Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies

Part 3: Electronic Failure Analysis for Specific Technologies

Chapter 13: SOLDER JOINTS
Chapter 14: FAILURE ANALYSIS OF PRINTED WIRING ASSEMBLIES
Chapter 15: WIRES AND CABLES
Chapter 16: SWITCHES AND RELAYS
Chapter 17: CONNECTION TECHNOLOGY
Chapter 18: FAILURE ANALYSIS OF COMPONENTS
Chapter 19: SEMICONDUCTORS
Chapter 20: POWER AND HIGH-VOLTAGE CONSIDERATIONS

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