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Supplier: Accuris
Description: Guidelines for Chip-on- Board Technology Implementation
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Supplier: Accuris
Description: GUIDELINES FOR CHIP ON BOARD TECHNOLOGY IMPLEMENTATION
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Standards and Technical Documents - Guidelines for Chip-on-Board Technology Implementation -- SM-784Supplier: IPC International, Inc.
Description: DESCRIPTION Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives,
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Supplier: Accuris
Description: Surface mounting technology Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
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Supplier: Accuris
Description: Surface mounting technology \x96 Part 5-1: Surface strain on circuit boards \x96 Strain gauge measurement applied to chip components
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Supplier: Artesyn Embedded Power
Description: The Artesyn Embedded Technologies MVME3100, featuring the system-on-chip Freescale MPC8540 processor, offers a growth path for VMEbus customers with applications on the previous generation of VME, specifically the MPC8240 and similar (MPC603 family) processors. The
- Clock Speed: 833 MHz
- Main Memory (RAM): 512 MB
- CE / FCC Certified: Card is CE / FCC Certified
- Features: Controller / Processor, Other
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Description: IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the
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Supplier: IPC International, Inc.
Description: DESCRIPTION Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on
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Supplier: Telit IoT Solutions, Inc.
Description: ATOP 2.5G is Telit’s platform for automotive telematics on-board units (OBU‘s). It simplifies creating applications such as road pricing and eCall by including all required technologies: 2G cellular for voice and data communication, Quad band GSM assures global network coverage, GPS
- Bias / Operating Current: 3 mA
- TJ: -40 to 85 C
- Technology: GPRS, GPS, GSM
- Interface: I2C, USB
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Supplier: Mettrix Technology Corporation
Description: Mettrix Technology provides a full range of electronic assembly services from prototyping to medium quantity production runs of up to 10,000 pieces or more depending on the type of assembly required. Our assembly services are divided into two tiers: Quick Turn Prototyping, and
- PCB Type: Double-Sided Boards, Flexible Boards, Multi-Layer Boards, Rigid-Flexible Boards, SMT Components, Single-Sided Boards, THT Components
- Supplier Capability: Just-In-Time Capability, PCB Assembly, PCB Design / Layout, Production Quantities, Prototype Quantities, Testing and Evaluation
- Features: North America, Northeast US Only, United States Only
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Supplier: Optima Technology Associates, Inc.
Description: Focused on meeting the unique needs of customers needing advanced PCB assembly and testing. We have invested in leading technology and skills to ensure customers can access cost-effective solutions using leading technologies. Production services are flexible enough to handle
- Testing Services: Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
- Production Capabilities: Cabling, High Volume, Mid Volume, Prototype / Low Volume, Quick Turn
- Design Services: Conceptual Product Development, Electrical Design Services, Mechanical Design Services, Software Design Services
- Material Acquisition: Customer Supplied, Vendor Supplied
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Description: and expert advice, Silicon Germanium covers all the key aspects of this technology and its applications. Beginning with a brief introduction to and historical perspective of IBM's SiGe technology, this comprehensive guide quickly moves on to: * Detail many of IBM's SiGe
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1046736-ATA6613-EK Category: Development Boards, Kits, Programmers>Evaluation and Demonstration Boards and Kits Type: Interface Package: Box Standard Package: 1 Function: LIN + MCU Supplied Contents: Board(s) Primary Attributes: LIN-SBC
- Category: Development Board
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Supplier: Richardson RFPD
Description: The PE42540 is a HaRP™-enhanced Absorptive SP4T RF Switch developed on UltraCMOS® process technology. This switch is designed specifically to support the requirements of the test equipment and ATE market. It is comprised of four symmetric RF ports and has very high isolation. An
- Category: Development Board
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Supplier: Keytronic
Description: Printed Circuit Board Assembly Best in class PCBA technologies We provide our customers with the highest quality printed circuit board assembly design and assembly services. We specialize in accommodating our customers' requirements for volume, mix, and complexity. Our customer's time
- Testing Services: Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
- Design Services: Conceptual Product Development, Electrical Design Services, Mechanical Design Services, Software Design Services
- Features: East Asia / Pacific Only, Midwest US Only, North America, Northwest US Only, Other, Southern US Only, United States Only
- Production Capabilities: High Volume, Mid Volume, Prototype / Low Volume, Quick Turn
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Supplier: Richardson RFPD
Description: inclusion of on-chip controllers simplifies system integration. A dual-port source synchronous LVDS interface simplifies the digital interface with existing FGPA/ASIC technology. On-chip controllers are used to manage external and internal clock domain variations
- Category: Development Board
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Supplier: Infineon Technologies AG
Description: MOSFET technology with a 3.3 x 3.3 mm leadless power package for very compact and robust automotive system solutions. It is based on Infineon’s latest silicon automotive PowerMOS technology, optimized to meet and exceed the energy efficiency and power density requirements of
- Bus Width: 32-Bit
- Category: Development Board
- Features: Other
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Supplier: Indocomp Systems, Inc.
