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Supplier: Techsil Limited
Description: TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process. 20-3063 has an easy to use one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Strength: 450 kV/in
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Supplier: Allied Electronics, Inc.
Description: 3M Scotch-Weld™ Epoxy Potting Compound-Adhesives Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Use Temperature: -40 to 300 F
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: OKW Enclosures, Inc.
Description: Plastic enclosures for encapsulating electronics Comprehensive range of boxes for potting electronic assemblies. With special cost advantages for series type production. potted assemblies are protected from shock as well as temperature, dampness and chemical influences
- Depth: 0.5000 to 1.96 inch
- Features: RoHS Compliant
- Length / Height: 3.56 to 3.94 inch
- Material: ABS
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Supplier: Techsil Limited
Description: Techsil® RTV12 is a two-component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 has been designed to achieve primerless adhesion to many substrates, including metals
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: components is a factor. 3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: components is a factor. 3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: components is a factor. 3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Chemence Inc.
Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the elastomer resists weathering, ozone,
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound
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Supplier: Epoxies Etc...
Description: This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxies Etc...
Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 83.33 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Nuva-Sil 5083 potting & encapsulating compound is compatible with electronics, glass, metal, plastic, rubber and wood materials with a 7 day cure time. Delivers great performance with a shear strength of 100 (Steel to Glass) psi, 275 (Glass to Glass) psi, 35 (Aluminum to Glass)
- Dielectric Strength: 635 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3364 black potting & encapsulating compound is compatible with electronics materials with a 60 min cure time. Provides a 45 sec working time. Works in a mix ratio of 1:2. Delivers great performance with a shear strength of 1100 (Wood Pine) psi, 145 (Nylon) psi, 145
- Dielectric Strength: 813 kV/in
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.4300 W/m-K
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Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Sauereisen, Inc.
Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as an economical, zircon
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description UR5604 general purpose polyurethane potting compound is a two part, potting and encapsulation resin. It’s a good all round resin suitable for a huge range of electronic applications offering high performance protection from the environment. It maintains
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: transparency of the cured compound, the potted electronics can be easily inspected and the defect spotted. It’s low viscosity and low shore hardness allows for potting small or tight units. It also absorbs very little water making it an ideal choice for electronics operating in
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Flexible / Dampening: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: for potting and encapsulating electronics or components with limited spacing and where thermal dissipation is required. It has a wide operating temperature range and can be used in a variety of potting and encapsulation applications. For more information please refer to the TDS,
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description UR5547 general purpose electrical potting compound is a black polyurethane resin ideally suited to electronics with small or delicate components. The cured resin is semi-rigid, exhibiting very little stress on components, even when thermally cycled offering
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: ANZER
Description: ANZER offers many facets of electronic manufacturing. Whether it is building an alpha or beta prototype, or populating SMT and Through-Hole printed circuit boards, our flexible capabilities include: Complete Box Builds Sub-System Assembly High-Mix, Low-Volume SMT
- Design Services: Conceptual Product Development, Electrical Design Services
- Location: North America, United States Only, Midwest US Only
- Manufacturing: Printed Circuit Board Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Cabling
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Encapsulants and Potting Compounds - HYSOL ES4512HF Non-Conductive Potting Compound -- 8799551356929Supplier: Henkel Corporation - Electronics
Description: HYSOL ES4512HF is a two-part non-conductive, room temperature cure, halogen free potting compound. It is used in the consumer and industrial market.
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Bluestar Silicones USA Corp.
Description: Two-Component, Medium Viscosity, Addition Cure, Potting/Encapsulatin g Silicone Compound Properties Viscosity 44000 Hardness Sha 29 Description Bluesil V-217 is a clear, two component, medium viscosity, addition cure silicone compound. It is designed for potting and encapsulating
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
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Supplier: CHT USA Inc.
Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 353 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ValueTronics International, Inc.
Description: The M900 is a HiPot from Rod L Electronics. The M900 is a HiPot from Rod L Electronics.
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Supplier: ValueTronics International, Inc.
