Conductive Epoxy Solder

Description: low humidity uptake : it is perfectly adapted for the lead-free solder reflow. Its reactivity enables it to be cured at 150C in less than 2 hours. Its outstanding features are : high ionic purity, high thermal conductivity and good adhesion on current surfaces./span>

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
• Composition: Filled
• Compound Type: Electrically Conductive, Thermally Conductive

Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Electrically Conductive, Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 26.11 to 110 µin/in-F
• Composition: Filled
• Compound Type: Electrically Conductive, Thermally Conductive

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 23.33 to 125 µin/in-F
• Composition: Filled
• Compound Type: Electrically Conductive, Thermally Conductive

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
• Composition: Filled
• Compound Type: Electrically Conductive, Thermally Conductive

Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Electrically Conductive, Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Electrically Conductive, Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 22.78 to 90 µin/in-F
• Composition: Filled
• Compound Type: Electrically Conductive, Thermally Conductive

Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Electrically Conductive
• Cure Type / Technology: Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: Electrically Conductive Resins These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic

• Chemical / Polymer System Type: Epoxy (EP)
• Compound Type: Electrically Conductive
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Industry Applications: Automotive

Description: DESCRIPTION: G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Compound Type: Electrically Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: DESCRIPTION: G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on advanced proprietary

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Compound Type: Electrically Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Compound Type: Electrically Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: DESCRIPTION: G6E-NS10™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10™ has been developed based on advanced

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Compound Type: Electrically Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: LOCTITE ABLESTIK 57C, Epoxy, Assembly LOCTITE® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the TDS for alternate cure schedules. Electrically conductive Thermally

• Cure Type / Technology: Two Component System
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
• Thermal Conductivity: 1.75 W/m-K
• Use Temperature: 76 to 248 F

Description: LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It can also be used as a "cold solder" for heat sensitive

• Cure Type / Technology: Two Component System
• Substrate / Material Compatibility: Ceramic / Glass, Metal
• Viscosity: 6500 cP

Description: LOCTITE ABLESTIK 83CJ, Epoxy, Assembly LOCTITE® ABLESTIK 83CJ adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures. LOCTITE

• Cure Type / Technology: Two Component System
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic

Description: 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Filled
• Compound Type: Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: LOCTITE 3629C, Epoxy, Surface mount adhesive LOCTITE® 3629C epoxy is formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed provide controlled dot size and shape, making it particularly suitable for high speed dispensing.

• Cure Type / Technology: Single Component System
• Viscosity: 165000 cP

Description: AI Technology Prima-Solder ME8456 Epoxy Paste Adhesive is a thermally conductive, electrically, reworkable, pure silver filled epoxy paste adhesive. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials

• Cure Type / Technology: Single Component System
• Thermal Conductivity: 7.9 W/m-K
• Viscosity: 130000 cP

Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic

Description: AI Technology EG8050-E is an electrically conductive, silver filled epoxy paste adhesive. It exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG8050-E can be readily reworked at 80 to 100 ºC and is fitting

• Cure Type / Technology: Two Component System, Single Component System
• Thermal Conductivity: 7.9 W/m-K
• Viscosity: 180000 cP

Description: AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched

• Cure Type / Technology: Single Component System
• Thermal Conductivity: 7.9 W/m-K
• Viscosity: 255000 cP

Description: , Anti-Corrosion Silver Epoxy – Economical, Easy-to-Pattern, 3 Bond Surface Options, Wire Bonding Silver Frit – Solderable, Durable, High Adhesion Wire Soldering – Other Materials Transparent Conductive Coatings Single Layer

• Busbar (Conductor) Material: Other
• Busbar Type: Laminate Busbars

Description: Henkel Loctite Ablestik 56C Silver, formerly Emerson and Cuming ECCOBOND, is two component, heat curing, epoxy adhesive resin that is used to replace hot soldering for electrical connections. It offers high strength bonds, non-flowing properties, long pot life, high thermal

• Cure Type / Technology: Two Component System
• Tensile Strength (Break): 870 psi

Description: , fabrication, HIE™ chemical strengthening or heat tempering, transparent conductive coatings, AR coatings, bus bars, electrical connectivity, wire bonding or soldering, connectors, screen printed ceramic frit or epoxy ink graphics, laser marking and applied gaskets.