Description: Features ISA Bus Compatible Single Board Computer 486DX2-66 or 486DX4-100 CPU Up to 128 MB FPM/EDO DRAM 256KB Cache (expandable to 512KB) On-board PC-104 Connector Socket for DiskOnChip from M-Systems supports up to 24MB Flash Disk On-board PCI IDE port supports
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Supplier: Infineon Technologies AG
Description: System-on-Chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for optimized EMC behavior. Its peripheral set
- Clock Speed: 40 MHz
- Supply Voltage (Vcc): 5.5 to 28 volts
- Operating Temperature: -40 to 150 C
- Bits: 32 Bit
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Supplier: Infineon Technologies AG
Description: System-on-Chip solution includes four fully integrated NFET drivers optimized to drive a 2-phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for optimized EMC behavior. Its peripheral set
- Clock Speed: 40 MHz
- Supply Voltage (Vcc): 5.5 to 28 volts
- Operating Temperature: -40 to 150 C
- Bits: 32 Bit
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Supplier: Infineon Technologies AG
Description: system-on-chip solution includes two fully integrated NFET drivers optimized to drive a single phase motor via four external power NFETs, a charge pump enabling low voltage operation and programmable current along with current slope control for optimized EMC behavior. Its peripheral
- Clock Speed: 40 MHz
- Supply Voltage (Vcc): 5.5 to 28 volts
- Operating Temperature: -40 to 150 C
- Bits: 32 Bit
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Supplier: TOP-electronics USA
Description: RTC (as low as 14 nA), these are the first semiconductors based on Ambiq's innovative SPOTTM (Subthreshold Power Optimized Technology) CMOS platform. The AM1815 includes on-chip oscillators to provide minimum power consumption, full RTC functions including battery backup
- Category: Development Board
- Supported System: Wireless Systems
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Supplier: TOP-electronics USA
Description: RTC (as low as 14 nA), these are the first semiconductors based on Ambiq's innovative SPOTTM (Subthreshold Power Optimized Technology) CMOS platform. The AM1805 includes on-chip oscillators to provide minimum power consumption, full RTC functions including battery backup
- Category: Development Board
- Supported System: Wireless Systems
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Supplier: Artesyn Embedded Power
Description: The Artesyn Embedded Technologies MVME7100, featuring the system-on-chip MPC864xD processor, offers a growth path for VMEbus customers with applications on the previous generation of VME, specifically the MPC74xx processors. The system-on-chip implementation offers
- Clock Speed: 1,300 MHz
- Main Memory (RAM): 2,000 MB
- CE / FCC Certified: Card is CE / FCC Certified
- Features: Controller / Processor, Other
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Supplier: IPC International, Inc.
Description: DESCRIPTION Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine,
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Supplier: Artesyn Embedded Power
Description: industries are upgrading to the MVME6100 series to take advantage of its enhanced performance features while protecting their investment in their existing VMEbus infrastructure. The MVME6100 series was the first VMEbus board designed with the Tundra Tsi148 VMEbus interface chip
- Clock Speed: 1,267 MHz
- Main Memory (RAM): 2,000 MB
- CE / FCC Certified: Card is CE / FCC Certified
- Features: Controller / Processor, Other
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Supplier: Ohmite Manufacturing Co.
Description: Power Chip Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other
- Resistance Range: 0.25 to 10,000,000 ohms
- Tolerance: 1 to 10 +/- %
- Temperature Coefficient (TCR): 50 to 450 ±ppm/°C
- Power Rating: 3 to 100 watts
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Supplier: Artesyn Embedded Power
Description: The MVME4100 single-board computer from Artesyn Embedded Technologies incorporates the Freescale 8548E processor, industry-leading storage options, extensive I/O and flexible expansion options including an on-board PMC site and up to four optional XMC sites via expansion cards.
