TABLE OF CONTENTS Lawrence L. Ludwig, Jr.
Electronic Section, Failure Analysis and Physical Testing Branch,
Materials Science Division, Logistics Operations Directorate,
National Aeronautics and Space Administration
Electronic failure analysis (FA) is complex process with many intermediate steps to the final objective. Photography and optical microscopy are the techniques used to document (photodocument) that process, providing the analyst with a permanent visual record.
The purpose of photography and optical microscopy in FA is to provide a clear, concise set of views that document an FA investigation from start to finish. This photographic documentation leaves no portion of the process without visual support or validation. The statement the subject part was severely weathered with a high degree of exterior corrosion can mean faded paint and light surface rust (if the part is in Arizona) or green and white chloride/salt deposits along with a rust scale 0.25 in. in depth (if the part is at Kennedy Space Center). A thorough visual trail documenting the whole FA process validates the conditions found and the testing performed. This validation process leaves no room for misinterpretation of the conditions found, and it aids in explaining intricate anomalies...
