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Description: Cuming Microwave manufactures a full line of low loss dielectric materials. Our materials range in dielectric constant from 1.03 to 30. These materials have unique dielectric and physical properties. Dielectric materials can be used to adjust
- Type: Closed Cellular, Flexible, Rigid
- Features & Approvals: Electrical Insulation / Dielectric
- Form / Shape: Film / Sheet, Stock Shape (Bar, Sheet, etc.)
- Material / Composition: Plastic / Polymer
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Supplier: Porex
Description: High-frequency applications, such as antennae systems, require low energy absorption. Trusted by manufacturers around the world, our low dielectric materials:•Ensure purity and manufacturability-POREX Virtek™ PTFE is pure PTFE and does not require a backing or support
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Foams and Foam Materials - Closed-cell Polyurethane Dielectric Foam Material -- LAST-A-FOAM® RF-2206Supplier: General Plastics Manufacturing Co.
Description: LAST-A-FOAM® RF-2200 is an advanced dielectric material for use in radomes, antennas and other radio frequency (RF) communication systems. This series of Machin able, closed cell polyurethane foams provide an RF-transparent, low-loss protective layer for applications requiring
- Bulk Density: 6 lbs/ft³
- Tensile Strength: 130 psi
- Thermal Conductivity: 0.24000000000000002 BTU-in/hr-ft²-F
- Form / Shape: Board / Block / Bun, Stock Shape (Bar, Sheet, etc.)
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Supplier: Accuris
Description: Dielectric and resistive properties of solid insulating materials-Part 2-2: Relative permittivity and dissipation factor-High frequencies (1 MHz to 300 MHz)
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Supplier: Accuris
Description: Dielectric and resistive properties of solid insulating materials Part 2-2: Relative permittivity and dielectric dissipation factor \x96 High frequencies (1 MHz to 300 MHz) \x96 AC Methods
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Description: Is applicable to industrial high-frequency dielectric heating installations used for the purpose of thermal applications such as melting, drying, welding, insect extermination, and gluing of partially conductive or non-conductive materials. Assists in compliance with the
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Supplier: Samsung Electro-Mechanics
Description: temperature or passage of time, and have high efficiency and less power consumption, they are mainly used for impedance matching in RF circuits. General Features High Q and low ESR in high frequency range Tight tolerance available High efficiency and low power
- Capacitance Range: 0.00000020000000000000002 to 220.00000000000003 microF
- DC Rated Voltage Range (WVDC): 25 to 250 volts
- Electrostatic Capacitors: Ceramic
- Capacitance Type: Fixed
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Supplier: CSA Group
Description: Is applicable to industrial high-frequency dielectric heating installations used for the purpose of thermal applications such as melting, drying, welding, insect extermination, and gluing of partially conductive or non-conductive materials. Assists in compliance with the
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Supplier: Accuris
Description: Dielectric and resistive properties of solid insulating materials Part 2-2: Relative permittivity and dissipation factor - High frequencies (1 MHz to 300 MHz) - AC methods
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Description: Applies to industrial high-frequency heating installations for the purpose of thermal applications such as assembly by melting, melting and drying of partially or non-conductive materials. Relates to high-frequency dielectric heating installations, in the
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Description: Is applicable to industrial high-frequency dielectric heating installations for the purpose of thermal applications such as melting, drying, welding, insect extermination and gluing of partially or non-conductive materials (plastics, wood, etc.) in both normal and
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Supplier: ASTM International
Description: 1.1 This test method covers the measurement of the complex dielectric constant of isotropic ferrites for extremely high-frequency applications. 1.2 The values stated in inch-pound units are to be regarded as the standard. 1.3 This standard does not purport to address all of the
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Description: IEC 62631-2-2:2022 specifies test methods for the determination of permittivity and dissipation factor properties of solid insulating materials in a high frequency range from 1 MHz to 300 MHz.