- Clock Speed: 1,300 MHz
- Main Memory (RAM): 2,000 MB
- CE / FCC Certified: Card is CE / FCC Certified
- Features: Controller / Processor, Other
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Supplier: Indocomp Systems, Inc.
Description: On-board PCI IDE port supports two drives Dual FDD controller supporting 2.88 MB drives Two RS-232 Ports with 16550 FIFOs, one Parallel controller DiskOnChip socket provides memory up to 288MB 16 Level Watch Dog Timer On-board PS/2 Mouse/keyboard connector Plug & Play
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Supplier: Richardson RFPD
Description: The HLC Series of Multilayer Organic High Current Inductors is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. Based on AVX’s patented multilayer organic technology (US patent
- Inductance Range: 0.0056 microH
- DCR: 0.5 ohms
- Rated DC Current: 375 milliamps
- SRF: 8,000 MHz
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Supplier: U.S. Sensor
Description: U.S. Sensor™s leadless chip thermistor elements are designed for use on hybrid substrates, integrated circuits or printed circuit boards. They have silver metallization on their top and bottom surfaces which are suitable for various contact techniques including epoxy or
- Resistance (@25°C): 100 to 100,000 ohms
- Package / Electrode Type: Chip / Surface Electrodes
- Lead Style: Leadless
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Supplier: ZBA, Inc.
Description: The ZBA BT44-111S is a Class 1 surface mount Bluetooth module based upon the CSR Blue-core 4 chip. The BT44-111S has been designed to be embedded into a variety of end user equipment such as Medical devices, automotive applications etc. This class 1 module is especially desireable when the
- Data Rate: 2,000 to 3,000 kbps
- Operating Frequency: 2,400 to 2,480 MHz
- Maximum Transmission Distance: 100 m
- Supply Voltage: 2.7 to 3.6 volts
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1341278-MIC45205-1YMP-TR Category: Power Supplies - Board Mount - DC DC Converters Series: MIC45205 Type: Non-Isolated PoL Module Features: Remote On/Off, OCP, OTP, SCP Package: Tape & Reel Size / Dimension: 0.31" L x 0.31" W x 0.12" H (8.0mm x 8.0mm x 3.0mm)
- Output Voltage (Volt): 4.5 to 26 volts
- Operating Temperature: -40 to 125 C
- Features: Other
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Supplier: Acromag, Inc.
Description: Celeron-based board for cost-sensitive applications FPGA-based VME to PCIe bridge Intel 8-Series QM87 PCH chipset Up to 1.50GHz CPU Up to 16GB DDR3L ECC RAM Dual PMC/XMC Sites The XVME-6700 will add 7 to 10 years of life to your system with modern technology. This high-performance SBC
- Clock Speed: 1,500 MHz
- Main Memory (RAM): 16,000 MB
- Features: Controller / Processor, Other
- Ports / Interfaces: Ethernet, Serial Interface (RS232, RS422, RS485), USB
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Supplier: Win Source Electronics
Description: Manufacturer: Artesyn Embedded Technologies Win Source Part Number: 283886-PTH12060LAST Packaging: Tape and Reel Type: Non-Isolated PoL Module Mounting Style: SMD Features: Remote On/Off, SCP, UVLO Applications: ITE (Commercial) Voltage - Output 1: 0.8 ~ 1.8V Efficiency: 88% Categories: Power
- Output Power: 55 watts
- Operating Temperature: -40 to 85 C
- Features: Other
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Featured Products Top
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ensure optimal performance. Fluoropolymer Coatings on Circuit Boards As cellular network technology advances, printed circuit boards face higher performance and quality demands. AGC’s Fluon+™ EA-2000 functionalized perfluoro resin coats and protects PCBs by (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc. -
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PLPCOS 450D laser diode has multimode beam and is chip on submount. PLPCOS 450D is ideal for material processing, projection applications demanding reliable operations with a long lifetime and stable output power. PLPCOS 450D - Typical Features — Optical output power (read more)
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are RTD Platinum sensors without leads suitable for automatic assembling on PCB by soldering and bonding. Depending on the connection process and the required temperature range you could choose between the different types: FlipChip 0402 -> 3FC (read more)
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to protect them from dust and moisture. Proprietary seal coatings used on the blowers’ internal components also help protect equipment from harsh weather conditions in outdoor and extreme environments. TITAN series blowers include full-wave in-board circuit designs with multiple (read more)
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generators are new MEMS-based clock-system-on-a-chip (ClkSoC) family, offering 10X higher performance in half the size, compared to standalone oscillators and clocks. Chorus’ new approach includes clock, oscillator and resonator technologies in an integrated chip, simplifying system clock architecture and accelerating design time by up to six weeks. (read more)
