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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at
- Use Temperature: -452.47 to 250 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Features: Anti-static / ESD Control, Die Bonding Adhesive / Compound, EMI / RFI Shielding Material, Electrical Insulating / Dielectric, Electrically Conductive, Liquid, Other, Specialty / Other, Unfilled
- Substrate Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer
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Supplier: Master Bond, Inc.
Description: Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is readily reworkable. With a flowable, moderate viscosity, EP3SP5FL adheres
- Viscosity: 100,000 to 150,000 cP
- Use Temperature: -60 to 200 F
- Coeff. of Thermal Expansion (CTE): 22.220000000000002 to 25 µin/in-F
- Tensile Strength (Break): 6,000 psi
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Supplier: Master Bond, Inc.
Description: Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent.
- Viscosity: 2,500 to 5,000 cP
- Use Temperature: -80 to 450 F
- Tensile Strength (Break): 11,000 to 12,000 psi
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Master Bond, Inc.
Description: Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles.
- Viscosity: 120 to 150 cP
- Use Temperature: -60 to 300 F
- Thermal Conductivity: 0.029 W/m-K
- Coeff. of Thermal Expansion (CTE): 33 µin/in-F
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Supplier: Epoxies Etc...
Description: 10-3092 is a two-component, high strength epoxy adhesive system. This adhesive is formulated with fiberglass for added impact, compression and thermal shock resistance. 10-3092 is a reliable bonding agent with excellent electrical insulation properties. BENEFITS: • Fiberglass
- Viscosity: 1,500 to 9,450 cP
- Use Temperature: -85 to 311 F
- Thermal Conductivity: 0.50479765 W/m-K
- Tensile Strength (Break): 3,000 to 4,000 psi
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Supplier: Epoxies Etc...
Description: 10-3213 is a new two part epoxy adhesive system which exhibits high bond strength and outstanding thermal shock resistance. The 10-3213 has proven to be an excellent quick set patch and repair adhesive with excellent sealant capabilities.
- Use Temperature: -76 to 392 F
- Thermal Conductivity: 0.46025729619958 W/m-K
- Tensile Strength (Break): 3,000 psi
- Dielectric Constant (Relative Permittivity): 8.25
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Supplier: Epoxies Etc...
Description: These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and
- Viscosity: 50,000 to 100,000 cP
- Dielectric Constant (Relative Permittivity): 4
- Industry: Automotive, Electrical Power / HV, Electronics, OEM / Industrial
- Substrate Compatibility: Ceramic / Glass, Concrete / Masonry, Dissimilar Substrates, Metal, Plastic, Rubber / Elastomer, Textiles / Fabrics, Wood / Wood Product
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Supplier: Epoxies Etc...
Description: 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance.
- Viscosity: 5,000 cP
- Use Temperature: -40 to 250 F
- Tensile Strength (Break): 2,500 psi
- Dielectric Strength: 599.9999999999991 kV/in
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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.
- Viscosity: 50,000 cP
- Use Temperature: -60 to 140 F
- Tensile Strength (Break): 3,000 psi
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature rating,
- Use Temperature: 221 to 500 F
- Thermal Conductivity: 1.03844088 to 1.38458784 W/m-K
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Tensile Strength (Break): 2,000 to 2,700 psi
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Supplier: Ellsworth Adhesives
Description: ITW Performance Polymers Devcon Epoxy Plus 25 14278 is a two component, structural adhesive that is used for bonding structural parts, thermoset plastics, and metals. It offers flexibility, high dielectric strength, non-shrinking, and resistance to peeling, impact, and
- Viscosity: 70,000 cP
- Elongation: 20 %
- Dielectric Strength: 550 kV/in
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: ITW Performance Polymers Devcon Epoxy Plus 25 14350 is a two component, structural adhesive that is used for bonding structural parts, thermoset plastics, and metals. It offers flexibility, high dielectric strength, non-shrinking, and resistance to peeling, impact, and
- Viscosity: 70,000 cP
- Dielectric Strength: 550 kV/in
- Chemical System: Epoxy (EP)
- Substrate Compatibility: Metal, Plastic
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 789-3 Epoxy Die Attach Adhesive Amber is a one component adhesive used for microelectronic applications. It offers good moisture resistance, high bond strength, and is non-conductive. 3 cc Syringe.
