensile Strength (Break): 5,000 to 7,000 psi
- Dielectric Strength: 450.00000000000006 kV/in
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Supplier: Henkel Corporation - Electronics
Description: (Known as ECCOBOND UF 3130 underfill ) LOCTITE ECCOBOND UF 3130 is designed for use in heat sensitive optoelectronic components and other microelectronic devices.
- Industry: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
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Description: LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: IPC International, Inc.
Description: This document provides users of underfill material with guidance in selecting and evaluating underfill material. Underfill material is used to increase reliability of electronic devices by two methods: alleviate CTE mismatch (between the electronic package and the assembly
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Supplier: Accuris
Description: JOINT INDUSTRY STANDARD Selection and Application of Board Level Underfill Materials
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Supplier: Accuris
Description: JOINT INDUSTRY STANDARD Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
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Supplier: Newark, An Avnet Company
Description: FAST FLOW,LOW TEMPERATURE CURE,REWORKABLE EPOXY UNDERFILL FOR BGA AND CSP DEVICES. HIGH ADHES AND RIGID CIRCUIT SUBSTRATES - 10 CC ML
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Description: Classic underfill, ultra-low viscosity suitable for most underfill applications.
- Viscosity: 360 cP
- Features: Electronics, Encapsulant / Potting Compound, Specialty / Other
- Chemical System: Epoxy (EP)
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Supplier: DigiKey
Description: 3593 NON REWORKABLE UNDERFILL
- Chemical System: Epoxy (EP)
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Supplier: Protavic America, Inc.
Description: Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications.
- Viscosity: 25,000 cP
- Use Temperature: -55 to 200 F
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 to 55.55555555555556 µin/in-F
- Tensile Strength (Break): 3,000 psi
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Supplier: Indium Corporation
Description: TACFlux® 26S is a NIA halogen-free, no-clean rework flux, which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3517M, Epoxy, Underfill LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications. One component - requires no mixing Reworkable Low halogen content
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 µin/in-F
- Viscosity: 2,600 cP
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Supplier: Indium Corporation
Description: dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.
- Features: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Protavic America, Inc.
Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
- Use Temperature: -55 to 120 F
- Thermal Conductivity: 0.5 to 1 W/m-K
- Tensile Strength (Break): 2,000 psi
- Dielectric Constant (Relative Permittivity): 4 to 5
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3912 underfill is specially designed for flip chip device applications. One component Halogen free Snap curable Fast flow High Tg Easy rework High fracture toughness Excellent thermal cycle
- Coeff. of Thermal Expansion (CTE): 15.555555555555555 µin/in-F
- Viscosity: 3,500 cP
- Chemical System: Epoxy (EP)
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Supplier: American Welding Society (AWS)
Description: 24 x 36 - This poster, the third in the "Weld Discontinuities" series, features illustrated examples and descriptions for slag inclusions, incomplete fusion, incomplete joint penetration, undercut, underfill, and overlap.
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND UF 3800, Epoxy, Underfill LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for
- Joining Process / Product Form: Paste
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Description: Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional protective film, semiconductor protective film.
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe.
- Viscosity: 4,000 cP
- Thermal Conductivity: 0.42 W/m-K
- Dielectric Strength: 1,066.8000000000022 kV/in
- Features: Encapsulating / Potting
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Supplier: Master Bond, Inc.
