High Frequency Dielectric Materials

Description: collapsing into electrical current. When these materials are placed in an electrical field, the atoms in the material become polarized. They are used in applications like capacitors and radio frequency transmission lines. In the latter case, the dielectric material

• Foam Type: Closed Cellular, Flexible, Rigid
• Form / Shape: Stock Shape (Bar, Sheet, etc.), Film / Sheet
• Material / Composition: Plastic / Polymer
• Special Features: Electrical Insulation / Dielectric

Description: High-frequency applications, such as antennae systems, require low energy absorption. Trusted by manufacturers around the world, our low dielectric materials:•Ensure purity and manufacturability-PO REX Virtek™ PTFE is pure PTFE and does not require a backing or support scrim

Description: Is applicable to industrial high-frequency dielectric heating installations used for the purpose of thermal applications such as melting, drying, welding, insect extermination, and gluing of partially conductive or non-conductive materials. Assists in compliance with the

Description: Specifies the test methods of electroheating installations used for heating, assembly by melting and drying of materials such as wood, rubber, textiles, glass, papers, etc. Applies to installations operating in the frequency range 1 MHz to 300 MHz for power levels of 50 W and above,

Description: This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor

• Features: Dielectric / Insulating
• Thickness: 6.30E-4 to 9.84E-4 inches

Description: These MLCCs can be used in high frequency. They consist of a ceramic body and an electrode made of copper and plated with nickel and tin. High Q and low ESR characteristics allow application of the products in high frequencies. In particular, as they suffer no

• Applications: High Frequency
• Capacitance Range: 2.00E-7 to 220 microF
• DC Rated Voltage Range (WVDC): 25 to 250 volts
• Electrostatic Capacitors: Ceramic

Description: Is applicable to industrial high-frequency dielectric heating installations for the purpose of thermal applications such as melting, drying, welding, insect extermination and gluing of partially or non-conductive materials (plastics, wood, etc.) in both normal and protective

Description: Applies to industrial high-frequency heating installations for the purpose of thermal applications such as assembly by melting, melting and drying of partially or non-conductive materials. Relates to high-frequency dielectric heating installations, in the range 1 MHz to

Description: Dielectric and resistive properties of solid insulating materials-Part 2-2: Relative permittivity and dissipation factor-High frequencies (1 MHz to 300 MHz)

Description: Is applicable to industrial high-frequency dielectric heating installations used for the purpose of thermal applications such as melting, drying, welding, insect extermination, and gluing of partially conductive or non-conductive materials. Assists in compliance with the

Description: LAST-A-FOAM® RF-2200 is an advanced dielectric material for use in radomes, antennas and other radio frequency (RF) communication systems. This series of Machin able, closed cell polyurethane foams provide an RF-transparent, low-loss protective layer for applications requiring

• Application: Other
• Bulk Density: 6 lbs/ft³
• Foam Type: Closed Cellular, Rigid
• Form / Shape: Stock Shape (Bar, Sheet, etc.), Board / Block / Bun

Description: 1.1 This test method covers the measurement of the complex dielectric constant of isotropic ferrites for extremely high-frequency applications. 1.2 The values stated in inch-pound units are to be regarded as the standard. 1.3 This standard does not purport to address all of the

Description: . Materion packages are used for discrete Si, GaAs and GaN devices. The high thermal conductivity flange promotes low thermal resistance ?JC, and alumina ring frames provide very low dielectric loss at RF frequencies. The leads are Alloy 42, and are plated with Ni and Au to

• Applications: Other
• Shape / Form: Bar Stock

Description: Dielectric and resistive properties of solid insulating materials Part 2-2: Relative permittivity and dissipation factor - High frequencies (1 MHz to 300 MHz) - AC methods

Description: . This material also offers electronic and semiconductor designers unmatched dielectric properties that are maintained over a wide frequency range. Unfilled UNITEM PEI is dark amber in color and semi-transparent. For applications that require improved stiffness, glass fiber

• Chemical / Polymer System Type: Polyetherimide (PEI)
• Elongation: 60 to 80 %
• Filler Material: Fiber Glass
• Form / Shape: Plate, Rod / Round Stock

Description: industries. This material also offers electronic and semiconductor designers unmatched dielectric properties that are maintained over a wide frequency range. Unfilled UNITEM PEI is dark amber in color and semi-transparent. For applications that require improved stiffness, glass

• Chemical / Polymer System Type: Polyetherimide (PEI)
• Elongation: 60 to 80 %
• Filler Material: Unfilled
• Form / Shape: Plate, Rod / Round Stock

Description: . High purity sand deposits provide the raw material for bulk refractory grade, which is electric arc melted at extremely high temperatures. Optical and general purpose fused silica rods and tubing are drawn from a melt made from high purity chemicals. Fiber optic purity