- Viscosity: 36,500 cP
- Thermal Conductivity: 0.3 W/m-K
- Features: Electrical Insulating / Dielectric
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 1090SI Black, formerly Emerson and Cuming, is a two component, room temperature curing epoxy that is used for encapsulating components that are exposed to high compressive stress. It offers low density, low dielectric constant, and high compressive
- Thermal Conductivity: 0.17 W/m-K
- Tensile Strength (Break): 5,300 psi
- Dielectric Strength: 375.9200000000008 kV/in
- Viscosity: 1,800 to 3,500 cP
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Supplier: EBG RESISTORS LLC
Description: EBG ALTOX film on the bottom for better heat transfer and optimum discharge. Encapsulation: Special resin filled epoxy casing. High insulation resistance (CTI 600), high dielectric strength and partial discharge capability. Resistance Element: Special design for
- Resistance Range: 0.5 to 1,000,000 ohms
- Power Rating: 600 watts
- Operating DC Voltage: 5,000 volts
- Operating Temperature: -55 to 150 C
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 104, Epoxy, Assembly LOCTITE® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230ºC. It has also been tested to withstand short term
- Viscosity: 25,000 cP
- Use Temperature: 13 to 446 F
- Coeff. of Thermal Expansion (CTE): 33.333333333333336 µin/in-F
- Substrate Compatibility: Ceramic / Glass, Metal
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Description: standard for electrical inspection of fusion-bonded epoxy pipeline coatings. Although several specifications have been written by operating companies for high voltage electrical inspection of protective coatings, they apply only to specific coatings. This standard recommended practice
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Supplier: AMPP Resources
Description: been no U.S. standard for electrical inspection of fusion-bonded epoxy pipeline coatings. Although several specifications have been written by operating companies for high voltage electrical inspection of protective coatings, they apply only to specific coatings. This standard
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Supplier: Allied Electronics, Inc.
Description: Power Relay, 10 A Rated Current, 150 VDC or 380 VAC Rated Voltage, 300 W Power Factor Dielectric strength 5000 V (RMS) Epoxy sealed version available 10 A switching-double pole contacts Isolation spacing greater than 8mm PC terminal. PCB mount. DPDT contact form.
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Supplier: Allied Electronics, Inc.
Description: 125 VAC⁄250 VAC, Solder Lug Termination, M Series Miniature Rocker Switches Prominent external insulating barriers increase insulation resistance and dielectric strength High insulating barriers increase isolation of circuits and provide added protection to contact points.
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Supplier: RCD Components, Inc.
Description: HIGH CAPACITANCE, LOW FREQUENCY RCD’s Tangold construction provides superior performance and wide capacitance range as a result of a solid slug of high-gain tantalum powders sintered under vacuum. The flame retardant epoxy molding ensures optimum environmental protection and
- Capacitance Range: 0.1 to 680.0000000000001 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 50 volts
- Operating Temperature: -55 to 125 C
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Supplier: ELANTAS North America LLC
Description: Wet winding resin - high bond strength
- Use Temperature: 356 F
- Dielectric Strength: 1,500 kV/in
- Viscosity: 90,000 to 120,000 cP
- Industry: Aerospace, Automotive, Electrical Power / HV, Marine, OEM / Industrial
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Supplier: Minco
Description: continuous monitoring Redundant measurement feedback Average temperature readings High dielectric strength Temperature limit: 180°C (356°F)
- Diameter or Width Range: 0.425 inch
- Sensitive Length: 11.8 inch
- Reference Resistance: 100 Ohms (Most Common)
- # of Lead Wires Per Element: 3
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Supplier: 3X Ceramic Parts Company Limited
Description: Machinable Glass Ceramic Rod Properties : Machinable Glass Ceramic rod with excellent compressive strength, high thermal insulating value, radiation immunity, and excellent dielectrical strength. Unlike plastics, whose temperature resistance and rigidity starts to fall off at as
- Density: 2.4799984348048953 g/cc
- Thermal Conductivity: 1.71 W/m-K
- MOR / Flexural Strength: 15,663.978650577275 psi
- Compressive / Crushing Strength: 73,678.71439345607 psi
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Supplier: Allied Electronics, Inc.
