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Supplier: 3X Ceramic Parts Company Limited
Description: , but it is difficult to recover the edge collapse. At this time, we can adopt the method of drilling a small hole first and then expanding the hole. Similarly, we can reserve more thickness of the zirconia wafer support first, and then go to the grinder to smooth the broken side after
- Compressive / Crushing Strength: 362592 psi
- Density: 6.02 g/cc
- MOR / Flexural Strength: 174044 psi
- Material Type: Zirconia, Specialty Ceramic
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Supplier: Phenom-World BV
Description: multiple point analysis, and identify any hidden elements within the sample. Additionally, this software can be expanded with elemental mapping functionality. The step-by-step guided process within the EID software helps the user to collect all X-ray results in an organized and structured way
- Applications: Semiconductor Wafers, CVD / PVD Films, Packaged ICs / Ceramic Substrates
- Area Mapping: Yes
- FIB / Ion Mill: Yes
- Form Factor: Monitor / Instrument
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Supplier: Precision Surfacing Solutions
Description: solution! Lapmaster serves the Fine Grinding, Advanced Materials, Precision Optics, Bore Honing and Finishing, Lapping/Polishing and Metallographic markets through an expanding network of sales and services offices located throughout the world. Sales and technical service is available either
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Supplier: Armstrong International
Description: Armstrong offers several thermostatic wafer steam traps. The WT-1 is ideal for low-capacity steam tracers and features an exclusive non-welded wafer design, a sealed stainless steel body and an internal strainer screen two to three times larger than that of other thermostatic traps.
- Connection Style: Socket Weld / Tube, Threaded
- Kinetic Steam Traps: Disc Trap (Thermodynamic)
- Material: Steel - High Carbon
- Maximum Capacity: 1600 lbs/hr
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Supplier: Technic, Inc.
Description: System Overview The SEMCON 4000 is an automatic loading and unloading “wet bench” type wafer Under Bump Metalization tool, designed with processes for Nickel and Gold metalization of silicon and Ga/As wafers with aluminum or copper seed layer. The Semcon 4000 tool is
- Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic
- Equipment / System Type: Automated System
- Process / Technology: Electroplating
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Description: sites allow for easy customization to make use of the X12d signals from P1 and user-defined I/O from P2 (wafers 1-10). Features 3U VPX Rear Transition Module Support for X-ES' 3U VPX SBC module I/O Up to six eSATA connectors Four micro-DB-9
- Connection to Host: USB, RS232/422/485
- Form Factor: Printed Circuit Board (PCB), Other
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Supplier: Evident Scientific
Description: different wafer sizes is a key for expanding fabs. The AL120 series consists of three models based on wafer diameter, the 200 mm (AL120-L8), the combination 150 mm and 200 mm (AL120-L86) and the 150 mm model for wafer sizes of 150 mm or less (AL120-L6). Each system is
- Application: Semiconductor Inspection
- Grade: Benchtop
- Mechanical Stage: Yes
- Microscope Type: Compound
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Supplier: SensoPart
Description: The VISOR® Solar detects the wafer position with an accuracy of ± 50 µm and registers any damage in the same step. Typical VISOR® Solar SensoPart has expanded its range of vision sensors with the VISOR® Solar in
- Horizontal Resolution: 1936 lines
- Lens Mount: C-Mount
- Monochrome / Color: Monochrome
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Supplier: SensoPart
Description: The VISOR® Solar detects the wafer position with an accuracy of ± 50 µm and registers any damage in the same step. Typical VISOR® Solar SensoPart has expanded its range of vision sensors with the VISOR® Solar in
- Horizontal Resolution: 1080 lines
- Monochrome / Color: Monochrome
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Supplier: CSA Group
Description: .1 Wafer thinning 3. Subclause 5.2 (Singulation or die separation) has been renamed from the previous Subclause 5.1 (Wafer sawing) and has been expanded to included other methods of singulation or sawing, including: - 5.2.2 Wafer scribing - 5.2.3 Laser cutting - 5.2.4
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Description: .1 Wafer thinning 3. Subclause 5.2 (Singulation or die separation) has been renamed from the previous Subclause 5.1 (Wafer sawing) and has been expanded to included other methods of singulation or sawing, including: - 5.2.2 Wafer scribing - 5.2.3 Laser cutting - 5.2.4
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Supplier: Comdel, Inc.
