Products & Services
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Supplier: Saint-Gobain Surface Conditioning Group
Description: AmberClean™ SWR Aqueous Silicon Wafer Cleaner AmberClean™ SWR is a biodegradable, aqueous cleaner which does not contain volatile organic compounds (VOCs). It is specifically formulated to flush and disperse ceramic, silicon and other lapping and slicing fines
- Aqueous / Water-based: Yes
- Concentration (As Used, by Volume): 1 to 5 %
- Features: Biodegradable, VOC Compliant
- Industry Applications: Semiconductor Wafer / Cleanroom
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Supplier: Saint-Gobain Surface Conditioning Group
Description: AmberClean™ SWB Aqueous Silicon Wafer Cleaner AmberClean™ SWB is a biodegradable, aqueous cleaner which does not contain volatile organic compounds (VOCs). It is specifically formulated to flush and disperse ceramic, silicon and other lapping and slicing fines
- Aqueous / Water-based: Yes
- Concentration (As Used, by Volume): 1 to 5 %
- Features: Biodegradable, VOC Compliant
- Industry Applications: Semiconductor Wafer / Cleanroom
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Supplier: Saint-Gobain Surface Conditioning Group
Description: AmberClean™ L17M ?Aqueous Silicon Wafer Cleaner AmberClean™ L17M is a biodegradable, aqueous cleaner which does not contain volatile organic compounds (VOCs). It is specifically formulated to flush and disperse ceramic and other lapping and slicing fines
- Aqueous / Water-based: Yes
- Concentration (As Used, by Volume): 2 to 5 %
- Features: Biodegradable, VOC Compliant
- Industry Applications: Semiconductor Wafer / Cleanroom
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Supplier: Palomar Technologies, Inc
Description: Overview The SST 1500 is a manually operated wafer aligner capable of aligning wafer sizes to 8-inch (200 mm) diameter. This clean-room compatible aligner includes two CCD cameras mounted on microscope zoom lenses and connected to a split-screen 17-inch LCD monitor. Fiber optic
- Form Factor: Other
- Maximum Wafer / Part Size: 100 to 200 mm
- Measurement Capability: Other
- Mounting / Loading: Other
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Description: HTOT has a full wafering line and can deliver wafer sustrates or completely finished wafers to the specifications outlined below. All wafers are produced from low stress high purity, LED grade HEM grown sapphire with a uniform crystalline structure, free of subgrains,
- Applications: Abrasive / Erosive Wear Protection, Optics / Optical Grade, Wear Parts / Tooling
- Thickness / Wall Thickness: 0.0169 to 0.0256 inch
- Width / O.D.: 1.97 inch
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-310 includes Rigaku's patented
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-V310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-V310 includes Rigaku's patented
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: Nikon Metrology
Description: photoelectric sensors. The system is configured so as not to interrupt the downflow of clean air in the clean room, and measures are taken to prevent particles arising on the suction surface of the wafer. In addition, the cover is stainless steel to prevent the build-up of
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System, Other
- Maximum Wafer / Part Size: 200 mm
- Measurement Capability: Defects / ADC
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Supplier: Technic, Inc.
Description: A specialty cleaner that stops electroless nickel from depositing in non-plated through holes (NPTH). When electroless copper is utilized for metallization it can leave Pd activator residues behind in NPTH. When processed through ENIG, this Pd residue can plate with electroless nickel.
- Industry Applications: Electrical / Electronics, Semiconductor Wafer / Cleanroom
- Type: Cleaner / Cleaning Agent
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Supplier: CoorsTek
Description: durability and hardness, dimensionally stable). RECOMMENDED LITHOGRAPHY & WAFER INSPECTION MATERIALS High-Purity Aluminas UltraClean™ Recrystallized Silicon Carbide CeraSiC, UltraSiC™ Direct Sintered Silicon Carbides
- Applications: Other
- Material Type: Other
- Shape / Form: Wafer Carrier / Holder
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Supplier: CoorsTek
Description: CoorsTek provides wafer boats, pedestals, and custom wafer carriers for both vertical / column and horizontal configurations. Advanced ceramics deliver excellent thermal resistance and plasma durability while mitigating particles and contaminants. Semiconductor-grade silicon carbide
- Applications: Other
- Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
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Supplier: Technic, Inc.
