Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies

By Perry L. Martin

INDEX

A

Abrasives

grinding, 8.13

polishing, 8.18

Absorption, X-ray, 5.9

Acoustic micro imaging, 2.4, 7.1

A-mode, 7.4

C-mode, 7.4

Aerospace electronics, 20.3

Aerospace power systems, 20.19

Altered electrical characteristics, 18.7

Ambient vacuum bake, 12.4

American Society for Testing and Materials standards, 17.33

AMI, see Acoustic micro imaging

Analyzing the evidence, 19.15

Arc tracking failures, 15.20

Artifacts, 8.45

ballooning, 8.49

bleedout, 8.46

embedded particles, 8.51

epoxy pull-away, 8.45

rounding, 8.48

scratches in the polished sample, 8.46

smearing, 8.48

Artificial intelligence, and thermography, 6.22

Assembly and packaging failure, 19.26 19.32

ATE, see Automated test equipment

Atomic absorption, 9.2

Atomic emission spectroscopy, 9.4

Atomic spectroscopy

detection limits, 9.5

interferences, 9.8

Automated test equipment, 10.17

Automatic optical inspection, 2.4

B

Backscatter mode, 11.26

Beam current density, 11.42

Bench handling, 2.6

Blind vias, 14.2

Bright-field illumination, 8.30, 18.24

Bright-field microscope, 4.37

Brightness, 11.16

Bulk analysis, 9.1

Buried vias, 14.2

Burn-in, 2.10

C

Cables, 10.19

Canadian Standards Association, 2.12

Capacitive touch switches, 16.4

Capacitor failure, 18.10

ceramic, 18.11

electrolytic, 18.12

film, 18.15

tantalum, 18.17

trim, 18.18

Capacitors, 10.21

Celsius or centigrade (metric system), 6.2

Centrifugal switches, 16.4

Chemical analysis, 9.1

Chemical etching, 18.22

Chestnut v. Ford Motor Company, 3.14

Chi-square test, 1.23

Chromatic aberration, 4.35

Circuit breakers, 16.8

Circuit breakers with hydraulic-magnetic trip mechanism, 16.4

Cleaning, 8.6

C-mode scanning acoustic microscope, 7.2

Coefficient of thermal expansion, 13.36

Cold starts for detecting moisture, 10.34

Color fringing, 4.35

Commercial electronics, 20.2

Commercial power considerations, 20.25

Component failure, 18.1

Composition resistors, 18.33

Concentric lay stranding, 15.5

Conductive anodic filament growth, 13.46

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Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies

TABLE OF CONTENTS

INDEX

A

B

C

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