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Supplier: Accuris
Description: Dielectric and resistive properties of solid insulating materials \x96 Part 2-2: Relative permittivity and dissipation factor \x96 High frequencies (1 MHz to 300 MHz) \x96 AC methods
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Supplier: Nytef Group
Description: unmatched dielectric properties that are maintained over a wide frequency range. Unfilled UNITEM PEI is dark amber in color and semi-transparent. For applications that require improved stiffness, glass fiber filled grades with filler levels of 10%-40% are available. Nytef Plastics’
- Overall Thickness: 0.25 to 4 inch
- Overall Width / O.D.: 0.375 to 8 inch
- Tensile Strength (Break): 17,000 psi
- Tensile Modulus: 800 ksi
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Supplier: ASTM International
Description: 1.1 These test methods cover the determination of relative (Note 0) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 0The word "relative" is often omitted. 1.1.1 Test Method A is for specimens precisely formed to
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Supplier: ASTM International
Description: 1.1 These test methods cover the determination of relative (Note 1) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 1: The word "relative" is often omitted. 1.1.1 Test Method A is for specimens precisely formed to
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Supplier: ASTM International
Description: 1.1 These test methods cover the determination of relative (Note 0) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 0The word "relative" is often omitted. 1.1.1 Test Method A is for specimens precisely formed to
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and
- Thickness: 0.0006299212598425197 to 0.000984251968503937 inches
- Features: Dielectric / Insulating
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Supplier: Kayaku Advanced Materials, Inc.
Description: KMSF® 2000 is a negative‑tone, low‑temperature‑cure PPE‑copolymer photo‑dielectric designed for high‑reliability heterogeneous integration in advanced packaging. It features excellent pattern resolution, a low dielectric constant (Dk = 2.5), and a low dissipation factor (Df =
- Applications: Electronics / Microelectronics
- Thick Film Type: Resistor
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Supplier: ASME
Description: demonstrated high performance high frequency piezo-composite ultrasound transducers. In this monograph, piezoelectric materials used for high frequency transducers is introduced first. Next, the benefits and theory of piezo composites is presented, followed
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Supplier: ASME Standards and Certification
Description: demonstrated high performance high frequency piezo-composite ultrasound transducers. In this monograph, piezoelectric materials used for high frequency transducers is introduced first. Next, the benefits and theory of piezo composites is presented, followed
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Supplier: IPC International, Inc.
Description: DESCRIPTION This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible flat cables. It includes flexible base
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Supplier: Materion Corporation
Description: Materion packages are used for discrete Si, GaAs and GaN devices. The high thermal conductivity flange promotes low thermal resistance θJC, and alumina ring frames provide very low dielectric loss at RF frequencies. The leads are Alloy 42, and are plated with Ni and Au to provide
- Shape / Form: Bar Stock
- Features: Other
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Supplier: Dymax
Description: has a low dielectric constant for high-frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass. Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in
- Viscosity: 4,500 cP
- Features: Encapsulant / Potting Compound, Other
- Cure / Technology: UV / Radiation Cured (also EB, Light)
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Supplier: Richardson RFPD
Description: The MLO® High Pass Filters are low profile passive devices with best in class performance based on AVX’s patented multilayer organic high density interconnect technology. The MLO® High pass filters utilize high dielectric constant and low loss materials to
- Bandwidth: 740,000 to 1,470,000 kHz
- Insertion Loss: 0.84 dB
- Filter Type: High Pass
- Features: Other
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: These materials are partially filled dielectrics which contain a high Dk ceramic powder. The thicknesses available include 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor
- Thickness: 0.00031496062992125983 to 0.00047244094488188977 inches
- Electrical Resistivity: 12,000,000,000,000 to 19,000,000,000,000 ohm-cm
- Features: Dielectric / Insulating
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: These materials are unfilled dielectrics. The thicknesses available include 24, 12 and 8um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits
- Thickness: 0.00031496062992125983 to 0.000984251968503937 inches
- Electrical Resistivity: 30,200,000,000,000 to 72,000,000,000,000 ohm-cm
- Temperature Resistance: 125 to 130 C
- Features: Dielectric / Insulating
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Supplier: FX PCB Co., Ltd.