• Fuel / Energy Source: Electric

Description: A 2 part electrically conductive silver epoxy for general purpose prototype, repair and rework applications. This epoxy resin adhesive is incredibly strong and quick to cure, saving you time when you need a secure bond that is quick to set. With excellent electrical

• Compound Type: Electrically Conductive
• Material Form: Specialty / Other

Description: replacement for soldered/brazed joints where temperature is a consideration, and as a thermally conductive adhesive. After curing, hard and wear resistant. High electrical conductivity. Resin to hardener mix ratio: 1:1 by weight. Full instructions supplied Product Type = Epoxy

• Compound Type: Electrically Conductive
• Material Form: Specialty / Other
• Thermal Conductivity: 11 W/m-K
• Use Temperature: -67 to 302 F

Description: . Not affected by UV light. Resistant to PCB cleaning solvents. Medium strength cure allows component removal for rework. Hardness (shore) 85. Dielectric constant 3.5 @ 1 kHz Type = Thermal Conductive Adhesive Product Material = Epoxy Package Type = Syringe Package Size = 10 ml

• Compound Type: Thermally Conductive
• Material Form: Specialty / Other
• Thermal Conductivity: 0.2500 to 0.3000 W/m-K
• Use Temperature: -40 to 266 F

Description: ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces.

• Compound Type: Electrically Conductive
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: packages and electronic assemblies, with the capability to attach a metal can or lid onto a package. STAYCHIP F614-3A was specifically developed for superior adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates. Non-conductive and Electrically

• Compound Type: Electrically Conductive
• Cure Type / Technology: Thermosetting / Crosslinking
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging

Description: mounting can be accomplished with either conductive epoxies or by reflow soldering. Special electrical parametric selections are available upon request.

• Isolation Voltage: 1500 volts
• Optocoupler Output: Phototransistor

Description: A six-layer combination rigid flex circuit has six conductive copper layers. The two most common design types are as follows: Six-Layer Rigid Flex – Two flex layers and four rigid layers Six-Layer Rigid Flex – Four flex layers and two rigid layers

• Applications: Automotive Equipment, Commercial Equipment, Industrial Equipment, Medical Equipment, Telecommunication Equipment, Other
• Certifications and Approvals: ISO, RoHS, Other
• Component Mounting: Press Fit, Surface Mount, Through-Hole
• Features: Multi Layer, Rigid Flex, Shielding

Description: A four-layer combination rigid flex circuit has four conductive copper layers. Typically, a four-layer has two flexible layers and two rigid layers. Rigid flex circuits have been used in the military and aerospace industries for more than 20 years. In most rigid flex circuit boards

• Applications: Automotive Equipment, Commercial Equipment, Industrial Equipment, Medical Equipment, Telecommunication Equipment, Other
• Certifications and Approvals: ISO, RoHS, Other
• Component Mounting: Press Fit, Surface Mount, Through-Hole
• Features: Multi Layer, Rigid Flex, Shielding

Description: enables a Lambertian radiation pattern. Additionally, these LEDs are die attachable with conductive epoxy, solder paste or solder preforms, as well as the eutectic method

Description: uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS,

• Frequency Range: 17000 to 26000 MHz
• Maximum Gain: 19 dB
• Output Power( P_1dB): 23 dBm
• Package Type: Other

Description: uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS,

• Amplifier Type: Power Amplifier
• Frequency Range: 43500 to 46500 MHz
• Maximum Gain: 14 dB
• Output Power( P_1dB): 24 dBm

Description: repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave

• Amplifier Type: Low Noise Amplifier
• Frequency Range: 20000 to 40000 MHz
• Maximum Gain: 20 dB
• Noise Figure: 2 dB

Description: electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is

• Input Frequency Range: 18000 to 21000 MHz
• Input Power: 0.0 dBm
• Multiplying Factor: 2X
• Package Type: Other