• Material Type: Fused Silica, Silica / Silicate Materials
• Shape / Form: Fabricated / Custom Shape

Description: Dielectric and resistive properties of solid insulating materials \x96 Part 2-2: Relative permittivity and dissipation factor \x96 High frequencies (1 MHz to 300 MHz) \x96 AC methods

Description: Dielectric and resistive properties of solid insulating materials Part 2-2: Relative permittivity and dissipation factor \x97 High frequencies (1 MHz to 300 MHz) \x97 AC methods

Description: 1.1 These test methods cover the determination of relative (Note 0) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 0The word "relative" is often omitted. 1.1.1 Test Method A is for specimens precisely formed to

Description: 1.1 These test methods cover the determination of relative (Note 0) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 0The word "relative" is often omitted. 1.1.1 Test Method A is for specimens precisely formed to

Description: 1.1 These test methods cover the determination of relative (Note 1) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 1-The word “relative” is often omitted. 1.1.1 Test Method A is for specimens precisely

Description: These materials are partially filled dielectrics which contain a high Dk ceramic powder. The thicknesses available include 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated

• Electrical Resistivity: 1.20E13 to 1.90E13 ohm-cm
• Features: Dielectric / Insulating
• Thickness: 3.15E-4 to 4.72E-4 inches

Description: These materials are unfilled dielectrics. The thicknesses available include 24, 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed

• Electrical Resistivity: 3.02E13 to 7.20E13 ohm-cm
• Features: Dielectric / Insulating
• Temperature Resistance: 125 to 130 C
• Thickness: 3.15E-4 to 9.84E-4 inches

Description: temperature of 800°C and a peak temperature of 1000°C. Its coefficient of thermal expansion readily matches most metals and sealing glasses. It is non-wetting, exhibits zero porosity, and unlike ductile materials, won't deform. It is an excellent insulator at high voltages, various

• Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
• Dielectric Strength: 6.24E7 V/m

Description: temperature of 800°C and a peak temperature of 1000°C. Its coefficient of thermal expansion readily matches most metals and sealing glasses. It is non-wetting, exhibits zero porosity, and unlike ductile materials, won't deform. It is an excellent insulator at high voltages, various

• Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
• Dielectric Strength: 6.24E7 V/m

Description: temperature of 800°C and a peak temperature of 1000°C. Its coefficient of thermal expansion readily matches most metals and sealing glasses. It is non-wetting, exhibits zero porosity, and unlike ductile materials, won't deform. It is an excellent insulator at high voltages, various

• Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
• Dielectric Strength: 6.24E7 V/m

Description: temperature of 800°C and a peak temperature of 1000°C. Its coefficient of thermal expansion readily matches most metals and sealing glasses. It is non-wetting, exhibits zero porosity, and unlike ductile materials, won't deform. It is an excellent insulator at high voltages, various

• Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
• Dielectric Strength: 6.24E7 V/m

Description: The most widely used and best-known fine ceramic material. Good mechanical strength, electrical insulation, high-frequency loss, thermal conductivity, and resistance to heat, wear and corrosion. Sapphire is single-crystal alumina.

• Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
• Coeff. of Thermal Expansion (CTE): 7.8 µm/m-C
• Hollow Stock / Shape: Yes
• Material Type: Alumina / Aluminum Oxide

Description: Alumina Ceramic Insulator Description : Alumina is the most cost effective and widely used material in the family of engineering ceramics. The raw materials from which this high performance technical grade ceramic is made are readily available and reasonably priced, resulting in

• Coeff. of Thermal Expansion (CTE): 8.2 to 8.4 µm/m-C
• Dielectric Constant (Relative Permittivity): 9 to 9.8 #
• Loss Tangent (tan δ ): 2.00E-4 to 0.0011 #
• Material Type: Alumina / Aluminum Oxide

Description: The MLO® High Pass Filters are low profile passive devices with best in class performance based on AVX’s patented multilayer organic high density interconnect technology. The MLO® High pass filters utilize high dielectric constant and low loss materials to

• Bandwidth: 2.37E6 to 7.00E6 kHz
• Insertion Loss: 0.7600 dB
• Package Type: Surface Mount Technology (SMT), Other

Description: -composite micromachined ultrasound transducers (PC-MUT) technique discovered over the last 10 years or so has demonstrated high performance high frequency piezo-composite ultrasound transducers. In this monograph, piezoelectric materials used for high

Description: -composite micromachined ultrasound transducers (PC-MUT) technique discovered over the last 10 years or so has demonstrated high performance high frequency piezo-composite ultrasound transducers. In this monograph, piezoelectric materials used for high