Description: Low Cost, High Copper Capacity Compared to Generic Sodium Persulfate.
- Industry Applications: Semiconductor Wafer / Cleanroom
- Type: Cleaner / Cleaning Agent
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Supplier: CoorsTek
Description: , dimensionally stable). RECOMMENDED LITHOGRAPHY & WAFER INSPECTION MATERIALS High-Purity Aluminas UltraClean™ Recrystallized Silicon Carbide CeraSiC, UltraSiC™ Direct Sintered Silicon Carbides
- Applications: Wear Parts / Tooling, Other
- Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
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Supplier: Robuster Quartz
Description: Quartz boat is a loader which can be inserted by silicon wafer. So it is applied in semiconductor area. The cleaning process for quartz boat is very strictly. The boat should be dipped in concentration of 4-5% HF solutions keeped for 4 hours. Then soaked in DI water for 1 hours. Quartz
- Glass Type: Quartz
- Shape / Form: Fabricated / Custom Shape, Specialty / Other
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Supplier: Technic, Inc.
Description: Low Cost, Easy to Use, Free Rinsing, Will Not Etch / Ideal for Thin Copper Coatings.
- Industry Applications: Semiconductor Wafer / Cleanroom
- Type: Cleaner / Cleaning Agent
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Supplier: Smith & Loveless, Inc.
Description: .... remove, clean and replace. This is possible thanks to the improved design that maintains the smaller lay length of a wafer check valve while keeping the valve body in the piping during maintenance, like larger full body check valves. Designed for quick removal, just 4 bolts allow
- Media Description: Wastewater
- Valve Size: 5 inch
- Valve Type: Wafer / Split Disc Check Valves
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Supplier: JST Manufacturing, Inc.
Description: JST's 300 CLV Cleaner and Stripping Tool is a completely self contained, dry to dry unit designed for cleaning and stripping wafers, optics, disk drives, flat panels and other delicate parts. Just place the product into the dry tank, process through either single or multiple chemical
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Supplier: Saint-Gobain Surface Conditioning Group
Description: AmberClean™ SC14 is a high purity aqueous cleaner formulated with a unique inhibitor which protects against corrosion of reaactive alloys of cobalt, iron, nickel and copper. It was developed using advanced cyclic polarization testing on blanket metal alloy wafers. AmberClean™
- Aqueous / Water-based: Yes
- Features: Biodegradable, Non-toxic
- Full Strength (Undiluted) Use: Yes
- Industry Applications: Electrical / Electronics, Semiconductor Wafer / Cleanroom, Other
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Supplier: Indium Corporation
Description: Indium Corporation's Wafer Pastes are a nitrogen refl ow, no-clean solder pastes using Type 5 and Type 6 powder, which are specifi cally formulated for fl ip-chip attachment and CSP and wafer bumping applications. The fl ux is formulated so that it is applicable to Sn/Ag and
- Form / Shape: Paste
- Soldering Filler Alloys: Tin-Lead (Sn-Pb), Other
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Supplier: JST Manufacturing, Inc.
Description: JST's Dessicators, Passthrous, and Cabinets provide a particle-free, static-safe, low-humidity environment for the transport of sensitive materials. Specialized designs and materials provide secure transport of wafer boxes, reticles and other critical parts as well as acids and corrosives.