Description: The Q920315 is a HiPot from Clare. HiPot, or high potential, is a class of electronic test equipment used to verify electrical insulation. Engineers use HiPot-testing instruments on cables, wires, circuit boards, appliances, electric motors, and transformers. As a product
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Supplier: ValueTronics International, Inc.
Description: The 255A is a HiPot from Associated Research. HiPot, or high potential, is a class of electronic test equipment used to verify electrical insulation. Engineers use HiPot-testing instruments on cables, wires, circuit boards, appliances, electric motors, and transformers.
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Supplier: ValueTronics International, Inc.
Description: The 2925 is a HiPot from Slaughter. HiPot, or high potential, is a class of electronic test equipment used to verify electrical insulation. Engineers use HiPot-testing instruments on cables, wires, circuit boards, appliances, electric motors, and transformers. As a
- Types of Measurements: Insulation Resistance, Current Leakage Tester, Ground Bond Testers
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3517M, Epoxy, Underfill LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications. One component - requires no mixing Reworkable Low halogen content
- Coeff. of Thermal Expansion (CTE): 36.11 µin/in-F
- Viscosity: 2600 cP
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite SI 5083 is a one component, high strength, UV cured silicone. It is used for potting, coating and sealing of various electronic, automotive, military, and industrial components. 300 mL Cartridge.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 635 kV/in
- Elongation: 170 %
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Supplier: Wacker Chemical Corp.
Description: two-part, 1 : 1 mixing ratio low viscosity rapid cure low hardness (silicone gel) Application encapsulation of electronic components
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.89E7 to 4.44E7 µin/in-F
- Composition: Unfilled
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Featured Products Top
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for plastic to plastic,metal,glass and concrete,high temperature epoxy for plastic,industrial strength epoxy glue,best thermally conductive epoxy,low temperature epoxy adhesive,electronic epoxy encapsulant potting compounds and so on. (read more)
Browse Electrical and Electronic Resins Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
and supplier in china. DeepMaterial mainly offering one component epoxy adhesive,two component epoxy adhesive,epoxy encapsulant,UV Curing optical adhesives,epoxy conformal coating,smt epoxy adhesives,epoxy potting compound,waterproof epoxy and so on. DeepMaterial waterproof epoxy adhesive is (read more)
Browse Electrical and Electronic Resins Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
optional. Inside, there are fixing supports for PCBs and components in both the top and bottom sections. Alternatively, potting of electronic assemblies is possible. MINI-DATA-BOX can be specified in plan sizes 1.57” x 1.57”, 1.96” x 1.96”, 1.57” x 2.36” (read more)
Browse Electronic and Instrument Enclosures Datasheets for OKW Enclosures, Inc. -
top and bottom. Alternatively, potting of electronic assemblies is possible. MINI-DATA-BOX is molded from ASA+PC-FR (UL 94 V-0) for superior strength and UV stability. There are four plan sizes from 1.57” x 1.57” to 2.76” x 1.97”, and two heights: 0.59” and (read more)
Browse Electronic and Instrument Enclosures Datasheets for OKW Enclosures, Inc. -
,best thermally conductive epoxy,low temperature epoxy adhesive,electronic epoxy encapsulant potting compounds and so on. Epoxy adhesive for plastic is a powerful bonding agent that can be used for various applications. From repairing broken plastic objects to creating new ones, an epoxy adhesive can be (read more)
Browse Electrical and Electronic Resins Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Potting Materials for Electronic Applications ELANTAS PDG, Inc. offers a broad range of potting and encapsulation materials for electronic protection. State of the art (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS PDG, Inc. -
Choosing the right potting compound: Here is why it matters Potting compounds seal and protect electrical components from various stresses (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS PDG, Inc. -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS PDG, Inc. -
Join ELANTAS PDG, Inc. for a webinar on Innovative Solutions for Next-Generation Potting & Encapsulating, where you will: Discover how to use ELANTAS' Conashield™ "flood coat (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS PDG, Inc. -
Applications Electronic components and devices must meet high reliability demands in challenging environments, such as extreme temperatures, vibration or exposure to moisture or harsh chemicals. CONAP®, Conathane®, ELAN-Ton®and Bectron®potting materials provide highly (read more)
Browse Casting Resins Datasheets for ELANTAS PDG, Inc.
