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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Filled
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Flexible / Dampening
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.94
- Dissimilar Substrates: Yes
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Flexible / Dampening, Laminating / Composites, Anti-static / ESD Control
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
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Supplier: Master Bond, Inc.
Description: Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles.
- Coeff. of Thermal Expansion (CTE): Over 33 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Dielectric Constant (Relative Permittivity): 3.76
- Dissimilar Substrates: Yes
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Supplier: Epoxies Etc...
Description: 10-3092 is a two-component, high strength epoxy adhesive system. This adhesive is formulated with fiberglass for added impact, compression and thermal shock resistance. 10-3092 is a reliable bonding agent with excellent electrical insulation properties. BENEFITS: • Fiberglass
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Strength: 400 kV/in
- Features: Electrical Insulating / Dielectric
- Industry: OEM / Industrial
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Supplier: Epoxies Etc...
Description: 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Strength: 600 kV/in
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting
- Industry: Electronics, OEM / Industrial, Other
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Supplier: Master Bond, Inc.
Description: Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is readily reworkable. With a flowable, moderate viscosity, EP3SP5FL adheres
- Coeff. of Thermal Expansion (CTE): 22.22 to 25 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.5
- Dielectric Strength: 400 to 450 kV/in
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Supplier: Epoxies Etc...
Description: 10-3213 is a new two part epoxy adhesive system which exhibits high bond strength and outstanding thermal shock resistance. The 10-3213 has proven to be an excellent quick set patch and repair adhesive with excellent sealant capabilities.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 8.25
- Features: Electrical Insulating / Dielectric
- Industry: Building / Construction
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Supplier: Epoxies Etc...
Description: 10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 is also very safe to use due to the absence of harmful solvents and toxic chemicals
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.11
- Dielectric Strength: 550 kV/in
- Dissimilar Substrates: Yes
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Supplier: OMEGA Engineering, Inc.
Description: products. OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Paper / Paperboard, Plastic, Rubber / Elastomer, Wood / Wood Product
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 789-3 Epoxy Die Attach Adhesive Amber is a one component adhesive used for microelectronic applications. It offers good moisture resistance, high bond strength, and is non-conductive. 3 cc Syringe.
- Cure Type / Technology: Single Component System
- Features: Electrical Insulating / Dielectric
- Thermal Conductivity: 0.3000 W/m-K
- Viscosity: 36500 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 104, Epoxy, Assembly LOCTITE® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230ºC. It has also been tested to withstand short term
- Coeff. of Thermal Expansion (CTE): 33.33 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric
- Substrate / Material Compatibility: Ceramic / Glass, Metal
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Supplier: 3X Ceramic Parts Company Limited
Description: Machinable Glass Ceramic Rod Properties : Machinable Glass Ceramic rod with excellent compressive strength, high thermal insulating value, radiation immunity, and excellent dielectrical strength. Unlike plastics, whose temperature resistance and rigidity starts to fall
- Material Type: Glass Ceramic, Silica / Silicate Materials
- Thermal Conductivity: 1.71 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 1090SI Black, formerly Emerson and Cuming, is a two component, room temperature curing epoxy that is used for encapsulating components that are exposed to high compressive stress. It offers low density, low dielectric constant, and high compressive
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 376 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: . For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. Flame retardant Halogen free High thermal conductivity High dielectric strength
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.67 µin/in-F
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.5 W/m-K
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Supplier: NACE International
Description: .S. standard for electrical inspection of fusion-bonded epoxy pipeline coatings. Although several specifications have been written by operating companies for high voltage electrical inspection of protective coatings, they apply only to specific coatings. This standard recommended
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Supplier: EBG RESISTORS LLC
Description: Electric support: High purity ceramic metallized with EBG ALTOX film on the bottom for better heat transfer and optimum discharge. Encapsulation: Special resin filled epoxy casing. High insulation resistance (CTI 600), high dielectric
- Category / Application: Power Resistor, Other
- Operating DC Voltage: 5000 volts
- Operating Temperature: -55 to 150 C
- Power Rating: 600 watts
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Supplier: ELANTAS North America LLC
Description: Wet winding resin - high bond strength
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Strength: 1500 kV/in
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Supplier: DuPont Electronics & Imaging
Description: High bond strength High thermal resistance Enable high yield in processing Halogen free Construction HXI0910: 9um black polyimide film and 10um epoxy adhesive Certification UL-94 VTM-0 flammability rating
- Chemical / Polymer System Type: Specialty / Other
- Features: Electrically Insulating / Dielectric, Encapsulating / Potting, UL Approved
- Industry: Electronics, OEM / Industrial
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Supplier: Minco
Description: : Reliable and continuous monitoring Redundant measurement feedback Average temperature readings High dielectric strength Temperature limit: 180°C (356°F)
- # of Lead Wires Per Element: 3
- Diameter or Width Range: 0.5000 inch
- Element Material: Platinum
- Probe Configuration: Other
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Supplier: RCD Components, Inc.