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Supplier: 3X Ceramic Parts Company Limited
Description: clean 4. Strong impact resistance 5. Slip Free Different Models of ceramic wafer boat : The semiconductor manufacturing industry typically processes these wafers in either horizontal or vertical carriers. The horizontal carrier, typically called a "boat", has
- Material Type: Carbide Materials, Silicon Carbide
- Shape / Form: Fabricated / Custom Shape
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Supplier: Indium Corporation
Description: low viscosity semiconductor-grade flux, specifically optimized for uniform, oxide-free solder bump formation across wafers up to 300mm (12 inches) in diameter, without solder thieving. WS-3543 washes off easily and leaves zero residues, even after repeated application/ reflow/cleaning
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Features Halogen-free (no intentionally-added halogens) Viscosity suitable for 150-300mm wafers Solvent clean Nitrogen reflow atmosphere Suitable for high-Pb, SnPb, and Pb-free solder applications Introduction Wafer Flux SC 5R
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
- Halogen / Halide Free: Yes
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Supplier: Indium Corporation
Description: Features Water-soluble Viscosity suitable for 150–300 mm wafers as a damming flux No residue after multiple reflow/cleaning cycles Uniform bump shape Halogen-free Suitable for SnPb and Pb-free, and high temperature applications
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: 3X Ceramic Parts Company Limited
Description: Zirconia Ceramic Wafer Carrier Support Plate Ceramic Wafer Carrier Support Plate is made of zirconia ceramic material , this is because zirconia ceramic surface is more smooth after polished , its roughness could reach to below Ra 0.1, so it is more easy to clean . Also this
- Compressive / Crushing Strength: 319081 psi
- Density: 6.02 g/cc
- Material Type: Zirconia, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
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Supplier: Badger Meter
Description: The Preso® COIN® wedge wafer flow meter accommodates most flows, even the most abrasive. This compact DP flow meter is streamlined for easier installation due to the narrow face-to-face, creating the lowest installed cost compared to other end connections. This
- Operating Temperature: 0.0 to 800 F
- Pipe Diameter: 0.5000 to 4 inch
- Process Media Type: Liquid
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Description: . Physical and chemical properties are stable: Porous ceramic materials can withstand acid and alkali corrosion, can withstand high temperature and high pressure, have good clean state and will not cause secondary pollution. It is a green and environmentally friendly functional material. High
- Chuck Geometry: Round
- Diameter: 4 to 12 inch
- Materials of Construction: Ceramic
- Type: Vacuum Chuck
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Supplier: 3X Ceramic Parts Company Limited
Description: wearable. It is also very easy to clean and wash because of its smooth and density surface . The zirconia ceramic tooth rails adopt special processing technology which greatly reduce the marks on the wafers . It is assembled on the automatic wafer handling system for DOA
- Compressive / Crushing Strength: 290074 psi
- Density: 6 g/cc
- MOR / Flexural Strength: 116029 psi
- Material Type: Zirconia, Specialty Ceramic
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Supplier: Ellsworth Adhesives
Description: MicroCare Sticklers® Benchtop CleanWipes® are optical-grade, lint-free wipes for cleaning fiber optic connectors or bare fiber before splicing. Made from hydroentangled polyester fabric, they contain no bleach, glue or cellulose. 2 in x 4 in, Mini-Tub of 90.
- Industry Applications: Semiconductor Wafer
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Supplier: Ellsworth Adhesives
Description: MicroCare Sticklers® Benchtop CleanWipes® are optical-grade, lint-free wipes for cleaning fiber optic connectors or bare fiber before splicing. Made from hydroentangled polyester fabric, they contain no bleach, glue or cellulose. 4 in x 4 in, Bag of 50.
- Industry Applications: Semiconductor Wafer
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Supplier: U.S. Plastic Corporation
Description: Praher K6 thermoplastic wafer check valves are available in sizes 2" though 8" with maximum operating pressure of 150 psi at 72 F, non-shock. The valve does not require a spacer for full disc opening performance in SCH 80 pipes. Valves have a single disc design suitable for horizontal and
- Material of Construction: PVC
- Valve Size: 6 inch
- Valve Type: Wafer / Split Disc Check Valves
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Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: Fast scribing speeds; high yield rates; high production capacity Produces high-quality results with no residue or melt-back Fully-automatic processing; integrated coating application, wafer cutting, and cleaning functions Laser type: DPSS 355nm ultraviolet laser Laser
- Automation / Control: Windows / PC Control
- Laser Output Power: 0.0 to 5 watts
- Laser Type: Other
- Materials Processed: Metal / Conductive Materials, Semiconductors / Electronics, Soft / Fibrous (Textiles, Foams, Paper)
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Supplier: Infinity Fluids Corp.