Description: An Expanded Performance, High Voltage, Electrostatic Chuck Our existing ESC product line was recently expanded with voltages up to 15kV 15kV, 1mA POLARITY REVERSIBLE – on command – for clamp and de-clamp – Enhances throughput and helps
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Supplier: Marktech Optoelectronics
Description: Infrared Emitters Marktech has recently expanded infrared capabilities to well beyond the 870 and 940 wavelengths, which have been the most popular ranges for designs over recent years. Recent additions to the product line include 1300nm, 1550nm and 1720nm wavelengths. We offer one of the
- Color: Infrared, Red
- Forward Current: 50 milliamps
- Forward Voltage: 0.8000 volts
- Optical Power Output: 3 milliwatts
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Supplier: Marktech Optoelectronics
Description: Infrared Emitters Marktech has recently expanded infrared capabilities to well beyond the 870 and 940 wavelengths, which have been the most popular ranges for designs over recent years. Recent additions to the product line include 1300nm, 1550nm and 1720nm wavelengths. We offer one of the
- Color: Infrared, Red
- Forward Current: 20 milliamps
- Forward Voltage: 1.4 volts
- Optical Power Output: 10 milliwatts
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Supplier: Marktech Optoelectronics
Description: Marktech has recently expanded infrared capabilities to well beyond the 870 and 940 wavelengths, which have been the most popular ranges for designs over recent years. Recent additions to the product line include 1300nm, 1550nm and 1720nm wavelengths. We offer one of the broadest wavelength
- Color: Infrared
- Forward Current: 30 milliamps
- Forward Voltage: 1.7 volts
- Optical Power Output: 6 milliwatts
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Supplier: Marktech Optoelectronics
Description: Infrared Emitters Marktech has recently expanded infrared capabilities to well beyond the 870 and 940 wavelengths, which have been the most popular ranges for designs over recent years. Recent additions to the product line include 1300nm, 1550nm and 1720nm wavelengths. We offer one of the
- Color: Infrared, Red
- Forward Current: 20 milliamps
- Forward Voltage: 1.4 volts
- Optical Power Output: 11 milliwatts
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Electron Microscopes - Ultra-high Resolution Field Emission Scanning Electron Microscope -- SEM5000XSupplier: CIQTEK Co., Ltd
Description: design, SEM5000X can achieve further improvements in low-voltage imaging resolution. The specimen chamber ports extend to 16, and the specimen exchange load-lock supports up to 8-inch wafer size (maximum diameter 208 mm), greatly expanding applications' coverage. The advanced scanning
- Accelerating Voltage: 0.0200 to 30 kilovolts
- Application: Metallurgical, Semiconductor Inspection
- Computer Interface: Yes
- Digital Display: Yes
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Supplier: ETEL S.A.
Description: The Z3TM module expands the range of motion platforms, offering four independent degrees of freedom for advanced semiconductor applications. Designed for advanced semiconductor applications, this module offers four independent degrees of freedom – 3 rotary axes (RX, RY, RZ) and one
- Actuation Type: Electrical
- Axis Configuration: Z Axis Only
- Features: Multi-position
- Motor Continuous Power: 0.0052 to 0.0562 HP
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Supplier: ETEL S.A.
Description: The Z3TM+ module expands the range of motion platforms and integrates four independent degrees of freedom in an enlarged theta hollow shaft. This module revolutionises motion control in the semiconductor industry through its advanced design with four degrees of freedom housed in an
- Actuation Type: Electrical
- Axis Configuration: Z Axis Only
- Bearing Type: Ball/Roller Bearing
- Carriage Load: 5.62 lbs
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Supplier: ETEL S.A.
