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  • Void Reduction during Low Pressure Lamination of Electronic Assemblies
    the laminate in the absence of air, i.e., under vacuum. Differential vacuum pressure lamination (DVPL) is an alternative to the standard vacuum bag process widely utilized today for lamination of populated electronic assemblies. It is shown that the DVPL process dramatically reduces void content
  • Dielectric Materials for Use in Radomes
    as relative permittivity ( e ) or D/K, the dielectric constant represents a material's ability to store electrostatic energy in an applied electric field. It is a dimensionless number representing the ratio of the permittivity of a material relative to that of a vacuum (evacuum = 1.0). Low relative

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