Description: All drying applications Wafer processing Metal finishing Solvent drying Explosion proof and ATEX constructions
- AC Voltage Required: 12 to 600 volts
- Fuel / Energy Source: Electric
- Heater Type: Air Heater, Circulation Heater, Explosion Proof Heater, Inline Heater
- Heating Capacity: 0.1000 to 250 kW
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Supplier: Drytek Distribution
Description: Product Features: 300mm wafer size Box cover and box base are made of PC. Top cushion and bottom cushion are made of PBT. Compatialbe top and bottom cushion ensures operator correct handling Innovative wafer suspension designs minimizes wafer rotation and particle generation
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Supplier: Abrisa Technologies
Description: Abrisa Technologies’ CleanVue™ PRO – Series of anti-reflection (AR) coatings combine improved handling, cleaning, water shedding, and robust performance with excellent anti-reflective properties making them ideal for displays and optical windows intended for use in
- Features: Weather / UV Resistant
- Industry: Other
- Substrate / Surface: Glass
- Surface Location / Orientation: Exterior, Interior
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF 3760 includes Rigaku's patented
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3800e can measure elements from S through U with a single-target, dual-beam X-ray system and a new liquid nitrogen-free detector system. The TXRF 3800e includes Rigaku
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: Zygo Corporation
Description: Wafer production technology requires extreme precision components, whether for reticle stages, wafer stages or imaging technologies. ZYGO is a leading supplier of stage positioning components, serving the semiconductor industry and emerging EUV technologies through multiple custom
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Supplier: Technic, Inc.
Description: Highly conductive electro-cleaner for removal of light oxide, oils and light buffing compound with excellent low recess cleaning.
- Industry Applications: Semiconductor Wafer / Cleanroom
- Type: Cleaner / Cleaning Agent
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Supplier: Air Innovations LLC
Description: (lithography, CMP, wafer processing) Microelectronic Aerospace (satellite and space craft development) Compact disc production Ultra-clean assembly and metrology operations
- Precision Cooling: Yes
- Specialized Application: Cleanroom
- Type: Central
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Supplier: ASTM International
Description: 1.1 This practice covers an inspection procedure for determining the surface quality of silicon wafers that have been polished on one side. 1.2 This practice is intended as a large-volume acceptance method and as such does not require use of a microscope or other optical instruments
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Supplier: ASTM International
Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers a noncontacting, non-destructive procedure to determine the sori of clean, dry semiconductor wafers. 1.2 The test method is applicable to wafers 50 mm or larger in diameter, and 100 [mu]m
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Supplier: ASTM International
Description: 1.1 This test method covers a noncontacting, nondestructive procedure to determine the warp of clean, dry semiconductor wafers. 1.2 The test method is applicable to wafers 50 mm or larger in diameter, and 100 [mu]m (0.004 in.) approximately and larger in thickness, independent
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Supplier: ASTM International
Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers a noncontacting, nondestructive procedure to determine the warp of clean, dry semiconductor wafers. 1.2 The test method is applicable to wafers 50 mm or larger in diameter, and 100 m (0.004
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Low outgassing characteristics and excellent plasma corrosion resistance make these chucks ideal for ultra-clean vacuum processing environments. Applications (read more)
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Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
, contamination, deformation under high temperatures, and material wear. The Wafer Pin Silicon Carbide (SiC) Chuck addresses these challenges with a high-performance material and advanced design, ensuring wafers remain stable, clean, and accurately positioned during processing (read more)
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Wafer producers frequently face kerf loss, slurry contamination, and yield instability during slicing. Traditional slurry-based cutting adds cleaning costs and environmental burden, while inconsistent cutting (read more)
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3. Easy to clean 4. Strong impact resistance 5. Slip Free Different Models of ceramic wafer boat : The semiconductor manufacturing industry typically (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
Semiconductor and precision manufacturing often face particle contamination, thermal deformation, and mechanical wear during wafer transfer. Metal arms may introduce impurities or lose accuracy under high (read more)
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meet the rigorous demands of modern semiconductor manufacturing and high-precision automation, our newly optimized alumina ceramic end effectors deliver exceptional stability and long-term reliability for handling high-value materials such as silicon wafers (read more)
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With the IMP-NIR-TH3/90/IP68 sensor, Micro-Epsilon is expanding its interferoMETER portfolio with a particularly robust sensor for inline thickness measurement of Si and SiC wafers. The sensor has a 90° beam path and a small working distance of just 3 mm, making it ideal for applications (read more)
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Mitsui Chemicals' ICROS™ TAPE is a surface protective tape used in silicon wafer-back-grinding processes in semiconductor manufacturing for the manufacturer of integrated circuits. ICROS Tape can be processed using a "no rinse" process, which is shorter than (read more)
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Conduct Research Top
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Introduction of Porous Ceramic Vacuum Chuck
Ceramic vacuum chuck module can be used for wafer heating, wafer transfer, wafer cutting, wafer grinding, wafer cleaning, laser cutting, screen printing and other processes.
