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Supplier: Epoxies Etc...
Description: 20-3290 is a high temperature two part epoxy system. This system has low thermal coefficient of expansion, good thermal shock resistance and high temperature service. 20-3290 is used in a wide variety of electronic potting and encapsulating applications.
- Use: Encapsulant / Potting Compound
- Form: Liquid
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has
- Compound Type: Electrical Insulation / Dielectric
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound, Gap Filling Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
- Industry Applications: OEM / Industrial
Encapsulants and Potting Compounds - Conap™ Flame Retardant Potting & Casting Compound -- CONATHANE® EN-2543Supplier: ACCRAbond, Inc.
Description: CONATHANES® EN-2541 and EN-2543 are filled, flame resistant polyurethane resins, specially formulated for general purpose electrical/electronic potting, casting and encapsulation. When tested in accordance with UL-94, flame resistance ratings of 94V-O are obtained. EN-2541 and EN-2543 have
- Form / Function: Encapsulant / Potting Compound
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Encapsulating / Potting
Description: Usable as a potting box, or general utility enclosure
- Shape: Rectangular
- Material: ABS
- Mounting: Wall Mount
- Features: Flame Retardant, Glue or Snap Together, RoHS Compliant
Supplier: RS Components, Ltd.
Description: Primary Application Category:Protection of Electronic Circuitry; Product Category:Conformal Coating; Operating Temperature Range:-40 - 60C (100C short-term)
- Form / Function: Conformal / Encapsulating Coating
Supplier: Henkel Corporation - Electronics
Description: Reliable moisture performance
- Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Potting Compound, Powder / Grain
- Features: Electronics / Semiconductors, UL Approved
- Use: Conformal Coating, Encapsulant / Potting Compound
- Form: Powder
Supplier: Shin-Etsu Silicones of America
Description: Highly flexible elastomers for use in potting and encapsulating electronics
- Cure Type / Technology: RTV / Room Temperature Curing
- Industry: Electronics
- Chemical / Polymer System Type: Silicone
Electrical and Electronic Resins - INSULCAST 118 FC Equal Ratio, Non-Abrasive, Potting/Casting Epoxy
Description: INSULCAST 118 FC is an equal ratio by weight of volume epoxy potting/casting compound designed for dispensing equipment. INSULCAST 118 FC exhibits good impact strength and mechanical shock resistance.
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors
- Compound Type: Thermally Conductive
- Material Form: Conformal / Encapsulating Coating
Supplier: Dow Polyurethanes
Description: and electronic potting. They contribute to an improvement in moisture vapor transmission resistance, while maintaining tensile strength, tear strength, flexibility and UV resistance. A very low Tg enables use over a broad temperature range. Applications Very favorable Moisture Vapor Transmission Rate
- Structure: Prepolymer
- Material Type: Type: Polyol / Polyureas
- End Product: Type: Elastomer
- Applications: Adhesives, Coatings, Sealants, Other
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Featured Products for Electronic Potting Top
ELANTAS PDG, Inc.
ELAN-Cast® E resins provide electrical insulation with the enhanced chemical resistance of an epoxy. Bectron® PK resins are single-component, low heat-cured polyurethanes offering excellent flexibility for protection of sensitive electronic components. (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS PDG, Inc.
TriStar Plastics Corp.
Potting and Encapsulation of Electronic Components
TriStar ’s Surface Modification Experts have teamed up with the leading manufacturers of electronic components to help them protect their sensitive devices from damage caused by moisture and chemicals, as well as the risks of pressure and vibration. Our latest application involves pre-treatment of ceramic piezo discs via plasma cleaning to guarantee a more-robust potting and encapsulation treatment. (read more)
Browse Surface Engineering Services Datasheets for TriStar Plastics Corp.
Di-Pak Potting & Encapsulating Materials
Electrical Insulating Compounds for Potting, Encapsulating, and Coatings. 1. Di-Pak - Elastomeric - High quality, impact resistant materials for potting, encapsulating, insulation, and components. 2. Di-Pak - Rigid - Production grade dielectric materials for potting, encapsulating, insulation, coatings, and components. Full Brochure (read more)
Browse Electrical and Electronic Resins Datasheets for Hapco, Inc.
EXACT Dispensing Systems
Dispensing Systems Application: Potting
Potting/Encapsulation: The process of encasing/protecting an electronic assembly within a container, typically using a thermosetting material which provides resistance to shock and vibration, or exclusion of moisture and corrosive agents. The main difference between potting and encapsulating is that with the latter, the container is removed from the article. Products for Potting/Encapsulation: Model 860-5. Model 1450 Double Acting. Model 9450 Single Acting. Model... (read more)
Browse Dispensing Valve Systems Datasheets for EXACT Dispensing Systems
Dow Corning Sylgard Encapsulants
Ellsworth Adhesives proudly carries Dow Corning Sylgard poly-dimethyl siloxane (PDMS) Encapsulants. They are used for a multitude of specialized tasks from protecting strain sensitive electronic components to creating soft lithography molds in the fabrication of new types of electronic, magnetic, and optical devices. Our Sylgard online selection is the most comprehensive listing; it includes kits, individual components, Sylgard Primer, and our most popular version Sylgard 184. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Ellsworth Adhesives
Powerful Polyurethane Solutions for Electronics
of high-end applications like electronic potting, and offer a superior combination of hydrophobicity, performance, and processability when compared with polyols of similar hydrophobic character. They contribute to an improvement in moisture vapor transmission resistance, while maintaining tensile strength, tear strength, flexibility, and UV resistance. Ask us for details. (read more)
Browse Foams and Foam Materials Datasheets for Dow Polyurethanes
Master Bond, Inc.