Description: 15 mA @ 5 VDC Rated Current, 2500 V (RMS) Dielectric Strength, AC Output Mini-SIP Relay The LC241 series is rated up to 1.5 Amps (SPST-NO) and is designed for general purpose AC loads. In most applications a snubber is not required. Operating Temperature Range: –40 to 80°C.
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Supplier: U.S. Plastic Corporation
Description: Phenolic and epoxy laminates are a hard dense material made by applying heat and pressure to layers of paper, fabric, or glass fiber with a phenolic or epoxy resin. GRADE XX - Copper color, paper base phenolic laminate with good mechanical properties, high dielectrical
- Chemical System: Phenolics
- Form / Shape: Rod / Round Stock
- Features: Thermoset / Crosslinked
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Supplier: DuPont Electronics & Imaging
Description: modified epoxy adhesive. The Pyralux® HXI coverlay is used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental and electrical insulation. Features Uniform matte black appearance High bond strength High thermal resistance
- Features: Electrically Insulating / Dielectric, Encapsulating / Potting, Film / Sheet, Specialty / Other, UL Approved
- Industry: Electronics, OEM / Industrial
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8900NC, Epoxy, Die Attach LOCTITE® ABLESTIK 8900NC die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on die size, aspect ratio and package design. Fast cure Snap curable High
- Viscosity: 10,000 cP
- Thermal Conductivity: 0.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 µin/in-F
- Features: Electrically Insulating / Dielectric
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Supplier: Allied Electronics, Inc.
Description: Polarized Relay, 2 A Rated Current, 220 VDC or 250 VAC Rated Voltage, 60 W Power Factor High sensitivity, 79 mW pickup Monostable and bistable (latching) two coil versions available Meets FCC Part 68.302 1500 V lightning surge DIP terminal layout, fits 10 pin IC socket Epoxy sealed for
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Supplier: NKK Switches
Description: audible feedback. Prominent external insulating barriers increase insulation resistance and dielectric strength.
- Maximum Current: 3 amps
- Maximum AC Voltage: 125 volts
- Switch Function: Momentary Contact
- Features: Other
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Supplier: NKK Switches
Description: audible feedback. Prominent external insulating barriers increase insulation resistance and dielectric strength.
- Maximum AC Voltage: 28 volts
- Maximum DC Voltage: 28 volts
- Switching Mechanism: DPDT
- Switch Function: Momentary Contact
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Supplier: NKK Switches
Description: audible feedback. Prominent external insulating barriers increase insulation resistance and dielectric strength.
- Maximum Current: 2 amps
- Maximum AC Voltage: 125 volts
- Features: Illuminated Switch, Other
- Switch Function: Momentary Contact
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Supplier: NKK Switches
Description: audible feedback. Prominent external insulating barriers increase insulation resistance and dielectric strength.