Description: paramount. C, Excellent Electrical Performance: Tg180 High Tg PCBs offer low dielectric constant and loss, which translates to minimal signal distortion and excellent signal integrity. This is vital for high-frequency applications like telecommunications and data
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Description: This book provides a brief overview of the popular Finite Element Method (FEM) and its hybrid versions for electromagnetics with applications to radar scattering, antennas and arrays, guided structures, microwave components, frequency selective surfaces, periodic media, and RF
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Description: chapter coverage includes: Electromagnetic fundamentals for signal integrity Transmission line fundamentals Crosstalk Non-ideal conductor models, including surface roughness and frequency-dependent inductance Frequency-dependent properties of dielectrics Differential signaling
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Supplier: Accuratus Corporation
Description: deposits provide the raw material for bulk refractory grade, which is electric arc melted at extremely high temperatures. Optical and general purpose fused silica rods and tubing are drawn from a melt made from high purity chemicals. Fiber optic purity is made by thermal
- Features: Dielectric Ceramic, Silica / Fused Silica
- Shape / Form: Fabricated / Custom Shape
- Material Type: Silica / Silicate Materials
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Supplier: Newport MKS
Description: The 05B20UF.20 Ultrashort Pulses High Reflecting Pump Mirror is a precision polished, 0.5 inch (12.7 mm) diameter, flat N-BK7 substrate. It's UF.20 coating is optimized for reflection at 710 to 890 nm, and pump transmission at 488 to 532 nm. This mirror is intended for use as a high
- Wavelength Range: 710 to 890 nm
- Diameter/Width: 12.700000000000001 mm
- Thickness: 9.65 mm
- Surface Flatness: λ/10
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Supplier: Newport MKS
Description: The 10B20UF.20 Ultrashort Pulses High Reflecting Pump Mirror is a precision polished, 1.0 inch (25.4 mm) diameter, flat N-BK7 substrate. It's UF.20 coating is optimized for reflection at 710 to 890 nm, and pump transmission at 488 to 532 nm. This mirror is intended for use as a high
- Wavelength Range: 710 to 890 nm
- Diameter/Width: 25.400000000000002 mm
- Thickness: 6 mm
- Surface Flatness: λ/10
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Supplier: 3X Ceramic Parts Company Limited
Description: advanced ceramic material. 3X Ceramic offers a wide range of material types with different property profiles that can be adjusted via a targeted matrix design. This material has very high hardness, very high stiffness, very good corrosion resistance to chemicals at
- Density: 3.5999977279425903 to 3.9399975133593905 g/cc
- Coeff. of Thermal Expansion (CTE): 8.2 to 8.4 µm/m-C
- MOR / Flexural Strength: 50,037.70957823296 to 54,968.96211637766 psi
- Compressive / Crushing Strength: 304,577.3626501137 to 377,095.7823287122 psi
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Featured Products Top
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. C, Excellent Electrical Performance: Tg180 High Tg PCBs offer low dielectric constant and loss, which translates to minimal signal distortion and excellent signal integrity. This is vital for high-frequency applications like telecommunications and (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
, particularly in high-power and Driven applications. High-Frequency Materials Moo dielectric misfortune and great warm steadiness, perfect for 5G and IoT applications. Thermally (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
, materials need to provide strength and stability under pressure. Polyurethane dielectric foam for aerospace meets these requirements with dependable performance. It supports systems that depend on radio frequency transmission while maintaining durability and precision. As technology becomes (read more)
Browse Electrical Insulation and Dielectric Materials Datasheets for General Plastics Manufacturing Co. -
conduction distance enhance heat dissipation significantly. Improved switching efficiency by reducing high-frequency parasitic impedance, leading to better device performance in high-frequency applications. Double-Sided Cooling Package Structure (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Rogers PCB is mostly used in high-frequency and high-power applications such as RF and microwave. the Rogers material normally has the advantages of low dielectric loss, stable dielectric constant, high thermal conductivity, thermal stability, etc. That’s why there are so many (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
become polarized. They are used in applications like capacitors and radio frequency transmission lines. In the latter case, the dielectric material channels the signal down the wire without letting it leak out, preventing interference. Inside a capacitor, a dielectric material is placed between two (read more)
Browse Foams and Foam Materials Datasheets for Dexmet® Corporation, a part of PPG’s engineered materials division -
-2200 is an advanced dielectric material for use in radomes, antennas and other radio frequency (RF) communication systems. This series of machinable, closed cell polyurethane foams provide an RF-transparent, low-loss protective layer for applications requiring optimal performance where (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
500°C~1000°C Dielectric Properties Medium Medium Low Dk/Df, Excellent High-Frequency Performance Fragile Medium Hard Easy (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
, which helps to match the thermal expansion characteristics of semiconductor materials. This reduces thermal stress and prevents mechanical failures due to thermal mismatches. Electrical Insulation High Dielectric Strength: Ceramic substrates provide (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Silicon Carbide: Superior Performance in Demanding Applications Silicon carbide (SiC) is a high-performance material with outstanding mechanical properties. Sintered at high temperatures, it offers remarkable hardness and durability, making it a versatile choice for (read more)
Browse Industrial Ceramic Materials Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd
Conduct Research Top
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Dielectric Materials for Use in Radomes
Mfg. Co. presents an overview of dielectric materials, as well as a comparison of polyurethane foam with other commonly used dielectrics. In addition, dielectric properties of three series of rigid polyurethane foam at low, medium and high densities are examined in frequencies ranging from 1 - 10 GHz
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
, Amp-Line, Oakland Gardens,. NY, USA). A high-voltage transformer was then used to. step-up the voltage of the signal before it was applied to the. microfluidic device. It should be noted that voltages and. frequencies higher than 300 Vrms and 600 kHz, respectively,. were not tested due to the PDMS
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What are the Defects on the Surface of Alumina Ceramics?
