Products & Services
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Supplier: Accuris
Description: GUIDELINES FOR CHIP ON BOARD TECHNOLOGY IMPLEMENTATION
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Supplier: Accuris
Description: Guidelines for Chip-on- Board Technology Implementation
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Supplier: Optima Technology Associates, Inc.
Description: Focused on meeting the unique needs of customers needing advanced PCB assembly and testing. We have invested in leading technology and skills to ensure customers can access cost-effective solutions using leading technologies. Production services are flexible enough to handle low
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
- Location: North America, United States Only, Northeast US Only, South Asia Only
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly,
- Material Acquisition: Customer Supplied, Vendor Supplied
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Single Board Computers (SBC) - VME Board with Freescale MPC8540 System-on-chip Processor -- MVME3100Supplier: Artesyn Embedded Power
Description: The Artesyn Embedded Technologies MVME3100, featuring the system-on-chip Freescale MPC8540 processor, offers a growth path for VMEbus customers with applications on the previous generation of VME, specifically the MPC8240 and similar (MPC603 family) processors. The
- CPU Speed: 833 MHz
- Communication Networks: Ethernet
- Features: Watchdog Timer?
- Flash Memory (RAM): 64000 to 128000 KB
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Supplier: Accuris
Description: Surface mounting technology Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
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Supplier: Accuris
Description: Surface mounting technology \x96 Part 5-1: Surface strain on circuit boards \x96 Strain gauge measurement applied to chip components
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Supplier: Mettrix Technology Corporation
Description: Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. Our assembly services are divided into two tiers: Quick Turn Prototyping, and
- Location: North America, United States Only, Northeast US Only
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability
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Supplier: Mettrix Technology Corporation
Description: Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. Our assembly services are divided into two tiers: Quick Turn Prototyping, and
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Other
- Location: North America, United States Only, Northeast US Only
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly,
- Material Acquisition: Customer Supplied, Vendor Supplied
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Description: IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the
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Description: excellent linearity. This book is a comprehensive review of the technology and of the design methods that go with it." -Alberto Sangiovanni-Vincente lli Professor, University of California, Berkeley Cofounder, Chief Technology Officer, Member of Board Cadence Design Systems Inc.
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Supplier: Telit IoT Solutions, Inc.
Description: ATOP 2.5G is Telit’s platform for automotive telematics on-board units (OBU‘s). It simplifies creating applications such as road pricing and eCall by including all required technologies: 2G cellular for voice and data communication, Quad band GSM assures global
- Features: RoHS Compliant
- Supply Voltage: Other
- TJ: -40 to 85 C
- Technology: GSM, GPRS, GPS
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Supplier: Telit IoT Solutions, Inc.
Description: The ATOP 3.5G is the new Telit platform for automotive telematics on-board units (OBU-s). It simplifies creating applications such as road pricing and eCall by integrating all required technologies, including: 3G cellular for voice and data communication GPS/GLONASS for
- Features: RoHS Compliant
- Supply Voltage: Other
- TJ: -40 to 85 C
- Technology: GSM, GPRS, GPS
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Supplier: Infineon Technologies AG
Description: voltage regulator to supply external loads. Produced on Infineon's first-in-industry automotive qualified 130 nm Smart Power technology, the Infineon MOTIX™ Embedded Power System-on-Chip solution offers an unmatched level of integration as well as system cost to performance
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 347 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Infineon Technologies AG
Description: linear voltage regulator to supply external loads. Produced on Infineon's first-in-industry automotive qualified 130 nm Smart Power technology, the Infineon MOTIX™ Embedded Power System-on-Chip solution offers an unmatched level of integration as well as system cost to
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 302 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Infineon Technologies AG
Description: voltage regulator to supply external loads. Produced on Infineon's first-in-industry automotive qualified 130 nm Smart Power technology, the Infineon MOTIX™ Embedded Power System-on-Chip solution offers an unmatched level of integration as well as system cost to performance
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 302 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Infineon Technologies AG
Description: regulator to supply external loads. Produced on Infineon's first-in-industry automotive qualified 130 nm Smart Power technology, the Infineon Embedded Power System-on-Chip solution offers an unmatched level of integration as well as system cost to performance optimization for