Description: HIGH CAPACITANCE, LOW FREQUENCY RCD’s Tangold construction provides superior performance and wide capacitance range as a result of a solid slug of high-gain tantalum powders sintered under vacuum. The flame retardant epoxy molding ensures optimum environmental protection and
- Applications: General Purpose
- Capacitance Range: 0.1000 to 680 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 50 volts
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Supplier: U.S. Plastic Corporation
Description: Phenolic and epoxy laminates are a hard dense material made by applying heat and pressure to layers of paper, fabric, or glass fiber with a phenolic or epoxy resin. GRADE XX - Copper color, paper base phenolic laminate with good mechanical properties, high dielectrical
- Chemical / Polymer System Type: Phenolics
- Form / Shape: Rod / Round Stock
- Thermoset / Crosslinked: Yes
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Supplier: NKK Switches
Description: of solder flux and other contaminants. Snap-acting mechanism gives smooth actuation and audible feedback. Prominent external insulating barriers increase insulation resistance and dielectric strength.
- Actuator Specifications: Other
- Maximum AC Voltage: 28 volts
- Maximum DC Voltage: 28 volts
- Switch Type Function: Momentary Contact, Other
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Supplier: RS Components, Ltd.
Description: The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so
- Features: Electrically Conductive
- Thermal Conductivity: 1.44 W/m-K
- Use Temperature: -94 F
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increasingly complex, engineers seek materials that can accomplish more. Dielectric foam meets this demand. Aerospace companies encounter various design challenges. High altitudes create extreme temperature changes. Parts must endure without losing strength or signal clarity. RF systems operate (read more)
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Master Bond EP40Med, a two part epoxy system, combines toughness and a low tensile modulus while still providing a relatively high lap shear strength. It meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. This compound can be used for bonding, sealing, coating and encapsulating. (read more)
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resistivity of >1014ohm-cm and a dielectric strength of 450 volts/mil. Formulated for temperatures ranging from 4K to +250°F, this epoxy is also suitable for challenging cryogenic applications. EP51CC is available in ounce kits, half pint kits, pint kits, quart kits, gun applicators, and FlexiPaks® for ease of use. (read more)
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handling Excellent heat resistance Toughened system Passes NASA low outgassing Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and (read more)
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Indicates content that may require registration and/or purchase.
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Design and Fabrication of the Iron Core for the OHTE Experimental Machine
To elimi- nate electrical shorts, all machined surfaces were etched with a dilute nitric acid solution, then painted with a moisture repelling high dielectric strength epoxy spray paint to elimi- nate lamination to lamination creepage and surface corrosion.
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Area bonding conductive epoxy adhesives for low cost grid array chip carriers
ABC adlheslve pattern, made by screenlng or stencilling silver filled epoxy conductlve dots on 2 mill thick Mylar carrier film and then screening a high strength dielectric epoxy adhesive between the conductive dots..
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Area bonding conductive epoxy adhesive preforms for grid array and MCM substrate attach
The silver filled dots in these ABC adhesives (Fig. 3) occupy only about 5% of the volume, the remainder being the higher strength dielectric epoxy .
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Evaluation of area bonding conductive adhesives for flip chip attach of area bonded die
… by screening or stenciling silver filled epoxy conductive dots or other shapes, in a pattern corresponding to the desired contact points, on a 2 mil Mylar release carrier film and then screening a high strength dielectric epoxy adhesive around the conductive …
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Area bonding conductive epoxy adhesives for low-cost grid array chip carriers
ABC adhesive pattern, made by screening or stencilling silver-filled epoxy conductive dots on a 2-mil thick Mylar carrier film and then screening a high strength dielectric epoxy adhesive between the conductive dots.
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http://www.mouser.com/catalog/supplier/library/pdf/AVXHighVoltageCeramic.pdf
• Good energy pulses ability • Excellent heat-proof, humidity-proof characteristics • High dielectric strength • Epoxy coating • High insulation resistance • Small size and low cost • Excellent Corona-proof .
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Investigation of alternative materials for impregnation of Nb3Sn accelerator magnets
The data shows that the E21 matrimid impregnated ceramic insulation has higher dielectric strength than epoxy impregnated ceralhic insulation.
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Investigation of alternative materials for impregnation of Nb/sub 3/Sn magnets
insulation has higher dielectric strength than epoxy impregnated ceramic insulation.
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High Density, High Performance Modular DC-DC Power Converter
The completed submodule is under filled with a thermally conductive epoxy with high dielectric strength to eliminate void/air pockets that could break down under the application of high voltage.
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Properties and economics of mica‐reinforced plastics related to processing conditions
… in the latter end use are: increase in impact resistance increase in thermal shock resistance decrease in cracking decrease in settling of fillers lower costs Mica is regarded as the best filler for epoxies where high dielectric strength is required (1).