- Maximum Current: 3 amps
- Maximum AC Voltage: 125 volts
- Switching Mechanism: DPDT
- Switch Function: Momentary Contact
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Supplier: Techsil Limited
Description: RTV630 is a room temperature molding compound from Momentive which cures to a high strength silicone rubber. This medium viscosity grade forms thin, light-weight molds with excellent durability. The high tear resistance and inherent release ability of this grade make it well
- Use Temperature: -76 to 399.2 F
- Type: Elastomer / Rubber
- Features: Molding Resin
- Chemical System: Silicone
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Supplier: Techsil Limited
Description: RTV630 is a room temperature molding compound from Momentive which cures to a high strength silicone rubber. This medium viscosity grade forms thin, light-weight molds with excellent durability. The high tear resistance and inherent release ability of this grade make it well
- Use Temperature: -76 to 399.2 F
- Type: Elastomer / Rubber
- Features: Molding Resin
- Chemical System: Silicone
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Master Bond EP40Med, a two part epoxy system, combines toughness and a low tensile modulus while still providing a relatively high lap shear strength. It meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. This compound can be used for bonding, sealing, coating and encapsulating. (read more)
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resistivity of >1014ohm-cm and a dielectric strength of 450 volts/mil. Formulated for temperatures ranging from 4K to +250°F, this epoxy is also suitable for challenging cryogenic applications. EP51CC is available in ounce kits, half pint kits, pint kits, quart kits, gun applicators, and FlexiPaks® for ease of use. (read more)
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electrical insulation properties with a volume resistivity exceeding 1014 ohm-cm at 75°F. It also exhibits thermal conductivity of around 4 to 5 BTU·in/ft²·hr·°F (0.58-0.72 W/m/K). The system provides high bond strength properties with a (read more)
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handling Excellent heat resistance Toughened system Passes NASA low outgassing Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and (read more)
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Indicates content that may require registration and/or purchase.
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Design and Fabrication of the Iron Core for the OHTE Experimental Machine
To elimi- nate electrical shorts, all machined surfaces were etched with a dilute nitric acid solution, then painted with a moisture repelling high dielectric strength epoxy spray paint to elimi- nate lamination to lamination creepage and surface corrosion.
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Area bonding conductive epoxy adhesives for low cost grid array chip carriers
ABC adlheslve pattern, made by screenlng or stencilling silver filled epoxy conductlve dots on 2 mill thick Mylar carrier film and then screening a high strength dielectric epoxy adhesive between the conductive dots..
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Area bonding conductive epoxy adhesive preforms for grid array and MCM substrate attach
The silver filled dots in these ABC adhesives (Fig. 3) occupy only about 5% of the volume, the remainder being the higher strength dielectric epoxy .
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Evaluation of area bonding conductive adhesives for flip chip attach of area bonded die
… by screening or stenciling silver filled epoxy conductive dots or other shapes, in a pattern corresponding to the desired contact points, on a 2 mil Mylar release carrier film and then screening a high strength dielectric epoxy adhesive around the conductive …
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Area bonding conductive epoxy adhesives for low-cost grid array chip carriers
ABC adhesive pattern, made by screening or stencilling silver-filled epoxy conductive dots on a 2-mil thick Mylar carrier film and then screening a high strength dielectric epoxy adhesive between the conductive dots.
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http://www.mouser.com/catalog/supplier/library/pdf/AVXHighVoltageCeramic.pdf
• Good energy pulses ability • Excellent heat-proof, humidity-proof characteristics • High dielectric strength • Epoxy coating • High insulation resistance • Small size and low cost • Excellent Corona-proof .
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Investigation of alternative materials for impregnation of Nb3Sn accelerator magnets
The data shows that the E21 matrimid impregnated ceramic insulation has higher dielectric strength than epoxy impregnated ceralhic insulation.
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Investigation of alternative materials for impregnation of Nb/sub 3/Sn magnets
insulation has higher dielectric strength than epoxy impregnated ceramic insulation.
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High Density, High Performance Modular DC-DC Power Converter
The completed submodule is under filled with a thermally conductive epoxy with high dielectric strength to eliminate void/air pockets that could break down under the application of high voltage.
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Properties and economics of mica‐reinforced plastics related to processing conditions
… in the latter end use are: increase in impact resistance increase in thermal shock resistance decrease in cracking decrease in settling of fillers lower costs Mica is regarded as the best filler for epoxies where high dielectric strength is required (1).