Wafer Expander

Description: Wide bandgap SiC technology is opening up a whole new generation of high voltage power products for applications in transport, power transmission and green energy. M2 Wafer edition tests these upto 10kV on wafer before singulation, identifying defective product early and saving the

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: Wide bandgap SiC technology is opening up a whole new generation of high voltage power products for applications in transport, power transmission and green energy. M2 Wafer edition tests these upto 10kV on wafer before singulation, identifying defective product early and saving the

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: High Precision Zirconia Ceramic Wafer Support Loader Zirconia Ceramic Wafer Carrier Support is highly precision machinind by flapping machine and CNC machined . It is used on the photovaltaic equipment machine to carry the wafer in semiconductor industry . Zirconia ceramic

• Density: 6.019996200615109 g/cc
• Thermal Conductivity: 2 W/m-K
• MOR / Flexural Strength: 174,044.2072286364 psi
• Compressive / Crushing Strength: 362,592.0983929925 psi

Description: In today's technologically advanced world, there are a growing number of applications where conventional machining techniques just aren't accurate enough to meet precision surfacing requirements. Precision surfacing with abrasive media, a technology developed and refined by Lapmaster International

Description: Armstrong offers several thermostatic wafer steam traps. The WT-1 is ideal for low-capacity steam tracers and features an exclusive non-welded wafer design, a sealed stainless steel body and an internal strainer screen two to three times larger than that of other thermostatic traps.

• Maximum Operating Pressure: 600 psi
• Maximum Capacity: 1,600.000000000002 lbs/hr
• Operating Temperature: 750 F
• Size of Connection: 0.5 inch

Description: easy customization to make use of the X12d signals from P1 and user-defined I/O from P2 (wafers 1-10). Features 3U VPX Rear Transition Module Support for X-ES' 3U VPX SBC module I/O Up to six eSATA connectors Four micro-DB-9 connectors for dual RS-232/422/485 serial ports Two USB 3.0

• Network Options: Ethernet
• Data Acquisition: I/O Module
• Features: Other
• Form Factor: Printed Circuit Board (PCB)

Description: The cleaving machines automatically perform parallel alignment and positioning and cleave with the blade the silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN, from the scribed positions. It is capable for processing maximum of 4-inch wafers and

• Maximum Wafer / Part Size: 101.59994513602963 mm
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: Using an internally developed PIG plasma source, this system can form smooth DLC film at high speed. It is mostly used for surface processing of automotive parts, whose applications are expected to expand in the future.

• Applications: CVD / PVD Films

Description: System Overview The SEMCON 4000 is an automatic loading and unloading “wet bench” type wafer Under Bump Metalization tool, designed with processes for Nickel and Gold metalization of silicon and Ga/As wafers with aluminum or copper seed layer. The Semcon 4000 tool is designed with

• Machinery Type: Automated System
• Process / Technology: Electroplating
• Application / Industry: Semiconductor / Wafer, Solar / Photovoltaic

Description: The AL120 wafer handler series transfers both silicon and compound semiconductor wafers from the cassette to the microscope stage with enhanced capabilities and flexibility, while maintaining an ergonomic design. Accommodates Multiple Wafer Sizes The ability to accommodate

• Grade: Benchtop
• Eyepiece Style: Binocular
• Microscope Type: Compound
• Features: Digital Display, Mechanical Stage

Description: sensor detects the position and any damage to wafers and cells. It allows robots to pick up and lay down wafers accurately. Wafers and solar cells with fine breakouts can be directly rejected during this step, before they can completely break up and damage other material. Read

• Horizontal Resolution: 1,080 lines
• Features: Industrial, Machine Vision Sensor, Other, Smart Camera
• Monochrome / Color: Monochrome

Description: IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - and minimally or partially encapsulated die and wafers. This

Description: IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - and minimally or partially encapsulated die and wafers. This

Description: The Phenom ProX desktop scanning electron microscope is the ultimate all-in-one imaging and X-ray analysis system. With the Phenom ProX desktop SEM, sample structures can be physically examined and their elemental composition determined. Viewing three-dimensional images of microscopic structures

• Measurements: Area Mapping, Composition, Critical Dimension / Trench Geometry, Defects / ADC, Particle Contamination, Roughness / Waviness
• Applications: CVD / PVD Films, Packaged ICs / Ceramic Substrates, Semiconductor Wafers
• Technology: FIB / Ion Mill
• Mounting / Loading: Manual Loading

Description: maximizing power transfer from a generator to the load. Our NT-series tuners have been designed for on-wafer applications with maximum VSWR at the probe tip.

• Frequency Range: 90,000,000,000 Hz
• Electrical Properties: Resistance/ Impedance
• Calibration Signal: Signal / Waveform Generator Output

Description: Configurations Available 10-15 kV configurations available Potential Applications Flat panel manufacturing Solar panel manufacturing Wafer manufacturing

• DC Output Voltage: 5,000 to 15,000 volts
• DC Output Current: 0.005 amps
• DC Input Voltage: 24 volts
• Type: DC Power Supply, High Voltage Power Supply

Description: in the industry which includes UV and "SuperLong" wavelengths as high as 2600nm. Our abilities to control wafer production through packaging assure the highest quality and reliability products are manufactured within our facilities.

