Products/Services for Wafer Dicing Saw Blades
-
Saw Blades - (698 companies)Saw blades are cutting implements used in conjunction with saws and other cutting devices. There are many different types of products. Types of Saw Blades Examples include: band saw blades circular saw blades diamond saw blades scroll saw... -
Cutoff Wheels and Abrasive Saw Blades - (471 companies)...consist of very thin superabrasive wheels that are used to slice boules into semiconductor wafers, dice processed wafers into integrated circuit chips or dies, cut optical components, and perform other specialized cutting operations. Saws or cut-off... -
Blades (wind turbine) - (19 companies)Wind turbine blades are air-foil shaped blades that harness wind energy and drive the rotor of a wind turbine. Wind turbine blades are airfoil-shaped blades that harness wind energy and drive the rotor of a wind turbine. The airfoil-shaped-design...
-
Laser Cutting Services - (837 companies)Laser cutting services use industrial-grade lasers to cut metals, plastics, rubber, glass, stone, foam, and composite materials. Laser cutting is a CNC-controlled, non-contact, thermal process that provides quick, accurate cuts with a narrow kerf or cutting groove. -
Hand Saws - (153 companies)How to Select Hand Saws. What are Hand Saws. Hand saws are hand-held tools, either powered or manually-driven, that are designed to cut through softer materials. They accomplish cutting using a hard, serrated blade, or by using a wire... -
Sawing Machinery - (734 companies)...use and often have automatic or semi-automatic operation. Metal sawing requires a saw with a fine-toothed blade. As a general rule, at least three teeth should touch the material. The blade of a band saw machine is a narrow band of toothed metal. Band...
-
Power Saws - (27 companies)Operation. The primary function of power saws is to cut lumber, metal, plastics, and ceramics to length. These tools rely on motors or engines and a blade to cut and shape the material. AC-powered saws have various power outputs but are restricted...
-
Hole Saws - (51 companies)Hole saws, also referred to as hole cutters, are saw blades with a circular cutting profile. Hole saws are used in a drill and cut out a hole without cutting up the core material. Hole saws often has a centering drill for hole placement. Hole saws...
-
Wafer Cassettes - (14 companies)Wafer cassettes are used to transport and store wafers during semiconductor manufacturing operations. They are designed to house or carry several wafers of the same size and are available in a range of materials to support specific applications...
-
Wafer Chucks - (21 companies)Wafer chucks are used to handle semiconductor wafers during wafer processing applications. Common work clamping technologies include vacuum and electrostatic. Wafer chucks handle or hold wafers or substrates during wafer processing applications...
Product News
-
Abrisa Technologies
Micro Optic Precision XY Wafer Dicing Abrisa Technologies offers Precision XY Saw Cutting services utilizing processes originally developed for semiconductor wafer dicing. The camera assisted array saw cutting method is ideal when parts are rectangular and volumes high as well as when parts are small or when parts require XY dimensional tolerances such as 0.025mm with consistent perpendicularity of edges to faces. The process is key when small optical components must be fit/press fit or hermetically sealed and in need of low... (read more) -
Abrisa Technologies
Precision XY Saw Cutting of Glass,Wafers & Filters Precision XY Saw Cutting of Glass, Wafers & Filters. Micro-Optics ? Sensing ? Scanning ? Sights ? Indicators. Abrisa Technologies offers Precision XY Saw Cutting services utilizing processes originally developed for semiconductor wafer dicing. The camera assisted array saw cutting method is ideal when parts are rectangular and volumes high as well as when parts are small or when parts require XY dimensional tolerances such as 0.025mm with consistent perpendicularity of edges to faces... (read more) -
Abrisa Technologies
Precision XY Saw Cutting - Glass, Wafers, Filters Abrisa Technologies offers Precision XY Saw Cutting services utilizing processes originally developed for semiconductor wafer dicing. The camera assisted array saw cutting method is ideal when parts are rectangular and volumes high as well as when parts are small or when parts require XY dimensional tolerances such as 0.025mm with consistent perpendicularity of edges to faces. The process is key when small optical components must be fit/press fit or hermetically sealed and in need of low... (read more) -
Hangzhou Shalom Electro-optics Technology Co., Ltd.
Wafers and Substrates Features: Various kinds of substrates and wafers. A wide range of substrate materials. Manifold dimension, orientation, and other specifications available. Price competitiveness on the premise of ensured qualities. Hangzhou Shalom EO offers various kinds of Wafers and Substrates including SAW (Surface Acoustic Wave) grade crystal wafers, optical grade crystal wafers, substrates and wafers for thin film growth (including HTSC thin film, magnetic and ferroelectric thin film, GaN thin film... (read more) -
Norton Abrasives
New Masonry and Tile Diamond Blades Norton Clipper has two new diamond blades designed for fast, smooth cutting of hard materials: Norton Clipper Slicer Turbo Mesh and the improved Norton Clipper Aero-Jet. Built with a unique mesh segment design and reinforced inner core to minimize chipping, Slicer Turbo Mesh cuts extra hard ceramics and porcelain fast. Featuring large arch shaped drop-down segments and a ventilated steel center, Aero-Jet is made for cool, precision cuts on ceramic and stone tiles, granite, marble, and very hard... (read more)Browse Cutoff Wheels and Abrasive Saw Blades Datasheets for Norton Abrasives -
Xiamen Innovacera Advanced Materials Co., Ltd.
