Conductive Epoxy Solder

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These

• Viscosity: 12,000 to 20,000 cP
• Use Temperature: 662 F
• Thermal Conductivity: 0.9 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.666666666666668 to 124.44444444444444 µin/in-F

Description: : it is perfectly adapted for the lead-free solder reflow. Its reactivity enables it to be cured at 150C in less than 2 hours. Its outstanding features are : high ionic purity, high thermal conductivity and good adhesion on current surfaces./span>

• Viscosity: 20,000 cP
• Thermal Conductivity: 7 W/m-K
• Coeff. of Thermal Expansion (CTE): 27.77777777777778 to 94.44444444444444 µin/in-F
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Grease / Paste, Thermal / Heat Conductive

Description: effective heat sink adhesive. This Conductive Silver Epoxy comes in two 7g syringes. Epoxy electrically conductive adhesive with reaction product of epichlorohydrin and bisphenol F, silver chemical component.

Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks

• Features: Electrically Conductive, Thermal / Heat Conductive
• Industry: Electronics
• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These

• Viscosity: 800 to 1,600 cP
• Use Temperature: 482 F
• Thermal Conductivity: 1.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These

• Use Temperature: 482 F
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 28.88888888888889 to 49.44444444444444 µin/in-F
• Viscosity: 25,000 to 45,000 cP

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These

• Viscosity: 25,000 to 45,000 cP
• Use Temperature: 482 F
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F

Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic

• Features: Electrically Conductive, Thermal / Heat Conductive
• Industry: Electronics
• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks

• Features: Electrically Conductive, Thermal / Heat Conductive
• Industry: Electronics
• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: AI Technology Prima-Solder ME8456 Epoxy Paste Adhesive is a thermally conductive, electrically, reworkable, pure silver filled epoxy paste adhesive. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials

• Viscosity: 130,000 cP
• Thermal Conductivity: 7.9 W/m-K
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic

• Features: Die Bonding Adhesive / Compound, Electrically Conductive
• Industry: Electronics
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It can also be used as a "cold solder" for heat sensitive

• Viscosity: 6,500 cP
• Substrate Compatibility: Ceramic / Glass, Metal
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.

• Use Temperature: 752 F
• Thermal Conductivity: 1.1538232 W/m-K
• Tensile Strength (Break): 7,500 psi
• Features: Die Bonding Adhesive / Compound, Filled, Grease / Paste, Thermal / Heat Conductive

Description: Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is particularly suitable

• Viscosity: 20,000 cP
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: Electrically Conductive Resins These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin

• Viscosity: 25,000 cP
• Cure / Technology: Anaerobic
• Industry: Automotive, Electronics
• Features: Electrically Conductive

Description: AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched

• Viscosity: 255,000 cP
• Thermal Conductivity: 7.9 W/m-K
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: AI Technology EG8050-E is an electrically conductive, silver filled epoxy paste adhesive. It exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG8050-E can be readily reworked at 80 to 100 ºC and is fitting

• Viscosity: 180,000 cP
• Thermal Conductivity: 7.9 W/m-K
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System, Two Component System

Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic

Description: possible at the surface, side or rear surface. Abrisa Technologies offers Total Solutions inclusive of transparent conductive coatings, bus bars and wire bonding on our supply of fabricated specialty glasses. Bus Bar Types Chrome-Nickle-Gold – Solderable, Anti-Corrosion Silver Epoxy –

• Busbar Type: Laminate Busbars
• Busbar (Conductor) Material: Other

Description: computing. This edgebond reinforces the Ball Grid Array (BGA) while avoiding contact with solder interconnects beneath the component. Its fluorescent appearance aids in efficient and accurate visual inspection. For industries that require both high temperature resilience and component

• Industry: Automotive, Electronics, Semiconductors / IC Packaging
• Chemical System: Epoxy (EP)
• Features: Thermally Conductive

Description: Abrisa Technologies’ Transparent Conductive Heaters incorporate coatings of Indium Tin Oxide (ITO), Index-Matched Indium Tin Oxide (IMITO) or Indium Molyb-denum Oxide (IMO) and are ideal window and display glass solutions when anti-fogging or de-icing, and high throughput and clarity are

• Features: Electric, Other

Description: Henkel Loctite Ablestik 56C Silver, formerly Emerson and Cuming ECCOBOND, is two component, heat curing, epoxy adhesive resin that is used to replace hot soldering for electrical connections. It offers high strength bonds, non-flowing properties, long pot life, high thermal conductivity,

• Tensile Strength (Break): 870.221036143182 psi
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces.

• Type: Electrically Conductive
• Industry: Electronics (PCB / SMT Assembly)

Description: The OLI110 consists of an LED and N-P-N silicon phototransistor that is electrically isolated, but optically coupled on a ceramic leadless chip carrier (LCC) surface mount package. The epoxy coating on the OLI110 allows the device to withstand normal solvent cleaning operations. Surface

• Isolation Voltage: 1,500 volts
• Output: Phototransistor

Description: a Lambertian radiation pattern. Additionally, these LEDs are die attachable with conductive epoxy, solder paste or solder preforms, as well as the eutectic method

Description: Plated Through Holes (PTH) type universal PCB with a 2.54mm hole-to-hole pitch. Inexpensive and economical PCB made using robust, heat-resistant and non-conductive glass epoxy. Easily mounted onto bosses or standoffs via the mounting holes at each corner. Environmentally friendly

Description: generated. This electrically isolated voltage can be used to drive the gates of Metal Oxide Semiconductor (MOS) devices. Device mounting is achieved with reflow soldering or conductive epoxies.

• Isolation Voltage: 1,500 volts

Description: additional ground bonding ribbon is not required. The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable.

• Attenuation: 1 to 30 dB
• Attenuator Type: Fixed
• Package Type: Flat Pack (FPAK)

Description: output. The integrated photodiode transistor improves the bandwidth by orders of magnitude as compared to standard phototransistors. The internal shield provides excellent commonmode immunity performance. Device mounting is achieved with reflow soldering or conductive epoxies.

Description: a Lambertian radiation pattern. Additionally, these LEDs are die attachable with conductive epoxy, solder paste or solder preforms, as well as the eutectic method. These vertically structured, low forward voltage LED chips are approximately 170 microns in height. Cree's

Description: terminations are recommended for use with conductive epoxy, gold is recommended for wire bonding, and tin plated nickel for soldering. Choice of termination materials: 100% tin plated nickel barrier is standard (palladium silver, gold, or tin-lead solder is available) Wraparound

• Resistance Range: 0.1 to 100,000,000 ohms
• Tolerance: 0.1 to 20 +/- %
• Temperature Coefficient (TCR): 400 ±ppm/°C
• Power Rating: 50,000,000 to 1,000,000,000 watts