Description: Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding, coating or
- Applied Thickness / Gap Fill: 0.002 to 0.006 inch
- Viscosity: 150 to 300 cP
- Use Temperature: -452.47 to 400 F
- Coeff. of Thermal Expansion (CTE): 22,222,222.22222222 to 25,000,000 µin/in-F
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passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications. As a single component system, EP3UF is easy to handle with an “unlimited” working life at room temperature and fast cures at temperatures as low as (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low (read more)
Browse Encapsulants and Potting Compounds Datasheets for MacDermid Alpha Electronics Solutions -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
stacking Staking and underfill to secure capacitors and absorb vibration energy Low ionic content and low outgassing to support mission reliability Learn more about Dymax 9773 (read more)
Browse UV Curing Adhesives Datasheets for Dymax -
alternative to underfill for many applications. Key technical advantages: Fast UV/Visible cure for high-throughput assembly See-Cure technology: dispenses blue, cures clear for visual confirmation Highly thixotropic to minimize component movement (read more)
Browse UV Curing Adhesives Datasheets for Dymax -
: Rapid Detection: Capable of counting thousands of tablets per minute, ideal for large-scale production lines. Accuracy >99.9%: Minimizes underfills or overfills, ensuring compliance with regulatory standards (e.g., FDA 21 CFR Part 211 (read more)
Browse Light Curtains Datasheets for Intellisense Microelectronics Ltd. -
debris Improve quality through better weigh sorting of under-filled or underweight capsules and parts Reduce compressed air usage vs open nozzles Lower cost as compared to fans or blowers Application mobility, compared to large fans and blowers (read more)
Browse Pressure Intensifiers and Boosters Datasheets for Vortec -
Vision/Detection Systems – As bottles move down the line, they need to be properly dried so that Vision and Detection Systems can properly detect any issues, such as underfilled bottles or crooked caps. The Paxton Products (read more)
Browse Manifolds and Manifold Systems Datasheets for Paxton Products, an ITW company -
level and reject any under-fills. Cans then are single-filed and returned to an upright position to pass under another bank of compressed air nozzles to ensure that the tops are dry before the multi-packaging step. A second PowerDry will replace this compressed air unit. In addition, the first (read more)
Browse Process Dryers Datasheets for Paxton Products, an ITW company
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Using PCB smt underfill epoxy and bga underfill material for different applications
Underfill applications make use of different adhesive compounds to fill up gaps that exist between PCBs and microchip packages. This is very important because different chip packages, like chip scale packages and ball grid arrays, have to be surface mounted.
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Epoxy Underfill Chip Level Adhesives
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. One-component epoxy resin adhesive
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The Benefits And Applications Of Underfill Epoxy Encapsulants In Electronics
Underfill epoxy has become an essential component in ensuring the reliability and durability of electronic devices. This adhesive material is used to fill the gap between a microchip and its substrate, preventing mechanical stress and damage, and protecting against moisture and environmental
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Best Top 10 BGA Underfill Epoxy Adhesives And Underfill Encapsulants Manufacturers In China
Underfill epoxy adhesives offer good protection against ionic residues and unwanted substances. One of the key things that the underfill helps to achieve is better adhesion of components onto the substrate and shock protection. Today, the formulations include no flow underfills. This eliminates
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How to use a smt underfill epoxy adhesive in various applications
Underfill is a liquid polymer type applied to PCBs after going through a reflow process. After the underfill is placed, it is then allowed to cure, encapsulating the bottom side of a chip covering fragile interconnected pads between the board's top side and the chip's bottom side. Underfills offers
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An Overview Of BGA Underfill Process And Non Conductive Via Fill
Flip chip packaging exposes chips to mechanical stress because of extensive coefficient thermal expansion mismatch between the silicon chips and the substrate. When there is a high thermal load, the mismatch stresses the chips, thus making reliability a concern. Manufacturers use single underfill
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Best bga underfill epoxy adhesive glue solutions for excellent surface mount SMT component performance
There are many challenges that manufacturers face in different industries. These issues can only be handled by the use of underfill adhesives. There are many partial or full underfill solutions that allow fast cure and flowability at room temperature. It is important to find the best underfill
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No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in
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Advanced Flip Chip Packaging
In support of the growth of flip chip, companion technologies such as substrate, underfill , interconnect, design, simulation…
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Area Array Packaging Handbook: Manufacturing and Assembly > NEXT-GENERATION FLIP CHIP MATERIALS AND PROCESSING
Processing steps that could be eliminated are flux application, flux residue cleaning, underfill flow, underfill fillet processing…
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Materials for Advanced Packaging
Latest advances in several key packaging materials including lead-free solders, flip chip underfills , epoxy molding compounds…
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Moisture Sensitivity of Plastic Packages of IC Devices
From mate- rial perspectives, epoxy molding compounds, die attach adhesives, and underfill materials are all covered in…
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Wafer Level Underfill .
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Microvias: For Low Cost, High Density Interconnects > Assembly of Flip Chip on PCB/Substrate
…10 – 6/ºC) and the epoxy PCB (18.5 × 10 – 6/ºC), underfill encapsulant is usually…
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A Novel Three Dimensional Wafer Level Chip Scale Packaging
Technology-Manufacturing Process Development and Reliability Characterizations
…3D Packaging, Die to Wafer Integration, Silicon on Silicon, Pb-free Reflow, Capillary Underfill , No Flow Underfill…
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LEAD-FREE ASSEMBLY AND RELIABILITY OF CHIP SCALE
PACKAGES AND 01005 COMPONENTS
Underfill materials are often used to improve the reliability of a variety of electronic components.