Description: The Z3TM+ module expands the range of motion platforms and integrates four independent degrees of freedom in an enlarged theta hollow shaft. This module revolutionises motion control in the semiconductor industry through its advanced design with four degrees of freedom housed in an
- Actuation Type: Electrical
- Axis Configuration: Z Axis Only
- Bearing Type: Ball/Roller Bearing
- Carriage Load: 5.62 lbs
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Technical Books - Optical Scattering: Measurement and Analysis, Third Edition -- ISBN: 9781628418408Supplier: SPIE
Description: The first edition of this book concentrated on relating scatter from optically smooth surfaces to the microroughness on those surfaces. After spending six years in the semiconductor industry, Dr. Stover has updated and expanded the third edition. Newly included are scatter models for pits and
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Supplier: Synertron Technology, Inc.
Description: DP display interface and 1 x M.2, 1 x Mini Card expansion slot offers the ideal platform for graphics performance with integrated IoT features, real-time performance, manageability, and security. 2I640HW's all wafer IO design delivers high flexibility toward expanded functions & and
- Chipset Type: Intel® Chipset
- Communication Networks: Ethernet
- I/O Bus Specifications: USB, Other
- Operating Temperature: -4 to 158 F
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Supplier: Lumentum Operations, LLC
Description: The high-power Q306 lasers expand the existing Q-Series® that provides a solution for demanding applications requiring faster throughput. Lumentum Q-Series lasers continue to lead the market for high-power Q-switched diode-pumped UV lasers used for a wide variety of high
- Beam Area: 0.3000 mm²
- Laser Output: Q-Switched, Pulsed
- Laser Power: 12000 to 40000 milliwatts
- Laser Type: Laser Diode Modules
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Supplier: Synertron Technology, Inc.
Description: i9 / i7 / i5 / i3 Pentium / Celeron (35W) CPU, Intel® Q470 chipset, eDP, 5 x Intel Gb Ethernet, 8 x USB, 8DI / 8DO, 4 x COM, 1 x Mini PCIe, 1 x M.2, 1 x PCIe, 1 x SIM, SMBus LEX SYSTEM 3I470HW, with Intel 10th Gen Comet Lake-S Core i CPU, equipped with wafer type I/O ports: 5 x Gb
- Chipset Type: Intel® Chipset
- Communication Networks: Ethernet
- I/O Bus Specifications: USB, Other
- Operating Temperature: -4 to 158 F
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Supplier: Synertron Technology, Inc.
Description: Coffee Lake-S Core i CPU, equipped with wafer type I/O ports: 5 x GbE, 6 x RS232/RS422/485 serial ports, 8 x USB, 16 DI /16 DO and PCIe/mPCIe/M.2 expansion slots, is ideal platform with high flexibility toward expanded functions & and also provides user hassle-free solution of
- Chipset Type: Intel® Chipset
- Communication Networks: Ethernet
- I/O Bus Specifications: USB, Other
- Operating Temperature: -4 to 140 F
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Supplier: Skyworks Solutions, Inc.
Description: Compared to ceramic capacitors, Skyworks MIS chip capacitors offer higher Q, and a lower insertion loss of 0.04 dB, in a 50 Ohm system. Insulation resistance is greater than 105M Ohm. To accommodate high volume automated assembly methods, wafers can be supplied on expanded film frame.
- Applications: RF / Microwave Capacitors
- Capacitance Range: 4.70E-5 microF
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Supplier: Skyworks Solutions, Inc.
Description: Compared to ceramic capacitors, Skyworks MIS chip capacitors offer higher Q, and a lower insertion loss of 0.04 dB, in a 50 Ohm system. Insulation resistance is greater than 105M Ohm. To accommodate high volume automated assembly methods, wafers can be supplied on expanded film frame.
- Applications: RF / Microwave Capacitors
- Capacitance Range: 3.33E-4 microF
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Supplier: Skyworks Solutions, Inc.