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Containment Technologies Group
environments and personnel protection are now available. This type of technology was developed to protect workers who handle radioactive materials from the hazards of exposure to radiation. The electronics industry advanced the technology to reduce losses of chips as a result of airborne
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
No shortages seen in NOR flash The NOR flash memory market in 2003 remains in a state of oversupply, apparently belying earlier forecasts that anticipated shortages would begin sending prices higher this year. Ex-Intel technology guru joins NuTool's board Gerald Marcyk, formerly director
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
with the daunting task of leading the company's resurrection. Creative Tech forms ZiiLabs to exploit 'stemcell computing' SoC British graphics chips specialist 3DLabs Ltd. has had another makeover, and is now part of a new initiative with its parent, Singapore based Creative Technology, dubbed ZiiLabs
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TFT LCD Interface
A TFT LCD display module consists of a TFT LCD panel, one or more COG (chip-on-glass) or COB (chip-on-board) driver ICs, a backlight, and an interface. Several TFT display interface technologies exist today. Picking the right interface depends on specific end-product concerns. There are several
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. Computer games, I-Spy and MP3 players are among the best products to prevent children from getting board in the back seat of a car, according to a new report. Zoran settles with MediaTek, UMC Zoran and its wholly-owned subsidiary, Oak Technology, have entered into an agreement to settle litigation
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
workforce as part of an initiative to significantly reduce expenses. In addition, the company said its board recommend the shareholders also approve a plan to dissolve the company following completion of the asset sale. Greece's Helic forms alliance with ComSilica in broadband chip market ATHENS
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Technologies Inc. (La Jolla, Calif.) will make Leon, an open-source, 32-bit Sparc-like processor, the heart of its licensable system-on-chip (SoC) platform. NEC plans run at cellular handsets ncouraged by the success of its fold-up handsets for Japan's i-Mode service, NEC Corp. is reshaping its cellular
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
version 17.1 from Cimmetry Systems adds support for pc-board layout and schematic formats, along with features such as cross-probing. Outsourcing services put chip designers on edge The acceleration of overseas outsourcing of information technology services in recent years has some circuit designers
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Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials > WLCSP WITH LEAD-FREE SOLDER BUMPS ON PCB/SUBSTRATE
Tsukada, Y., “Solder Bumped Flip Chip Attach on SLC Board and Multichip Module,” in Chip on Board Technologies for Multichip Modules, Lau, J. H., ed., Van Nostrand Reinhold, New York, pp. 410–443, 1994.
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Microvias: For Low Cost, High Density Interconnects > Solder Joint Reliability of Flip Chip on Microvia PCB/Substrate
Lau, J. H., Chip On Board Technologies for Multichip Modules, Van Nostrand Reinhold, New York, 1994.
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3D packaging for space application: imagination and reality
3D integration seems necessarily synonymous with a technology breakdown : the move to non-hermetic or quasi-hermetic packaging and the introduction of Chip on Board technology .
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Is hermitic encapsulation of GaAs MMIC still required for space applications?
The next step could be now to move from these standard hermetic sealing processes of GaAs devices to an organic encapsulation solution with processes derived from the Chip on Board technology .
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Design and procurement of eutectic Sn/Pb solder-bumped flip chip test die and organic substrates
Lau J. H., Chip On Board Technolo- gies for Multichip Modules,Van Nostrand Reinhold, New York, 1994.
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Current trends in military microelectronic component packaging
[32] L. E. Gates, H. S. Fenger, A. R. Janus, and C. P. Minning, “Application of chip on board technology in military systems,” in Proc. NEPCON West’96 Conf., Anaheim, CA, 1996, pp. 1084–1089.
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Low-cost miniaturized electronics for space application with chip-on board technology-design, manufacturing and reliability considerations
[ll] J. H. Lau, “ Chip on Board Technologies for Multichip Modules,” Van Nostrand Reinhold, first edition, New York, Chapter 7, pp. 275-342, 1994.
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Advanced Flip Chip Packaging
1990) COB ( Chip on Board ) technology .