Products & Services
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Supplier: Saint-Gobain Surface Conditioning Group
Description: AmberClean™ SWR Aqueous Silicon Wafer Cleaner AmberClean™ SWR is a biodegradable, aqueous cleaner which does not contain volatile organic compounds (VOCs). It is specifically formulated to flush and disperse ceramic, silicon and other lapping and slicing fines from substrate surfaces.
- Temperature (As Used): 150 F
- Concentration (As Used, by Volume): 1 to 5 %
- Type: Aerosol / Contact Cleaner, Alkaline Cleaner (11 to 12.5 pH), Aqueous / Water-based, Cleaner / Cleaning Agent
- Features: Biodegradable, VOC Compliant
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Supplier: Shenzhen Jewellok Technology Co., Ltd.
Description: Chemical Delivery Modules for Automated Blending and Precise Dilution in Modern Wafer Cleaning Applications Shenzhen Jewellok Technology specializes in Ultra-High Purity (UHP) liquid chemical delivery systems tailored for the semiconductor and photovoltaic industries. These systems are
- Body Material: Stainless Steel
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Supplier: Palomar Technologies, Inc
Description: include flip chip solder reflow, solder lid sealing, wafer to wafer bonding using solder, glass, adhesives and direct fusion. Wafer Aligner Capabilities Alignment of wafers of to 8 inch (200mm diameter) Fully adjustable stages for positions over wafer fiducials
- Maximum Wafer / Part Size: 100 to 200 mm
- Technology: Optical / Imaging System
- Features: Other
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Supplier: Technic, Inc.
Description: Low Cost, Easy to Use, Free Rinsing, Will Not Etch / Ideal for Thin Copper Coatings.
- Type: Cleaner / Cleaning Agent
- Industry Applications: Semiconductor Wafer / Cleanroom
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Supplier: Nikon Metrology
Description: The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors. Improved
- Maximum Wafer / Part Size: 200 mm
- Measurements: Defects / ADC
- Mounting / Loading: Floor Mounted / Stand-alone
- Features: Non-contact, Non-destructive, Other
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Supplier: Technic, Inc.
Description: A specialty cleaner that stops electroless nickel from depositing in non-plated through holes (NPTH). When electroless copper is utilized for metallization it can leave Pd activator residues behind in NPTH. When processed through ENIG, this Pd residue can plate with electroless nickel. TechniClean
- Type: Cleaner / Cleaning Agent
- Industry Applications: Electrical / Electronics, Semiconductor Wafer / Cleanroom
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Description: HTOT has a full wafering line and can deliver wafer sustrates or completely finished wafers to the specifications outlined below. All wafers are produced from low stress high purity, LED grade HEM grown sapphire with a uniform crystalline structure, free of subgrains, bubbles
- Width / O.D.: 1.968505 inch
- Thickness / Wall Thickness: 0.016929143 to 0.025590565 inch
- Applications: Abrasive / Erosive Wear Protection, Optics / Optical Grade, Wear Parts / Tooling
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Supplier: Drytek Distribution
Description: Product Features: 300mm wafer size Box cover and box base are made of PC. Top cushion and bottom cushion are made of PBT. Compatialbe top and bottom cushion ensures operator correct handling Innovative wafer suspension designs minimizes wafer rotation and particle generation
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Supplier: Technic, Inc.
Description: Low Cost, High Copper Capacity Compared to Generic Sodium Persulfate.
- Type: Cleaner / Cleaning Agent
- Industry Applications: Semiconductor Wafer / Cleanroom
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Supplier: Smith & Loveless, Inc.