Alumina ceramics is a kind of ceramic material with Al2O3 as the main raw material. It has many advantages, such as high mechanical strength, high hardness, and low dielectric loss at high frequencies, so it is widely used in the fields of electronics, electrical appliances, machinery, textiles
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Advantages of Laser Microscopes for Measuring the Roughness of Copper Foil used in 5G PCBs
to improve its ability to bond with the dielectric material. However, rough copper foils cause a loss in conductivity, which can negatively impact how the circuit board functions. In addition, conductor loss significantly increases as the current frequency increases due to what 's known as the skin
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Comparison of RF Terminations with BeO and ALN Substrates
Terminations designed to dissipate significant amounts of power at RF frequencies have traditionally been fabricated on beryllium oxide (BeO) substrates. The high thermal conductivity and moderate dielectric constant make BeO an ideal choice for this application. Increased regulation regarding
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Designing Atmospheric-Pressure Plasma Sources for Surface Engineering of Nanomaterials
, respectively. Complex permittivity is. defined as. e ¼ e1 s. jo ð3Þ. where e and s are the real permittivity and conductivity of. the subject, j ¼ ffiffiffiffiffiffi. 1 p and o is the radial frequency. From the. single shell dielectric model [31] the effective permittivity. and conductivity
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3D Scanners Take Volume Measurement to a New Level
3D Scanners take Volume Measurement to a New Level. Advanced non-contact technology for measuring the volume of solids in silos. There are many devices on the market today for detecting the level of solids and powders in silos. Many devices will only alert when material reaches a particular high
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A Microfluidic System for Biological Particle Enrichment Using Contactless Dielectrophoresis
conductive. fluid to act as electrodes and provide the necessary electric. field. These reservoirs are placed adjacent to the main microfluidic. channel and are separated from the sample by a thin. barrier of a dielectric material as shown in Figure 1H. The. application of a high-frequency electric field
More Information Top
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Thesis for the degree of Doctor of Technology
Chapter seven covers the importance of high frequency dielectric material in the design of planar power transformers suitable for the next generation SMPS.
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Ultra-Wideband Radio Frequency Identification Systems
At these higher frequencies material dielec- trics , such as conductivity, can have significant effect on the antenna’s complex impedance and therefore on the performance of the tags.
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Impact of surface treatment on high frequency signal loss characteristics
When the future of high frequency devices are discussed, the focus is often more on the advancement of high frequency dielectric material properties.
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Dielectric properties of Ag(Nb1−x Tax )O3 and Bi2 O3 Doped Ag(Nb1−x Tax )O3 ceramics
Recent comprehensive study on silver niobate-tantalate solid solutions Ag(Nb1- xTax)O3 (ANT) has proved that it should be regarded as a good candidate for high frequency dielectric materials for absence of the dielectric dispersion in a very wide .
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Transcrystallinity at Interior Boundaries in Multilayer Crystalline PCTFE Films
Polychlorotri¯uoroethylene (PCTFE) and PCTFE- based copolymers are commonly used in a range of applications, including high-performance pack- aging as gas diffusion barriers and electronic circuit constructions as high frequency dielectric materials , due to their low dielectric constant and loss charac…
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Theoretical analysis of photoconducting microdipole antennas
Since some years, the needs of high frequency dielectric materials characterization have required .
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Analysis of a low power passive RFID tag based on advanced CMOS process for wide area application
There are several low loss high frequency dielectric material which can be used successfully due to their thermal stability (able to sustain high temperatures), flexibility (will not damage with bending) [13].
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Wet antenna effect on VSAT rain margin
[8] D. Blackham, F. David, and D. Engelder, “ High frequency dielectric ma- terials measurements,” in Proc. 1990 RFIMWILightwave Symp.