Specialty / Other Thin Film Materials
from DuPont Electronics & Imaging
DuPont ™ Kapton ® B polyimide film exhibits an excellent balance of physical, chemical, and electrical properties over a wide temperature range, with superior dimensional stability at elevated temperatures. The matte black color of Kapton ® B provides a uniform, aesthetically pleasing... [See More]
- Material: Polyimide
- Features: Dielectric
- Applications: Semiconductors; Heaters, Antennas, LED Circuitry, Precision Laser Ablation Applications
from Saint-Gobain Performance Ceramics & Refractories
Hexoloy SG, a variant of silicon carbide containing graphitic carbon, is electrically conductive and can be readily DC magnetron sputtered. Silicon carbide thin film coatings are optically transparent, abrasion and corrosion resistant, temperature stable, and have excellent adhesion on a variety of... [See More]
- Material: Hexoloy
- Applications: Decorative / Shielding; Optical Coatings; Magnetic storage; Vapor Barrier
- Type: Sputtering Target
- Resistivity: 1
from Wacker Chemical Corp.
LUMISIL ® 815 A/B is a low viscous, addition-curing, two-part silicone that cures to a transparent rubber. Especially suited for LED fabrication. Special features. two-part, 1 : 1 mixing ratio. low viscous. rapid heat curing. forms a rubber on vulcanization. almost constant properties between... [See More]
- Material: Dielectric or Ceramic; Silicone
- Applications: Semiconductors
- Type: ECD Material
- Index of Refraction: 1.41
from Indium Corporation
Benefits. Simple. Efficient. Customizable. High throughput. Simply Efficient. Indium Corporation ’s OnSpec CIG alloy sputtering targets, made from copper (Cu), indium (In), and gallium (Ga), are used to produce high-effi ciency CIGS (Cu/In/Ga/di-selenide) solar cells. CIG targets offer tight... [See More]
- Material: Copper-Induim-Gallium
- Applications: Semiconductors
- Type: Sputtering Target; Planar; Rotary or Cylindrical
- Width / OD: 50.38 to 381
from Plansee SE
We supply evaporation boats manufactured from tungsten, molybdenum, molybdenum-lanthanum (ML), molybdenum-yttrium oxide (MY) or tantalum. Our evaporation boats offer a good level of electrical conductivity and possess low vapor pressures combined with a very high melting point. When powered on, our... [See More]
- Material: Molybdenum; Tungsten; Tantalum
from Saint-Gobain Coating Solutions
Saint-Gobain Coating Solutions applies its vast knowledge of materials technology to produce a range of high-quality rotatable sputtering targets for architectural glass, automotive glass, smart windows, PV-thin film, Flat Panel Display, web coating, coatings on polymer films. The unique combination... [See More]
- Material: Barrier; Silicon; Oxides; Silicide; Molybdenum; Tungsten; Niobium, Tantalum, Silicon-Aluminum, Titanium
- Applications: Architectural Glass, PV, FPD, BIPV
- Type: Rotary or Cylindrical
- Purity: 99.97
from Materion Corporation
Materion Microelectronics & Services ’ collection of innovative engineered materials increases manufacturing yields extends target life and offers the lowest overall cost of ownership. Materion Microelectronics & Services employs a wide range of manufacturing options to meet the needs... [See More]
- Material: Various
- Type: Sputtering Target; Precursor
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Au. Fits. ESQ 212. Volume. 13 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Indium Corporation
Gallium is a by-product of aluminum extracted during the processing of bauxite into alumina. It can also occasionally be found in Zn ore. We are a refiner and supplier of gallium materials. Indium Corporation supplies gallium: in the form of shot and ingot, in the form of sputtering targets, after... [See More]
- Material: Gallium
- Applications: Photovoltaic or solar cell; Semiconductors
- Type: EvapSource; Sputtering Target; Planar; Rotary or Cylindrical; Powder, Granule, Lumps, Flakes, etc.
- Purity: 99.99 to 100
from Plansee SE
Thermal evaporation (resistance evaporation) is a coating method used as part of the PVD process (Physical Vapor Deposition). The material that is to form the subsequent layer is heated in a vacuum chamber until it evaporates. The vapor formed by the material condenses on the substrate and forms the... [See More]
- Material: Molybdenum; Tungsten; Tantalum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Fits. Pot crucible, ESQ 110. Volume. 14 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Indium Corporation
Advantages of the Indium Sulfamate Bath. - One of the easiest plating baths to operate and maintain. - Proven formulation, capable of heavy production. - Extremely stable operation and long life. - Constant plating rate. - Operates at room temperature. - Wide current density range of operation. -... [See More]
- Material: Indium Sulfamate
- Applications: Photovoltaic or solar cell; Semiconductors
- Type: Plating
- Purity: 99.99
from Plansee SE
During plasma spraying, metal or ceramic powder is melted in a plasma arc and then propelled at high speed against the workpiece that is to be coated. In this way, it is possible to deposit impermeable, adherent layers on tools and various equipment components. When used in plasma spray guns, our... [See More]
- Material: Tungsten-copper
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Fits. ESV 6/1 , ESV 4. Volume. 2 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Indium Corporation
Indium metal has played a key role in technology advances since it was first investigated by Dr. William S. Murray in 1924 in Utica, NY, and with the creation of the Indium Corporation in 1934, the two have been tied together, leading, and supporting the advancement of technologies that we all rely... [See More]
- Material: Indium
- Applications: Photovoltaic or solar cell; Semiconductors
- Type: EvapSource; Sputtering Target; Planar; Rotary or Cylindrical; Powder, Granule, Lumps, Flakes, etc.; Plating
- Melting Temperature: 314
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Fits. 4-hole crucible, ESQ 212. Volume. 23 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Indium Corporation
Indium Corporation is a leading global supplier of pure tin, tin alloys, and compounds. Tin metal is primarily obtained from the mineral cassiterite (SnO2) and is extracted by roasting cassiterite in a furnace with carbon. Rigorous quality standards and advanced analytical instrumentation, such as... [See More]
- Material: Tin
- Applications: Photovoltaic or solar cell; Semiconductors
- Type: EvapSource; Sputtering Target; Powder, Granule, Lumps, Flakes, etc.
- Melting Temperature: 449
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Fits. 6-hole crucible, ESQ 212. Volume. 23 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Fits. ESV 14/3. Volume. 23 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Volume. 24 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Ag, Cu, In. Fits. 4-hole crucible, ESQ 113, ESQ 212. Volume. 25 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Cu, Dielectrica. Fits. 4-hole crucible, ESQ 212. Volume. 25 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Ag. Fits. 4-hole crucible, ESQ 113. Volume. 25 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Fits. Pot crucible, ESQ 150. Volume. 30 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Fits. Pot crucible, ESQ 110. Volume. 4 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Ag, Cu, Dielectrica. Fits. 4-hole crucible, ESQ 110. Volume. 4 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Ag, Cu. Fits. Pot crucible, ESQ 110. Volume. 55 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Fits. 6-hole crucible, ESQ 212. Volume. 6 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Dielectrica. Fits. 4-hole crucible, ESQ 212. Volume. 7 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum
from Umicore Metal Deposition Solutions
Specifications. Type. Liner. Material. Molybdenum. Can be used in. Au. Fits. ESQ 212. Volume. 8 ccm [See More]
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Material: Barrier; Molybdenum;
Molybdenum