Description: Smith & Loveless has revolutionized wafer check valve maintenance with the new RAPIDJACK™. Clearing wafer check valves of stringy materials and obstructions will now take 15 minutes or less with the new RAPIDJACK™. Today’s consumer products promote flushing more and more things down
- Valve Size: 5 inch
- Number of Ports/Ways: 2
- Valve Type: Check Valves
- Features: Wafer / Split Disc Check Valves
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Supplier: CoorsTek
Description: CoorsTek provides wafer boats, pedestals, and custom wafer carriers for both vertical / column and horizontal configurations. Advanced ceramics deliver excellent thermal resistance and plasma durability while mitigating particles and contaminants. Semiconductor-grade silicon carbide
- Material Type: Carbide Materials, Silicon Carbide
- Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
- Features: Other
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Supplier: Rigaku Corporation
Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant distribution over the
- Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
- Measurements: Area Mapping, Particle Contamination
- Mounting / Loading: Floor Mounted / Stand-alone
- Form Factor: Monitor / Instrument
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Supplier: CoorsTek
Description: ideal for microscopic patterning from wafers to large flat panel displays (FPD). Ceramic Components for Lithography & Wafer Inspection Perfect for next-generation lithography and wafer-handling applications, our ultra-pure ceramic components ensure minimal contamination and
- Applications: Chemical / Materials Processing
- Features: Dielectric / Electrical Insulation, Other
- Shape / Form: Wafer Carrier / Holder
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Supplier: JST Manufacturing, Inc.
Description: JST's 300 CLV Cleaner and Stripping Tool is a completely self contained, dry to dry unit designed for cleaning and stripping wafers, optics, disk drives, flat panels and other delicate parts. Just place the product into the dry tank, process through either single or multiple chemical
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Supplier: CoorsTek
Description: LITHOGRAPHY & WAFER INSPECTION COMPONENTS Resistant to chemical attack and thermally stable, our high-purity ceramic components are ideal for lithography processing, wafer handling (low contamination), and wafer inspection (extreme durability and hardness, dimensionally stable).
- Material Type: Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide
- Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
- Features: Other
- Applications: Wear Parts / Tooling
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Supplier: Rigaku Corporation
Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Integrated VPD capability enables automatic VPD preparation of one wafer while a TXRF
- Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
- Measurements: Area Mapping, Particle Contamination
- Mounting / Loading: Floor Mounted / Stand-alone
- Form Factor: Monitor / Instrument
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Supplier: Indium Corporation
Description: Indium Corporation's Wafer Pastes are a nitrogen refl ow, no-clean solder pastes using Type 5 and Type 6 powder, which are specifi cally formulated for fl ip-chip attachment and CSP and wafer bumping applications. The fl ux is formulated so that it is applicable to Sn/Ag and Sn/Ag/ Cu
- Features: Other
- Joining Process / Product Form: Paste
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: JST Manufacturing, Inc.
Description: JST's Dessicators, Passthrous, and Cabinets provide a particle-free, static-safe, low-humidity environment for the transport of sensitive materials. Specialized designs and materials provide secure transport of wafer boxes, reticles and other critical parts as well as acids and corrosives.
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Supplier: Robuster Quartz
Description: Quartz boat is a loader which can be inserted by silicon wafer. So it is applied in semiconductor area. The cleaning process for quartz boat is very strictly. The boat should be dipped in concentration of 4-5% HF solutions keeped for 4 hours. Then soaked in DI water for 1 hours. Quartz
- Shape / Form: Fabricated / Custom Shape
- Glass Type: Quartz
- Features: Specialty / Other
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Supplier: Saint-Gobain Surface Conditioning Group
Description: AmberClean™ SC14 is a high purity aqueous cleaner formulated with a unique inhibitor which protects against corrosion of reaactive alloys of cobalt, iron, nickel and copper. It was developed using advanced cyclic polarization testing on blanket metal alloy wafers. AmberClean™ SC14 also excels
- Type: Aerosol / Contact Cleaner, Aqueous / Water-based, Cleaner / Cleaning Agent
- Features: Biodegradable, Non-toxic, Other
- Industry Applications: Electrical / Electronics, Semiconductor Wafer / Cleanroom
- Full Strength Use: Full Strength (Undiluted) Use
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Supplier: Indium Corporation
Description: Features Water-soluble Viscosity suitable for 150–300mm wafers No residue Halide-free Promotes uniform solder bump formation Suitable for SnPb and Pb-free solder applications Introduction Wafer Flux WS-3543 is a low viscosity semiconductor-grade flux, specifically optimized for
- Features: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: U.S. Plastic Corporation
Description: Praher K6 thermoplastic wafer check valves are available in sizes 2" though 8" with maximum operating pressure of 150 psi at 72 F, non-shock. The valve does not require a spacer for full disc opening performance in SCH 80 pipes. Valves have a single disc design suitable for horizontal and
- Valve Size: 8 inch
- Valve Type: Check Valves
- Primary Material: PVC
- Features: Wafer / Split Disc Check Valves
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Supplier: 3X Ceramic Parts Company Limited
Description: φ150mm ) silicone wafer , thickness 675 um . They want this part in 99% alumina ceramic . We don’t have the standard wafer boats for customer wafer size , but we custom made it . Before this projects , we have made a 99% alumina horizontal wafer boat , it is for
- Material Type: Carbide Materials, Silicon Carbide
- Shape / Form: Fabricated / Custom Shape
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Supplier: Infinity Fluids Corp.