Description: Compared to ceramic capacitors, Skyworks MIS chip capacitors offer higher Q, and a lower insertion loss of 0.04 dB, in a 50 Ohm system. Insulation resistance is greater than 105M Ohm. To accommodate high volume automated assembly methods, wafers can be supplied on expanded film frame.
- Applications: RF / Microwave Capacitors
- Capacitance Range: 1.50E-5 microF
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Supplier: Skyworks Solutions, Inc.
Description: Compared to ceramic capacitors, Skyworks MIS chip capacitors offer higher Q, and a lower insertion loss of 0.04 dB, in a 50 Ohm system. Insulation resistance is greater than 105M Ohm. To accommodate high volume automated assembly methods, wafers can be supplied on expanded film frame.
- Applications: RF / Microwave Capacitors
- Capacitance Range: 6.80E-5 microF
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Supplier: Custom-Pak, Inc.
Description: or foam assembly. Blow molded shapes can meet ergonomic needs on one side and aesthetic needs on the other. Walls can be compressed for wafer-thin designs, expanded for over-stuffed designs or precisely varied for combination designs. Let Custom-Pak help you design great furniture at
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Supplier: HORIBA Instruments, Inc.
Description: includes the laser source, light receiver, and optical components, as well as the illumination and CCD imaging camera, allowing monitoring of any area of the wafer surface using microscopic images. This system uses a visible laser (670 nm) which can be used for a broad range of films. Sensor
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Supplier: Synertron Technology, Inc.
Description: , HDMI ,VGA & LVDS with 1 x mPCIe, 2 x M.2 and 1 x SIM expansion slots. 3I110HW/BW's all wafer IO design delivers high flexibility toward expanded functions & and also provides user hassle-free solution of integrating the SBC board within various mechanical enclosures. Plus with
- Chipset Type: Intel® Chipset
- Communication Networks: Ethernet
- I/O Bus Specifications: USB, Other
- Operating Temperature: -40 to 158 F
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Supplier: ValueTronics International, Inc.
Description: 708B The Keithley 7072 Semiconductor Matrix Card is designed specifically to handle low-level and high-impedance measurements encountered in semiconductor parametric tests on wafers and devices. This unique design provides two low-current circuits with specified 1pA maximum offset
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Supplier: ValueTronics International, Inc.
Description: handle low-level and high-impedance measurements encountered in semiconductor parametric tests on wafers and devices. This unique design provides two low-current circuits with specified 1pA maximum offset current for sensitive sub-picoamp measurement resolution and two C-V paths for
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Supplier: ASTM International
Description: nonvulnerability) of components to be used in such systems. Manufacturers are currently selling semiconductor parts with guaranteed hardness ratings, and the military specification system is being expanded to cover hardness specification for parts. Therefore test methods and guides are
![Real Time Interferometric Process Monitor [CCD] Laser Interference Camera -- LEM-CT-670-G50](https://partimages.globalspec.com/37/4787/5454787_medium.png "Real Time Interferometric Process Monitor [CCD] Laser Interference Camera -- LEM-CT-670-G50")
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With the IMP-NIR-TH3/90/IP68 sensor, Micro-Epsilon is expanding its interferoMETER portfolio with a particularly robust sensor for inline thickness measurement of Si and SiC wafers. The sensor has a 90° beam path and a small working distance of just 3 mm, making it ideal for applications (read more)
Browse Interferometers Datasheets for Micro-Epsilon Group -
system caters to a wide range of applications demanding exceptional performance in mmWave measurements. Its industry-leading frequency coverage, enhanced calibration stability, and focus on on-wafer capabilities make it a compelling choice for engineers and technicians working on cutting-edge technologies. The additional spectrum analyzer option further expands its functionality, providing a versatile solution for diverse testing needs. (read more)
Browse Vector Network Analyzers Datasheets for Anritsu Company -
-generation device architectures. These extreme low-temperature conditions add further complexity to system design, requiring feedthroughs capable of maintaining hermetic performance under both cryogenic and vacuum stress, an area where our engineering expertise is continuously expanding. All (read more)
Browse Feedthroughs Datasheets for Douglas Electrical Components -
broad electronics materials portfolio, ESI expands its ability to support innovation across advanced and high-reliability electronics applications. “The acquisition of Micromax is a strong strategic fit for ESI and reinforces our focus on high-value, technology (read more)