- Clock Frequency: 40 MHz
- Interface: Other Interface
- Operating Temperature: 302 F
- Operating Voltage: 5.5 to 28 volts
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Supplier: Mettrix Technology Corporation
Description: Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. Our assembly services are divided into two tiers: Quick Turn Prototyping, and
- Cable Types / Application: Audio / Visual, Coaxial / RF, Computer / Networking, Consumer Electronics / Appliances, Fiber Optic, Grounding Cable, Medical, Power Cable, Robotics, Ribbon Cable
- Location: North America, United States Only, Northeast US Only
- Supplier Capability: Design Assistance, CAD Documentation / Drawings, Prototype Quantities, Production Quantities, Testing and Evaluation, Just-In-Time Capability
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1136524-ATA6623-EK Category: Development Boards, Kits, Programmers>Evaluati on and Demonstration Boards and Kits Type: Interface Package: Bulk Standard Package: 1 Function: LIN Supplied Contents: Board(s) Primary Attributes: LIN
- Category: Development Board
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1046737-ATA6614-EK Category: Development Boards, Kits, Programmers>Evaluati on and Demonstration Boards and Kits Type: Interface Package: Box Standard Package: 1 Function: LIN + MCU Supplied Contents: Board(s) Primary Attributes: LIN
- Category: Development Board
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1046736-ATA6613-EK Category: Development Boards, Kits, Programmers>Evaluati on and Demonstration Boards and Kits Type: Interface Package: Box Standard Package: 1 Function: LIN + MCU Supplied Contents: Board(s) Primary Attributes: LIN
- Category: Development Board
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1048051-EVB9514 Category: Development Boards, Kits, Programmers>Evaluati on and Demonstration Boards and Kits Type: Interface Package: Box Standard Package: 1 Function: Ethernet Controller (PHY and MAC) Supplied Contents: Board(s
- Category: Development Board
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Supplier: TOP-electronics USA
Description: industry RTC (as low as 14 nA), these are the first semiconductors based on Ambiq's innovative SPOTTM (Subthreshold Power Optimized Technology) CMOS platform. The AM1815 includes on-chip oscillators to provide minimum power consumption, full RTC functions including battery
- Category: Development Board
- Supported System: Wireless Systems
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Supplier: TOP-electronics USA
Description: industry RTC (as low as 14 nA), these are the first semiconductors based on Ambiq's innovative SPOTTM (Subthreshold Power Optimized Technology) CMOS platform. The AM1805 includes on-chip oscillators to provide minimum power consumption, full RTC functions including battery
- Category: Development Board
- Supported System: Wireless Systems
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Supplier: U.S. Sensor
Description: U.S. Sensor™s leadless chip thermistor elements are designed for use on hybrid substrates, integrated circuits or printed circuit boards. They have silver metallization on their top and bottom surfaces which are suitable for various contact techniques including epoxy or
- Lead Style: Leadless
- Package / Electrode Type: Chip / Surface Electrodes
- Resistance (@25°C): 100 to 100000 ohms
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Supplier: RS Components, Ltd.
Description: A range of Programmable System-on-chip (PSoC®) products from Cypress Semiconductor incorporating analogue sub-systems with capacitive sensing hardware. These configurable devices include an on-board MCU and are aimed primarily at capacitive touch screen applications. Processing Unit
- Interface: Other Interface
- Operating Voltage: Up to 5.25 volts
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Supplier: RS Components, Ltd.
Description: A range of Programmable System-on-chip (PSoC®) products from Cypress Semiconductor incorporating analogue sub-systems with capacitive sensing hardware. These configurable devices include an on-board MCU and are aimed primarily at capacitive touch screen applications. Processing Unit
- Interface: Other Interface
- Operating Voltage: Up to 5.5 volts
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Supplier: RS Components, Ltd.
Description: A range of Programmable System-on-chip (PSoC®) products from Cypress Semiconductor incorporating analogue sub-systems with capacitive sensing hardware. These configurable devices include an on-board MCU and are aimed primarily at capacitive touch screen applications. Processing Unit
- Interface: Other Interface
- Operating Voltage: Up to 5.5 volts
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Supplier: RS Components, Ltd.
Description: A range of Programmable System-on-chip (PSoC®) products from Cypress Semiconductor incorporating analogue sub-systems with capacitive sensing hardware. These configurable devices include an on-board MCU and are aimed primarily at capacitive touch screen applications. Processing Unit
- Interface: Other Interface
- Operating Voltage: Up to 5.25 volts
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Supplier: Artesyn Embedded Power
Description: The MVME4100 single-board computer from Artesyn Embedded Technologies incorporates the Freescale 8548E processor, industry-leading storage options, extensive I/O and flexible expansion options including an on-board PMC site and up to four optional XMC sites via expansion cards.