Description: All drying applications Wafer processing Metal finishing Solvent drying Explosion proof and ATEX constructions
- AC Voltage Required: 12 to 600 volts
- kWatts: 0.1 to 250 kW
- Heating Capacity: 0.1 to 250 kW
- Heater Type: Air Heater, Circulation Heater, Explosion Proof Heater, Inline Heater
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Supplier: 3X Ceramic Parts Company Limited
Description: system DOA equipment integrated wafer loading & unloading, unloading the wafers from the Ceramic boat to the cassette or loading the wafers from the cassette to the ceramic boat. Available for double back-to-back wafers in one slot which realize single side diffusion or
- Density: 5.99999621323765 g/cc
- Thermal Conductivity: 2.5 W/m-K
- MOR / Flexural Strength: 116,029.4714857576 psi
- Compressive / Crushing Strength: 290,073.678714394 psi
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Supplier: Terra Universal, Inc.
Description: The perfect cabinets for secure work-in-process (WIP) storage inside a cleanroom Electropolished 304 stainless steel construction ensures clean, durable surfaces that wipe down easily Wire cage accommodates cleanroom laminar air-flow Locking doors keep your materials secure!
- Height: 76 inch
- Width: 36 inch
- Depth: 24 inch
- Use: Industrial
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Supplier: 3X Ceramic Parts Company Limited
Description: Zirconia Ceramic Wafer Carrier Support Plate Ceramic Wafer Carrier Support Plate is made of zirconia ceramic material , this is because zirconia ceramic surface is more smooth after polished , its roughness could reach to below Ra 0.1, so it is more easy to clean . Also this material
- Density: 6.019996200615109 g/cc
- Compressive / Crushing Strength: 319,081.0465858334 psi
- Shape / Form: Fabricated / Custom Shape
- Features: Specialty Ceramic
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Supplier: Abrisa Technologies
Description: Abrisa Technologies’ CleanVue™ PRO – Series of anti-reflection (AR) coatings combine improved handling, cleaning, water shedding, and robust performance with excellent anti-reflective properties making them ideal for displays and optical windows intended for use in “tough” outdoor, high
- Features: Coating, Other, Weather / UV Resistant
- Location / Orientation: Exterior, Interior
- Substrate: Glass
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Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: Fast scribing speeds; high yield rates; high production capacity Produces high-quality results with no residue or melt-back Fully-automatic processing; integrated coating application, wafer cutting, and cleaning functions Laser type: DPSS 355nm ultraviolet laser Laser power: ≥5W
- Laser Output Power: 0 to 5 watts
- Type: Complete / Turnkey System
- Laser Operation: Laser Cutting
- Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System
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Supplier: Badger Meter
Description: The Preso® COIN® wedge wafer flow meter accommodates most flows, even the most abrasive. This compact DP flow meter is streamlined for easier installation due to the narrow face-to-face, creating the lowest installed cost compared to other end connections. This type of wedge meter is
- Pipe Diameter: 0.5 to 4 inch
- Operating Temperature: 0 to 800 F
- Features: Liquid
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Supplier: Ellsworth Adhesives
Description: MicroCare Sticklers® Benchtop CleanWipes® are optical-grade, lint-free wipes for cleaning fiber optic connectors or bare fiber before splicing. Made from hydroentangled polyester fabric, they contain no bleach, glue or cellulose. 2 in x 4 in, Mini-Tub of 90.
