Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies

Part 1: Introduction to Electronic Failure Analysis

Chapter 1: OVERVIEW OF ELECTRONIC COMPONENT RELIABILITY
Chapter 2: OVERVIEW OF ELECTRONIC SYSTEMS RELIABILITY
Chapter 3: PRODUCT LIABILITY

D. David Dylis

IIT Research Institute (IITRI)

1.1 INTRODUCTION

Failure analysis is the process of determining the cause of failure, collecting and analyzing data, and developing conclusions to eliminate the failure mechanism causing specific device or system failures. Failures can occur throughout a product s life cycle. These failures can result from design, workmanship, components and manufacturing processes, overstress, and maintenance. Table 1.1 generically outlines factors affecting reliability.

Table 1.1: Distribution of Factors Affecting Reliability1

Factor

Failure percentage

Maintenance shop

17

Hardware reliability

16

Retest OK

28

Design

21

Quality

18

It is all too often that a failure analyst has limited information concerning the cause of a failure. Details surrounding the cause will not only aid the analyst in the failure analysis process, but the results of the analysis also will be more meaningful when completed. A failure reporting, analysis, and corrective action system (FRACAS), as described in Chapter 2, is used by many organizations to track failures associated with their products. A FRACAS can provide the valuable information necessary to perform a complete and accurate failure analysis. When data is not available, the analyst may take the role of a private investigator to determine details surrounding the cause of failure. A complete and accurate failure analysis will allow a designer or user to take the action necessary to remedy the problem. Cost savings associated with the corrective action are...

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