• Peak Wavelength: 950 nm
• Forward Voltage: 1.3 volts
• Forward Current: 100 milliamps
• Optical Power Output: 24 milliwatts

Description: hollow shaft. With optional coarse Z-axes, this module provides unprecedented control over wafer motion profiles and improves precision and efficiency in semiconductor manufacturing. Utilizing flexure-based fine Z-axis technology, hysteresis issues are avoided while achieving nanometer-level

• Z-Axis Travel: 0.0787402 to 0.4724412 inch
• Rated Speed: 393.7007874015748 in/sec
• Carriage Load: 5.62 lbs
• Motor Continuous Power: 0.00402066115470846 to 0.11793939387144815 HP

Description: hollow shaft. With optional coarse Z-axes, this module provides unprecedented control over wafer motion profiles and improves precision and efficiency in semiconductor manufacturing. Utilizing flexure-based fine Z-axis technology, hysteresis issues are avoided while achieving nanometer-level

• Z-Axis Travel: 0.0787402 to 0.4724412 inch
• Rated Speed: 393.7007874015748 in/sec
• Carriage Load: 5.62 lbs
• Motor Continuous Power: 0.00402066115470846 to 0.12464049579596226 HP

Description: achieve further improvements in low-voltage imaging resolution. The specimen chamber ports extend to 16, and the specimen exchange load-lock supports up to 8-inch wafer size (maximum diameter 208 mm), greatly expanding applications' coverage. The advanced scanning modes and enhanced automated

• Total Magnification: 1 to 2,500,000 X
• Resolution: 0.6 to 1 nm
• Accelerating Voltage: 0.02 to 30 kilovolts
• Grade: Benchtop, Research

Description: 1/4 wafer sawn and expanded on ring Product overview: GN25L53-GRP6 from Semtech is a Special Purpose Amplifier Ic for embedded electronics, industrial equipment, maintenance repair, OEM production, and component sourcing. It is useful for engineers and buyers comparing datasheets, replacement

• Features: Other
• Standards and Certifications: RoHS Compliant

Description: particles as well as the use of wafer scanners to locate and size isolated surface features. New sections cover the multimillion-dollar wafer scanner business, establishing that microroughness is the noise, not the signal, in these systems. Scatter measurements, now routinely used to

Description: 2.5' wafer I/O Embedded IPC Board supports, Intel® Elkhart Lake ATOM® x6000E Series, HDMI, LVDS, eDP, 2 x Intel 2.5 Gb Ethernet, 6 x USB, Touch Screen, 4 x COM, 1 x Mini PCIe, 1 x M.2, 1 x Nano SIM, HD Audio, 4DI / 4DO, SMBus LEX SYSTEM 2I640HW is a 2.5” (102 x 88 mm) embedded board and base

• RAM: 8,000 MB
• Operating Temperature: -4 to 158 F
• Communication Networks: Ethernet
• Chipset: Intel® Chipset

Description: generation Customization available upon request Applications Wafer scribing Full-cut wafer dicing Low-k dielectric grooving Micromachining of silicon, sapphire, ceramic, and metal Micro-via drilling PCB and flexboard cutting

• Wavelength Range: 354.7 nm
• Laser Power: 12,000 to 40,000 milliwatts
• Beam Area: 0.3 mm²
• Operating Voltage: 200 to 240 volts

Description: ceramic capacitors, Skyworks MIS chip capacitors offer higher Q, and a lower insertion loss of 0.04 dB, in a 50 Ohm system. Insulation resistance is greater than 105M Ohm. To accommodate high volume automated assembly methods, wafers can be supplied on expanded film frame. To reduce cost,

• Capacitance Range: 0.000033 microF
• Applications: RF / Microwave Capacitors
• Configuration / Form Factor: Surface Mount / Chip Capacitor

Description: molded shapes can meet ergonomic needs on one side and aesthetic needs on the other. Walls can be compressed for wafer-thin designs, expanded for over-stuffed designs or precisely varied for combination designs. Let Custom-Pak help you design great furniture at prices that will win markets.

Description: optical components, as well as the illumination and CCD imaging camera, allowing monitoring of any area of the wafer surface using microscopic images. This system uses a visible laser (670 nm) which can be used for a broad range of films. Sensor head Camera with CCD imaging A large objective

Description: specifically to handle low-level and high-impedance measurements encountered in semiconductor parametric tests on wafers and devices. This unique design provides two low-current circuits with specified 1pA maximum offset current for sensitive sub-picoamp measurement resolution and two C-V

Description: sufficiently low energy that it can be readily collimated. As a result, it is possible to irradiate a single device on a wafer. Radiation safety issues are more easily managed with an X-ray irradiator than with a cobalt-60 source. This is due both to the relatively low energy of the photons