Zirconia ceramic cutter blade INNOVACERA ceramic blades are made of zirconia. Zirconia has many advantages over steel, especially for industrial applications. It has the following characteristics: 1. The blade is extremely sharp, no need to re-sharp, extremely durable. 2. Anti-corrosion, no iron smell, never rust, easy to clean. Will not bring odour to food. 3. Non-toxic, hygienic and environmentally friendly. The surface density is large, it is not easy to be contaminated with food juice, and it reduces the chance... (read more)Browse Zirconium Oxide and Zirconia Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Charles Ross & Son Company
Saw-tooth Dispersers vs. Rotor/stator Mixers The saw-tooth disperser and rotor/stator mixer are two of the most widely used high speed mixers yet many are unaware of the differences in their utility and operating capacities. Knowing the unique attributes of these devices is important in mixer selection and process optimization. High speed mixing is often required when incorporating solids into liquid especially when the powders are difficult to wet out, or when large amounts of solids are involved. Mixing under high shear and turbulent... (read more)Browse Rotor-Stator Mixers Datasheets for Charles Ross & Son Company -
Ametek Solartron Metrology
Jet Engine Turbine Blade Gauging Specialists in the investment casting and machining of alloy metals, such as aluminium and titanium, which are primarily used for jet aircraft engines and airframes, have to measure the dimensions of the blades after surface grinding. After casting, the turbine blades undergo surface grinding to complete the collaboration of surfaces. The dimensions of the blade post-grind then need to be accurately measured as the initial proportions from the casting will have changed slightly. A precision... (read more)Browse Styli and Probes Datasheets for Ametek Solartron Metrology -
Saint-Gobain Performance Ceramics & Refractories
Ceramics for Semiconductor Wafer Processing A range of Hexoloy (R) SA and SG components are used in semiconductor wafer processing equipment, including vacuum chucks, reactor tubes for thermal oxidation, wafer grinding and polishing plates, chemical mechanical polishing (CMP) blocks, wafer carrier trays and clamps. These applications take advantage of Hexoloy silicon carbide's thermal expansion match to silicon, high elastic modulus, chemical inertness, and high thermal conductivity. Hexoloy silicon carbide is well suited as a structural... (read more)Browse Semiconducting Materials Datasheets for Saint-Gobain Performance Ceramics & Refractories -
Precision Polymer Engineering Ltd.
Wafer Handling Components PPE are experts in providing low contact force solutions for your wafer handling requirements. The PPE range of materials includes elastomers with both low and high coefficients of friction, to allow tailoring of wafer retention force. High purity elastomer materials, such as PPE's Perlast (R) (FFKM) and Kimura (HPE) grades, are widely utilized for wafer handling components, such as end-effector pads, as they prevent particulation due to their wholly organic nature. NEW - PPE will launching... (read more)
More Information
Indicates content that may require registration and/or purchase.
-
Microfabrication techniques for trapped ion quantum information
processing
• shadow masks and wafer dicing saw blades Section 3 on page 67 discusses the apparatus used to test the boron doped silicon traps.
-
Thermal Transport in Oblique Finned Micro/Minichannels
Channels are cut on the backside of the silicon thermal test chips using wafer dicing saw blades of different width.
-
Microneedle Array for Measuring Wound Generated Electric Fields
The silicon microneedles are shaped by a combination of deep reactive ion etching (DRIE), mechanical sawing with wafer dicing blade , and sharpening with a silicon isotropic etchant, HNA.
-
A high-repetition-rate femtosecond laser for thin silicon wafer dicing
The cutting speed of laser dicing is several times higher than the traditional saw blade dicing when wafer thickness reduces below 100 µm.
-
Thin silicon wafer dicing with a dual-focused laser beam
These factors introduce serious limitation in current saw blade semiconductor wafer dicing technology and needs new processing tools.
-
A cost-effective solution for packaging the arrayed waveguide grating (AWG) photonic components
… independent AWG devices can be produced from a single wafer by means of optimum de- sign and waveguide fabrication, only a number of them can ac- tually be obtained from a wafer through the conventional saw blade dicing technology, because of its …
-
http://dspace.mit.edu/bitstream/handle/1721.1/80207/44416014-MIT.pdf?sequence=2
tape with a diamond-impregnated blade mounted on a wafer dicing saw (K & S .
-
Use of Stress To Produce Highly Oriented Tetragonal Lead Zirconate Titanate (PZT 40/60) Thin Films and Resulting Electrical Properties
Substrates and films were shadow-masked and sputter-coated with ϳ1700 Å of Pt to serve as top electrodes followed by dicing with a diamond blade wafer saw .
-
Saw + LMJ: a hybrid semiconductor dicing solution
Keywords: Water jet-guided laser, wafer dicing , hybrid dicing, blade saw .
-
Crystalline silicon solar cells with laser ablated penetrating V‐grooves: Modeling and experiment
… and 3.1 mm, spaced 7, 8, and 10 mm, respectively, were fabricated by a combination of optical lithography and deep RIE [15]; – deep ($100 mm) V-grooves were cut in Si wafers using a dicing saw and beveled blades [16].