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Tips for Designing Clean Room Equipment
Mechanical components intended to run in clean rooms for wafer fabrication must comply with uniform industry standards that dictate the number and size of particles they can generate.
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Case Study: Future-Proofing Wafer Production with an Advanced new Polyamide-Imide
We worked with a large semiconductor process equipment manufacturer, developing a long life oxygen cleaning erosion-resistant polyamide-imide material to help keep production running smoothly.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Commentary & analysis of week's chip news Japan's Ulvac rolls out wafer cleaning system METHUEN, Mass. -- Ulvac Technologies Inc. here has expanded its semiconductor equipment portfolio, announcing a new, low-cost cleaning system for 6- and 8-inch wafer fab applications. The new system, dubbed
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Why use Microporous Ceramic for Vacuum Chucks
Vacuum chucks are used in the thinning, dicing, cleaning, handling, and other processes of semiconductor electronic chips, like wafers. Why choose microporous ceramic vacuum chucks? 1. During the polishing and cleaning process of wafers, polishing liquid and water mist enter the working table
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
must go to Xerox, but license can be terminated SEZ, Samsung to develop 300-mm single-wafer etch, cleaning Vitesse's 6-inch GaAs wafer fab receives ISO 9000 certification Trillian makes headway on Linux for Intel's Merced David Lam joins board of
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
that Paul Jacobs and Steven Altman have officially assumed their roles as the company's chief executive and president, respectively. Applied completes acquisition of single-wafer immersion technology Applied Materials has completed the acquisition of single-wafer immersion technology and Marangoni
More Information Top
Indicates content that may require registration and/or purchase.
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MEMS Materials and Processes Handbook
Photoresist Removal Techniques and Wafer Cleaning Processes . . . . . . . . . . . . . . . . . . .
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Introduction to Microfabrication 2nd Edition
… Etching, Plasma Etching (RIE), Isotropic Dry Etching, Etch Masks, Non-Masked Etching, Multistep and Multilayer Etching, Etch Processes for Common Materials, Ion Beam Etching, Etch Process Characteristics, Selecting Etch Processes, Exercises References and Related Reading 12 Wafer Cleaning and Surface Preparation 143 …
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Microelectronic Applications of Chemical Mechanical Planarization
16.1 Introduction, 467 16.2 Types of Post-CMP Cleaning Processes, 468 16.2.1 Wet Bath Type Cleaning, 468 16.2.2 Single Wafer Cleanings , 469 16.2.2.1 Immersion-Type Single-Wafer Post-CMP Cleaning System, 469 16 …
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UV/Ozone Cleaning For Organics Removal On Silicon Wafers
The curves are shown for the coverea portion of the wafer, for the surface portion treated with 30% H202 and for the uncovered portion of the wafer cleaned by gas phase cleaning only.
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Introduction to Semiconductor Manufacturing Technology
6.3.1 Wafer cleaning ..................................................................................
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Chemicals for the Electronics Industry
Wafer Cleaning ............................................................................................................3-17 .
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RTG thermopile glass bonding process description (1D-W)
15 Loading Wafer Cleaning Fixture .
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Sulfuric acid/hydrogen peroxide rinsing study
Methods to eliminate or reduce the particle growth on wafers cleaned in SPM without alteringthe chemicalsthe wafers are exposed to have also been investigated.