- Industry Applications: Semiconductor Wafer
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Supplier: Ellsworth Adhesives
Description: MicroCare Sticklers® Benchtop CleanWipes® are optical-grade, lint-free wipes for cleaning fiber optic connectors or bare fiber before splicing. Made from hydroentangled polyester fabric, they contain no bleach, glue or cellulose. 4 in x 4 in, Bag of 50.
- Industry Applications: Semiconductor Wafer
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Supplier: Air Innovations LLC
Description: configurations Meet Semi S2-93 and S8-05 standards Non out-gassing construction available Examples of AdvancAir applications installed around the world Semiconductor (lithography, CMP, wafer processing) Microelectronic Aerospace (satellite and space craft development) Compact disc production
- Type: Central, Precision Cooling
- Application: Cleanroom
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Supplier: Fischer Technology, Inc.
Description: deliver reliable results. The instrument is suitable for use in clean rooms, and a comprehensive equipment catalog allows simple integration into existing wafer fabs. Features: Fully automated wafer handling and test process enables efficient staff deployment Can precisely test
- Focal Spot Size: 20 µm
- Form Factor: Bench / Rack / Cabinet
- Features: Material Condition
- Instrument Technology: Radiographic / X-ray
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Supplier: Schmalz Inc.
Description: Wafer gripper for extreme fast, reliable, precise and gentle handling of wet wafers in wet bench applications Handling of wafers after etching and cleaning processes Loading and unloading of conveyor belts Fully or partially automated production of silicon wafers
Find Suppliers by Category Top
Featured Products Top
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The Ceramic Wafer Chuck is essential in the semiconductor industry for holding wafers securely during high-precision processes like lithography, etching, deposition, and testing. With its exceptional thermal stability, chemical resistance, and flatness (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Low outgassing characteristics and excellent plasma corrosion resistance make these chucks ideal for ultra-clean vacuum processing environments. Applications (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Product Overview Used in plasma etch chambers, CVD systems, and ion implantation equipment for wafer clamping and lift-pin support during processing. Fountyl silicon carbide wafer pin chucks integrate the clamping surface and lift pins into a single high-purity sintered (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
, contamination, deformation under high temperatures, and material wear. The Wafer Pin Silicon Carbide (SiC) Chuck addresses these challenges with a high-performance material and advanced design, ensuring wafers remain stable, clean, and accurately positioned during processing (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
shed particles into the wafer environment. - No outgassing -- ceramic material is vacuum compatible, suitable for EFEM and vacuum transfer modules. - Chemical resistance -- unaffected by cleaning solvents and process residues. No coating or anodizing required. - Custom wafer support (read more)
Browse Industrial Ceramic Materials Datasheets for Fountyl Technologies Pte. Ltd. -
and handling — clean, low-particle transport between process steps Customer Value Uniform airflow and flat surface ensure consistent wafer positioning, improving measurement accuracy and process repeatability. Non-contact operation eliminates mechanical wear and (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Wafer producers frequently face kerf loss, slurry contamination, and yield instability during slicing. Traditional slurry-based cutting adds cleaning costs and environmental burden, while inconsistent cutting (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
3. Easy to clean 4. Strong impact resistance 5. Slip Free Different Models of ceramic wafer boat : The semiconductor manufacturing industry typically (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
Fountyl manufactures electrostatic chucks (ESCs) for semiconductor wafer fabrication equipment, available in both Coulomb and Johnsen-Rahbek types. These ESCs are widely used in plasma etching, CVD, PVD, and ion implantation chambers, providing engineers with reliable wafer clamping and precise (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Technologies Pte. Ltd. supplies SiC wafer pins and chucks to semiconductor equipment OEMs and fab maintenance teams. Production includes powder processing, sintering, precision grinding, and final cleaning in-house. (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd.