Conduct Research Top
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
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How to Achieve Several Efficiencies by Using Polyurethane Potting Compound for Electronics
and vibrations. This is where electronic potting comes in. The enclosure of the miniature electronic component will have to be filled up with suitable materials to protect them from shocks, vibrations, water, high temperature, chemicals, and other external factors.
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Potting Electronic Components
Filling an intended space with self-leveling materials is known as potting. This process is used among others to shield sensitive electronics from damaging outside influences or to provide camouflage or fire protection for components.
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PCB Potting Material in Electronic Manufacturing and Assembly
In electronic manufacturing, potting boxes are very common and act as enclosures. These protect the internal components of a box from environmental factors and physical damage. With potting, you can enhance the insulation of the electronics in question.
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Common Applications for Electronic Epoxy Encapsulant Potting Compounds
Electronic epoxy encapsulant potting compounds are materials used to protect electronic components from environmental factors such as moisture, dust, and temperature changes. These compounds are essential in the electronics industry as they help to improve the durability and reliability
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Electronic Epoxy Encapsulant Potting Compounds in Harsh Environments
Electronic epoxy encapsulant potting compounds are essential for protecting electronic components from harsh environments. These compounds provide a protective barrier that shields electronics from moisture, dust, and other contaminants that can cause damage or failure. In this article, we
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This is why you Need the Best Potting Material for Electronic Components
Potting material for electronic components is highly important for protecting product assemblies. Potting materials are specialized chemicals that are used to fill and seal holes and cavities. When these materials are used this way on the products, they protect the products against shock
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Choosing The Best Electronic Epoxy Encapsulant Potting Compounds For Your Needs
Electronic epoxy encapsulant potting compounds are essential for protecting electronic components from harsh environmental factors. However, with so many options available on the market today, choosing the right compound for your specific needs can be a daunting task.
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Handbook of Adhesive Chemical and Compounding Ingredients
Uses: Used as structural adhesive or miniature electronic potting compd.; good dielec. props.; bonds to most metals, ceramics, and plastics; applics. incl. bonding and/or sealing magnet and speaker assemblies, batteries, filters, end cap filling, structural materials, miniature potting and staking; AD-3 …
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Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
Leecure B-110 [Leepoxy Plastics] Chem. Descrip.: Boron trifluoride-based Uses: Hardener, epoxy curing agent providing water, heat and chem. resist. compds. with high physical str. and elec. props.; used in electronic potting compds., elec. varnishes, adhesives, filament winding, fiberglass composites, prepregs .
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Handbook of Green Chemicals
Chem. Descrip.: Dicyandiamide CAS 461-58-5; EINECS/ELINCS 207-312-8 Uses: Latent curing agent for epoxy resins; used in one-component adhesives, sealants, prepregs and film adhesives, electronic potting and encapsulating compds., and powd. coatings; avail. in varying particle sizes Regulatory …
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printing oil manufacturers & suppliers ( Page 31 ) - printing oil manufacturers, exporters, factories, suppliers, China printing oil
[Related Keywords : Silicone, silicone rubber, electronic potting silicone, silicone pad] .
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Materials Science and Engineering II
The dielectric loss and volume resistivity of epoxy electronic potting were measured via the electrical performance analysis.
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Iodide based polyamide stabilisers as potential risk for corrosion in electronics
namely Au4Al, Au2Al and Au5Al2.16 After making the wire bond, the IC is then encapsulated by epoxy mould compound or electronic potting gel.
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Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology
These products also have a limited depth of cure and therefore are not suitable for many electronic potting applications.
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rtv m 20 - offers from rtv m 20 manufacturers, suppliers, exporters & wholesalers
Electronic Potting Silicone Rubber .