Unique UV Cure Adhesive for Temporary Bonding
and thermal shock. Master UV14-3 can be cured in much greater section thickness (up to 1/8 inch deep) compared to most conventional UV type systems, making it of value for various electronic and opto-electronic potting and encapsulation applications. Disassembly can be easily accomplished upon exposure to most conventional solvents such as acetone, MEK, etc. Master Bond UV14-3, UV cure adhesive, is durable and tough. The re-workable adhesive has a Shore D hardness of 30 and an elongation of 150%... (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc.
Parts by Number for Electronic Potting Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|2368049||RS Components, Ltd.||ITW Devcon||Structural Adhesives||Product Category:Adhesive; Primary Application Category:Potting Electronic Components; Bonding Ceramic; Ferrous/Non Ferrous; Ferrite; Wood; Glass; Concrete; Material:Epoxy; Curing Type:Fast; Pack Type:Cartridge; Pack Size:200ml|
|2368027||RS Components, Ltd.||ITW Devcon||Structural Adhesives||Product Category:Adhesive; Primary Application Category:Potting Electronic Components; Bonding Ceramic; Ferrous/Non Ferrous; Ferrite; Wood; Glass; Concrete; Material:Epoxy; Curing Type:Fast; Pack Type:Cartridge; Pack Size:400ml|
|2368011||RS Components, Ltd.||ITW Devcon||Structural Adhesives||Product Category:Adhesive; Primary Application Category:Potting Electronic Components; Bonding Ceramic; Ferrous/Non Ferrous; Ferrite; Wood; Glass; Concrete; Material:Epoxy; Curing Type:Fast; Pack Type:Cartridge; Pack Size:50ml|
|SUN SE11F1204-2.0-17||PEI-Genesis||Sunbank Electronics||Not Provided||MOLDING/POTTING ADAPTER|
|19-160||Digi-Key||GC Electronics||Tapes, Adhesives||POTTING SILICONE SEALANT|
Conduct Research Top
Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology
The Potting or Encapsulation of electronic components is a common engineering design tool to protect products from environmental exposure. Potting involves the covering or embedding of an electronic or electrical device. In most cases an assembly is placed in a case or shell and then a liquid
Turn-key Potting Benefits OEM Electronics Producer
to remove any moisture retained by the PC boards and to help ensure uniform flow of the potting material around the board’s intricate electronic components. This pre-heat oven is rated at 7.2 kw and is approximately 5.5 ft long. After pre-heating, the modules are automatically indexed and positioned
Managing Heat Transfer With Potting Compounds
Today's electronic designs are smaller in size and deliver more power, which requires that they run at higher temperatures. In order to maintain long life and high reliability, they must be able to dissipate that heat efficiently. Fans, vents and other cooling devices take up valuable design space
UV Curing Adhesives and Potting Compounds
. Ultraviolet curable formulations are materials that cure (harden or polymerize) when exposed to ultraviolet light. Epoxies Etc... has developed an extensive line of UV curing products designed to fit a wide range of electronic, aerospace, decorative, and medical device applications. Ultraviolet light
New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
Thermally Conductive Adhesives Keep Things Cool
Thermally conductive adhesives. and potting compounds are an important. weapon in the war against heat raging within. today's powerful electronic devices. T E C H S P O T L I G H T. Thermally Conductive. Adhesives Keep. Things Cool. Thermally conductive adhesives. and potting compounds
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Engineering Web Search: Electronic Potting Top
- Polycase - TF-2315TX - Electronic Enclosures - Potting...
- Polycase - TF-1521TX - Electronic Enclosures - Plastic,...
Epoxy Resin | Electronics Potting Compounds | Custom...
to find out more about getting the best price on the perfect electronic potting compound, epoxy resin for electronics, solar panel encapsulation or
:: Rand Polyproducts Pvt. Ltd. ::
Electronic Potting Filter Applications Encapsulation of electronic circuits Potting of Electronic Components
Find Electronic Potting Compound Suppliers, China Wholesale...
Find Electronic Potting Compound Suppliers, China Wholesale Suppliers
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- Electronic Product Magazine - Component and Technology News...
electronic goods - offers from electronic goods manufacturers,...
LED silicone of electronic potting silicone rubber Product Feature: Electronic potting compound silicone for good ...