- CPU Speed: 1300 MHz
- Cache Memory (L1 & L2): 512 KB
- Communication Networks: Ethernet
- Features: Watchdog Timer?
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Supplier: Keytronic
Description: Printed Circuit Board Assembly Best in class PCBA technologies We provide our customers with the highest quality printed circuit board assembly design and assembly services. We specialize in accommodating our customers' requirements for volume, mix, and complexity
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
- Location: North America, United States Only, Southern US Only, Northwest US Only, Midwest US Only, East Asia / Pacific Only, Other
- Manufacturing: Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn
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Supplier: Richardson RFPD
Description: The PE42540 is a HaRP™-enhanced Absorptive SP4T RF Switch developed on UltraCMOS® process technology. This switch is designed specifically to support the requirements of the test equipment and ATE market. It is comprised of four symmetric RF ports and has very high isolation. An
- Category: Development Board
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Supplier: Acromag, Inc.
Description: system with modern technology. This high-performance SBC features a FPGA-based VME to PCIe-bridge that solved the end of life issue with the TSI148 VME interface chip. Ruggedized SODIMM removable memory is surrounded by heat sink material to provide a robust hold-down mechanism. The
- CPU Speed: 1500 MHz
- Chipset Type: Intel® Chipset
- Communication Networks: Ethernet
- I/O Bus Specifications: PCI, VMEbus
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Description: . They are low-power system-on-chip (SoC) processors with integrated graphics and support for up to four cores operating at up to 1.91 GHz. Along with best-in-class performance-per-watt , the E3800 family supports extremely low operating temperatures, and its power-efficient 22 nm
- Communication Networks: Ethernet
- Hard Drive Support?: Other
- I/O Bus Specifications: USB, VPX, Other
- Ports: Serial Ports, USB
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Supplier: Indocomp Systems, Inc.
Description: Features ISA Bus Compatible Single Board Computer 486DX2-66 or 486DX4-100 CPU Up to 128 MB FPM/EDO DRAM 256KB Cache (expandable to 512KB) On-board PC-104 Connector Socket for DiskOnChip from M-Systems supports up to 24MB Flash Disk On-board
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Supplier: Littelfuse, Inc.
Description: Littelfuse leadless chip thermistor elements are designed for use on hybrid substrates, integrated circuits or printed circuit boards. They have silver metallization on their top and bottom surfaces which are suitable for various contact techniques including epoxy or
- Lead Style: Leadless
- Resistance (@25°C): 50000 ohms
- Temperature Range: -55 to 150 C
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Featured Products Top
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ensure optimal performance. Fluoropolymer Coatings on Circuit Boards As cellular network technology advances, printed circuit boards face higher performance and quality demands. AGC’s Fluon+™ EA-2000 functionalized perfluoro resin coats and protects PCBs by (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc. -
Rego’s chip coolers are a series of cooling solutions for multi-functional chips. These products are well designed in thermal performance based on our professional manufacturing know how. We have the sophisticated equipment to precisely measure its performance to meet your requirements (read more)
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PLPCOS 450D laser diode has multimode beam and is chip on submount. PLPCOS 450D is ideal for material processing, projection applications demanding reliable operations with a long lifetime and stable output power. PLPCOS 450D - Typical Features — Optical output power (read more)
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Derived from our HYPERION si155 platform, the HYPERION Single Board Interrogator leverages the high performance of the Micron Optics patented fiber Fabry-Perot filter and wavelength reference technology. The HYPERION Single Board Interrogator features groundbreaking (read more)
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are RTD Platinum sensors without leads suitable for automatic assembling on PCB by soldering and bonding. Depending on the connection process and the required temperature range you could choose between the different types: FlipChip 0402 -> 3FC (read more)
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Semiconductor market benefits from the CHIPS Act The CHIPS Act impacts the semiconductor market, is vital to the global economy and requires a skilled workforce to (read more)
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to protect them from dust and moisture. Proprietary seal coatings used on the blowers’ internal components also help protect equipment from harsh weather conditions in outdoor and extreme environments. TITAN series blowers include full-wave in-board circuit designs with multiple (read more)
Browse Electronic Cooling Fans Datasheets for Pelonis Technologies, Inc. -
generators are new MEMS-based clock-system-on-a-chip (ClkSoC) family, offering 10X higher performance in half the size, compared to standalone oscillators and clocks. Chorus’ new approach includes clock, oscillator and resonator technologies in an integrated chip, simplifying system clock architecture and accelerating design time by up to six weeks. (read more)
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a robust, thin-film technology on an alumina substrate, the HR TSX WB2 Series provides reliable and stable performance in critical industries such as aerospace, space, and defence. Key features and benefits: Compact 0404 form factor – saves valuable (read more)
Browse Chip Resistors Datasheets for Molex Signal Tech Industrial Ltd.