Browse Electrical and Electronic Resins Datasheets for MacDermid Alpha Electronics Solutions
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
ASE to surpass Amkor in IC-packaging market, says report Merger rumors in foundry biz SiGen, EV Group forge wafer bonding alliance Apple cites Oxford Semi's ARM chip in Firewire drive failures Suppliers get hopeful for 2004 Tronics Microsystems opens Grenoble MEMS wafer fab Struggling Trikon raises
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Amkor goes wafer-bumping with Unitive Amkor Technology Inc.'s move this week to acquire a wafer-bump company will enable the IC-packaging giant to expand its wings in the flip-chip, wafer-level and related markets, according to an executive with the company. DoD spending bill includes
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Semiconductor IPOs range from successful to disappointing IP trading center planned to serve Japanese designers Atmel, SST continue to battle over patent issues Matheson achieves new efficiencies by centralizing gas-equipment operations ATMI expands GaAs epitaxial wafer production to meet customer
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
NEC plans major restructuring, but semiconductors will not be touched Module features Patriot's Java MPU ASML taps Extraction's monitor for DUV demo cell Philips MCU in Visa smart card Samsung, Hyundai pick TI's ADSL chip set MEMC says new technique improves wafers for higher yields Anadigics DC/DC
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
silicon, Barrett tells analysts Broadcom to expand Taiwanese R &D center Suppliers to get a 'lump of coal' 300-mm wafer capacity ramping to 400,000 wpm, says report The long-awaited semiconductor and chip-equipment recovery is here. Or is it? Some see a few more speed bumps ahead, as wafer
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
: Java is ready for real time With new standards efforts and millions of Java-savvy developers, Java is ready for real-time embedded systems development, says Gary Cato, manager of strategic alliances at Aonix. IQE buys Singapore wafer maker Welsh wafer supplier IQE plc has agreed to acquire MBE
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Commentary & analysis of week's chip news Japan's Ulvac rolls out wafer cleaning system METHUEN, Mass. -- Ulvac Technologies Inc. here has expanded its semiconductor equipment portfolio, announcing a new, low-cost cleaning system for 6- and 8-inch wafer fab applications. The new system, dubbed
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
provided an editor 's selection of other significant stories of the week. Singapore tips sub-surface wafer metrology Researchers from Nanyang Technological University in Singapore are developing a metrology system that claims to detect "sub-surface " defects in raw or reclaimed silicon wafers. Rave tips
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Approaching the numerical aperture of water immersion lithography at 193-nm
Beam Expander Wafer Stage .
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Laser coding of bipolar read-only memories
The test patterns were all on the same wafer and the beam ex- pander was held constant.
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Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation
For practical uses, the bending stress can be applied to wafers e.g. using a special tape expander with a convex wafer stage.
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Investigation of photoconductive silicon as a reconfigurable antenna
To define the shape of the illumination pattern a copper mask containing a bow-tie shaped aperture was inserted into the optical path between the beam expander and the Si wafer .
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New spectroscopic instrumentation for measurement of stratospheric trace species by remote sensing of scattered skylight
The refrigerator cooler is a specialized glass wafer Joule-Thompson gas expander (model R2605-7) built by MMR Technologies (Mountain View, CA).
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Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate
This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smaller substrate onto a larger wafer substrate by using a standard matrix expander in combination with adhesive wafer bonding and an elastic dice …
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Reliable wide-temperature-range operation of 1.3-μm beam-expander integrated laser diode for passively aligned optical modules
These FFP values are about 1/3 those of reference LD’s without the beam- expander fabricated on the same wafer .
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Internal medicine
In this case further heparin and only fibrinogenfreie concentrates (albumin, plasma expanders ), washed erythrocytes and the platelet concentrates would move because arise otherwise new Fibrinthromben and plättchenhemmende FDP.