Description: stress. This feature is crucial in aerospace, military, and medical applications where reliability is paramount. C, Excellent Electrical Performance: Tg180 High Tg PCBs offer low dielectric constant and loss, which translates to minimal signal distortion and excellent signal integrity

Description: layer. It has a low dielectric constant for high-frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass. Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure

• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Form / Function: Encapsulant / Potting Compound
• Industry Applications: Other
• Viscosity: 4500 cP

Description: many engineering plastics. It is chemically inert and has a low dielectric constant (2.1) over a wide temperature and frequency range. This material does not ignite and can prevent the spread of flames. It has excellent weather resistance, low friction coefficient, and can be

• Elongation: 200 %
• Material Type / Grade: Dielectric / Electrically Insulating
• Overall Thickness: 0.0012 to 0.0059 inch
• Tensile Strength (Break): 2843 psi

Description: Unipretec offers 99.6% alumina substrates. This high purity alumina substrate exhibits excellent physical, chemical, and mechanical properties, including exceptional insulating properties, high thermal conductivity, low dielectric constant, low dielectric loss,

• Applications: Chemical / Materials Processing, Corrosion Protection, Electrical / HV Parts, Electronics / RF-Microwave
• Density: 3.9 to 3.95 g/cc
• Dielectric Strength: 1.70E7 to 2.00E7 V/m
• Material Type: Alumina / Aluminum Oxide

Description: flame retardant ratings High electrical conductivity High shielding effectiveness Energy management RoHS compliant Living hinge materials Quick turn prototyping Materials Conductive coated fabric, adhesives, paints

• Application: EMI / RFI Shielding
• Foam Type: Flexible, Rigid
• Form / Shape: Fabricated Shapes / Parts (Molded, Cast)
• Material / Composition: Plastic / Polymer, Elastomer / Rubber

Description: integrity, chapter coverage includes: Electromagnetic fundamentals for signal integrity Transmission line fundamentals Crosstalk Non-ideal conductor models, including surface roughness and frequency-dependent inductance Frequency-dependent properties of dielectrics Differential

Description: This book provides a brief overview of the popular Finite Element Method (FEM) and its hybrid versions for electromagnetics with applications to radar scattering, antennas and arrays, guided structures, microwave components, frequency selective surfaces, periodic media, and RF

Description: Ceramic Fork Aluminum Nitride Vacuum Plate for LED wafer Aluminum nitride ceramic fork have excellent physical properties such as high thermal conductivity, low dielectric constant, reliable electrical insulation, thermal expansion coefficient matched with silicon, insulation and non

• Applications: Dielectric / Electrical Insulation
• Density: 3.36 g/cc
• MOR / Flexural Strength: 58015 psi
• Material Type: Aluminum Nitride, Specialty Ceramic

Description: dielectric. Built in fuse and failsafe design. Non-inductive construction. Excellent frequency characteristics. Low loss. Low hum sound noise Capacitance = 4.7µF Voltage = 450V dc Mounting Type = Through Hole Tolerance = ±5% Series = ECWFE Application = Active Filter Circuit,

• Applications: High Frequency, Other
• Capacitance Range: 4.7 microF
• Capacitance Tolerance: 5 (+/- %)
• Electrostatic Capacitors: Polypropylene

Description: dielectric. Built in fuse and failsafe design. Non-inductive construction. Excellent frequency characteristics. Low loss. Low hum sound noise Capacitance = 100nF Voltage = 630V dc Mounting Type = Through Hole Tolerance = ±5% Series = ECWFE Application = Active Filter Circuit,

• Applications: High Frequency, Other
• Capacitance Range: 0.1000 microF
• Capacitance Tolerance: 5 (+/- %)
• Electrostatic Capacitors: Polypropylene

Description: dielectric. Built in fuse and failsafe design. Non-inductive construction. Excellent frequency characteristics. Low loss. Low hum sound noise Capacitance = 680nF Voltage = 630V dc Mounting Type = Through Hole Tolerance = ±5% Series = ECWFE Application = Active Filter Circuit,

• Applications: High Frequency, Other
• Capacitance Range: 0.6800 microF
• Capacitance Tolerance: 5 (+/- %)
• Electrostatic Capacitors: Polypropylene

Description: dielectric. Built in fuse and failsafe design. Non-inductive construction. Excellent frequency characteristics. Low loss. Low hum sound noise Capacitance = 1µF Voltage = 630V dc Mounting Type = Through Hole Tolerance = ±5% Series = ECWFE Application = Active Filter Circuit, High

• Applications: High Frequency, Other
• Capacitance Range: 1 microF
• Capacitance Tolerance: 5 (+/- %)
• Electrostatic Capacitors: Polypropylene