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Containment Technologies Group
environments and personnel protection are now available. This type of technology was developed to protect workers who handle radioactive materials from the hazards of exposure to radiation. The electronics industry advanced the technology to reduce losses of chips as a result of airborne
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
No shortages seen in NOR flash The NOR flash memory market in 2003 remains in a state of oversupply, apparently belying earlier forecasts that anticipated shortages would begin sending prices higher this year. Ex-Intel technology guru joins NuTool's board Gerald Marcyk, formerly director
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
with the daunting task of leading the company's resurrection. Creative Tech forms ZiiLabs to exploit 'stemcell computing' SoC British graphics chips specialist 3DLabs Ltd. has had another makeover, and is now part of a new initiative with its parent, Singapore based Creative Technology, dubbed ZiiLabs
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TFT LCD Interface
A TFT LCD display module consists of a TFT LCD panel, one or more COG (chip-on-glass) or COB (chip-on-board) driver ICs, a backlight, and an interface. Several TFT display interface technologies exist today. Picking the right interface depends on specific end-product concerns. There are several
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. Computer games, I-Spy and MP3 players are among the best products to prevent children from getting board in the back seat of a car, according to a new report. Zoran settles with MediaTek, UMC Zoran and its wholly-owned subsidiary, Oak Technology, have entered into an agreement to settle litigation
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
workforce as part of an initiative to significantly reduce expenses. In addition, the company said its board recommend the shareholders also approve a plan to dissolve the company following completion of the asset sale. Greece's Helic forms alliance with ComSilica in broadband chip market ATHENS
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Technologies Inc. (La Jolla, Calif.) will make Leon, an open-source, 32-bit Sparc-like processor, the heart of its licensable system-on-chip (SoC) platform. NEC plans run at cellular handsets ncouraged by the success of its fold-up handsets for Japan's i-Mode service, NEC Corp. is reshaping its cellular
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
version 17.1 from Cimmetry Systems adds support for pc-board layout and schematic formats, along with features such as cross-probing. Outsourcing services put chip designers on edge The acceleration of overseas outsourcing of information technology services in recent years has some circuit designers
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Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials > WLCSP WITH LEAD-FREE SOLDER BUMPS ON PCB/SUBSTRATE
Tsukada, Y., “Solder Bumped Flip Chip Attach on SLC Board and Multichip Module,” in Chip on Board Technologies for Multichip Modules, Lau, J. H., ed., Van Nostrand Reinhold, New York, pp. 410–443, 1994.
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Microvias: For Low Cost, High Density Interconnects > Solder Joint Reliability of Flip Chip on Microvia PCB/Substrate
Lau, J. H., Chip On Board Technologies for Multichip Modules, Van Nostrand Reinhold, New York, 1994.
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3D packaging for space application: imagination and reality
3D integration seems necessarily synonymous with a technology breakdown : the move to non-hermetic or quasi-hermetic packaging and the introduction of Chip on Board technology .
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Is hermitic encapsulation of GaAs MMIC still required for space applications?
The next step could be now to move from these standard hermetic sealing processes of GaAs devices to an organic encapsulation solution with processes derived from the Chip on Board technology .
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Design and procurement of eutectic Sn/Pb solder-bumped flip chip test die and organic substrates
Lau J. H., Chip On Board Technolo- gies for Multichip Modules,Van Nostrand Reinhold, New York, 1994.
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Current trends in military microelectronic component packaging
[32] L. E. Gates, H. S. Fenger, A. R. Janus, and C. P. Minning, “Application of chip on board technology in military systems,” in Proc. NEPCON West’96 Conf., Anaheim, CA, 1996, pp. 1084–1089.
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Low-cost miniaturized electronics for space application with chip-on board technology-design, manufacturing and reliability considerations
[ll] J. H. Lau, “ Chip on Board Technologies for Multichip Modules,” Van Nostrand Reinhold, first edition, New York, Chapter 7, pp. 275-342, 1994.
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Advanced Flip Chip Packaging
1990) COB ( Chip on Board ) technology .