Conduct Research Top
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Introduction of Porous Ceramic Vacuum Chuck
Ceramic vacuum chuck module can be used for wafer heating, wafer transfer, wafer cutting, wafer grinding, wafer cleaning, laser cutting, screen printing and other processes.
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Tips for Designing Clean Room Equipment
Mechanical components intended to run in clean rooms for wafer fabrication must comply with uniform industry standards that dictate the number and size of particles they can generate.
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Case Study: Future-Proofing Wafer Production with an Advanced new Polyamide-Imide
We worked with a large semiconductor process equipment manufacturer, developing a long life oxygen cleaning erosion-resistant polyamide-imide material to help keep production running smoothly.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Commentary & analysis of week's chip news Japan's Ulvac rolls out wafer cleaning system METHUEN, Mass. -- Ulvac Technologies Inc. here has expanded its semiconductor equipment portfolio, announcing a new, low-cost cleaning system for 6- and 8-inch wafer fab applications. The new system, dubbed
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Why use Microporous Ceramic for Vacuum Chucks
Vacuum chucks are used in the thinning, dicing, cleaning, handling, and other processes of semiconductor electronic chips, like wafers. Why choose microporous ceramic vacuum chucks? 1. During the polishing and cleaning process of wafers, polishing liquid and water mist enter the working table
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
must go to Xerox, but license can be terminated SEZ, Samsung to develop 300-mm single-wafer etch, cleaning Vitesse's 6-inch GaAs wafer fab receives ISO 9000 certification Trillian makes headway on Linux for Intel's Merced David Lam joins board of
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
NEC plans major restructuring, but semiconductors will not be touched Module features Patriot's Java MPU ASML taps Extraction's monitor for DUV demo cell Philips MCU in Visa smart card Samsung, Hyundai pick TI's ADSL chip set MEMC says new technique improves wafers for higher yields Anadigics DC/DC
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
that Paul Jacobs and Steven Altman have officially assumed their roles as the company's chief executive and president, respectively. Applied completes acquisition of single-wafer immersion technology Applied Materials has completed the acquisition of single-wafer immersion technology and Marangoni
More Information Top
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MEMS Materials and Processes Handbook
Photoresist Removal Techniques and Wafer Cleaning Processes . . . . . . . . . . . . . . . . . . .
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Introduction to Microfabrication 2nd Edition
… Etching, Plasma Etching (RIE), Isotropic Dry Etching, Etch Masks, Non-Masked Etching, Multistep and Multilayer Etching, Etch Processes for Common Materials, Ion Beam Etching, Etch Process Characteristics, Selecting Etch Processes, Exercises References and Related Reading 12 Wafer Cleaning and Surface Preparation 143 …
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Microelectronic Applications of Chemical Mechanical Planarization
16.1 Introduction, 467 16.2 Types of Post-CMP Cleaning Processes, 468 16.2.1 Wet Bath Type Cleaning, 468 16.2.2 Single Wafer Cleanings , 469 16.2.2.1 Immersion-Type Single-Wafer Post-CMP Cleaning System, 469 16 …
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UV/Ozone Cleaning For Organics Removal On Silicon Wafers
The curves are shown for the coverea portion of the wafer, for the surface portion treated with 30% H202 and for the uncovered portion of the wafer cleaned by gas phase cleaning only.
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Introduction to Semiconductor Manufacturing Technology
6.3.1 Wafer cleaning ..................................................................................
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Chemicals for the Electronics Industry
Wafer Cleaning ............................................................................................................3-17 .
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RTG thermopile glass bonding process description (1D-W)
15 Loading Wafer Cleaning Fixture .
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Sulfuric acid/hydrogen peroxide rinsing study
Methods to eliminate or reduce the particle growth on wafers cleaned in SPM without alteringthe chemicalsthe wafers are exposed to have also been investigated.
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