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Supplier: Win Source Electronics
Description: Manufacturer: Micron Technology Inc. Win Source Part Number: 906126-28032116 Features: Memory IC Package: Tube Part Status: Obsolete Categories: Integrated Circuits (ICs) ECCN: OBSOLETE Popularity: High Fake Threat In the Open Market: 92 pct. Supply and Demand Status: Balance Quantity per
- Memory Category: Flash
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Supplier: TT Semiconductor, Inc.
Description: TT Semiconductor is the leading manufacturer of electronic components designed to survive under extreme temperature ranges and harsh environmental conditions. The current standard product offering is focused on high performance analog and memory devices. TT
- Density: 64000 kbits
- IC Package Type: SOIC, DIP, Other
- Memory Category: Flash
- Operating Temperature: -55 to 200 C
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Supplier: Cypress Semiconductor Corp.
Description: Cypress offers the industry™s highest performance, most secure, low-pin-count Serial NOR Flash Memory. Our broad portfolio makes it easy to find the ideal solution for your embedded system. The industry standard Quad SPI (Serial Peripheral Interface) interface is simple to use and is
- Density: 16000 to 1.00E6 kbits
- IC Package Type: BGA, SOIC, Other
- Pin Count: 8 to 24
- Screening Level: Commercial, Industrial
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Supplier: Cypress Semiconductor Corp.
Description: Cypress offers the industry's broadest portfolio of high performance Parallel NOR Flash Memory. Our Parallel NOR Flash Memory is designed to provide fast random access read performance and high bandwidth. Cypress also offers standard, simultaneous read/write, burst, and
- Density: 8000 to 2.00E6 kbits
- IC Package Type: TSOP, Other
- Pin Count: 48 to 80
- Screening Level: Commercial, Industrial
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Supplier: SK Hynix
Description: System performance depends highly on eMMC performance, such as random read and write IOPS. SK hynix eMMC provides the best IOPs performance by using advanced FTL algorithm. Furthermore, features of eMMC5.0 allows for an even greater improvement in performance.
- Density: 512000 to 1.02E9 kbits
- Operating Temperature: -45 to 85 C
- Supply Voltage: 1.8 V, 2.7 V, 3 V, 3.3 V, 3.6 V
- Technology: NAND
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Supplier: Cypress Semiconductor Corp.
Description: stringent quality standards including AEC-Q100 for automotive applications. All our NAND Flash Memory products are targeted specifically for data storage in Automotive Instrument Clusters and Infotainment Systems, Communication Equipment, Consumer Electronics and Industrial Automation.
- Density: 1.00E6 to 1.60E7 kbits
- IC Package Type: BGA, TSOP
- Pin Count: 48 to 67
- Screening Level: Commercial, Industrial
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: Kioxia America, Inc. Category: Integrated Circuits (ICs) Memory Memory Package: Tray Product Status: Active Memory Size: 32 GB Mounting Style: SMD/SMT
- Memory Category: Flash
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Supplier: Win Source Electronics
Description: Manufacturer: Cypress Semiconductor Corp Win Source Part Number: 1001814-1819-0876 Categories: Integrated Circuits Status: Last Time Buy Popularity: Medium Fake Threat In the Open Market: 60 pct. Supply and Demand Status: Balance
- Memory Category: Flash
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Supplier: Utmel Electronic Limited
Description: IC FLASH MEMORY NOR
- Memory Category: Flash
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: Alliance Memory, Inc. Category: Integrated Circuits (ICs) Memory Memory Package: Tray Product Status: Active Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - NAND Memory
- Memory Category: Flash, Other
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Supplier: TT Semiconductor, Inc.
Description: TT Memories is a division of Twilight Technology formed to support the memory marketplace from legacy technologies to state-of-the-art technologies. TT Memories manufactures devices and modules for the Commercial, Industrial, Aerospace, and Defense marketplaces. TT
- Density: 4000 kbits
- Memory Category: Flash
- Operating Temperature: -55 to 125 C
- Supply Voltage: 5 V
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Supplier: LCSC Electronics Technology (HK) Limited
Description: WSON-8 NAND FLASH ROHS
- Memory Category: Flash
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, MEMORY CARD, FLASH MEMORY, 15 MBYTE. FREE 2 YEAR RADWELL WARRANTY
- Memory Category: Flash
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Supplier: Radwell International
Description: FLASH MEMORY, 512 KX 8BIT, 70NS, PLCC 32, PARALLEL, MEMORY CAPACITY 4MB.. FREE 2 YEAR RADWELL WARRANTY
- Memory Category: Flash
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Supplier: Radwell International
Description: (PRICE/TC) FLASH MEMORY, 2MBIT, -40 TO 85DEG C, FLASH MEMORY TYPE:SERIAL NOR, MEMORY SIZE:2MBIT, FLASH MEMORY CONFIGURATION:-, IC INTERFACE TYPE:SPI, MEMORY CASE STYLE:WSOIC, NO. OF PINS:8PINS, CLOCK FREQUENCY:70MHZ, ACCESS TIME:-, SUPPLY ROHS
- Memory Category: Flash
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Supplier: Radwell International
Description: (PRICE/TC) FLASH MEMORY, 8MBIT, -40 TO 85DEG C, FLASH MEMORY TYPE:SERIAL NOR, MEMORY SIZE:8MBIT, FLASH MEMORY CONFIGURATION:4096 PAGES X 264BYTE, IC INTERFACE TYPE:SPI, MEMORY CASE STYLE:NSOIC, NO. OF PINS:8PINS, CLOCK FREQUENCY:85MHZ, ACCESS
- Memory Category: Flash
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Supplier: Datakey
Description: logo options for the shank and head areas. Datakey's large memory capacity serial flash memory Keys feature a Serial Peripheral Interface (SPI) which is a synchronous serial data link that is standard across many microprocessors and other peripheral chips. It provides a
- Density: 2000 to 32000 kbits
- Operating Temperature: -40 to 85 C
- Screening Level: Commercial, Industrial
- Supply Voltage: 2.7 V, 3 V, 3.3 V, 3.6 V, Other
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Supplier: Infineon Technologies AG
Description: Home // Products // Memories // NOR flash // Parallel NOR flash // Standard interface parallel flash // S29AL016J70TFN023
- Access Time: 70 ns
- Density: 16000 kbits
- IC Package Type: Other
- Operating Temperature: -40 to 125 C
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Description: MEMORY
- Cycle Time: Up to 1.00E7 ns
- Data Rate: 80 MHz
- Density: 1000 kbits
- Memory Category: Flash, Other
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Supplier: Karl Kruse GmbH & Co. KG
Description: Karl Kruse is a worldwide leading franchised distributor (ISO: 9001-2008 certified). A service provider specializing in the supply and material management of electronic components, since 1951. We are an innovative company who is dedicated to collaborating with customers and partners to develop and
- Memory Category: Flash
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Supplier: Infineon Technologies AG
Description: Home // Products // Memories // NOR flash // Parallel NOR flash // Standard interface parallel flash // S29AL008J70TFA010
- Access Time: 70 ns
- Density: 8000 kbits
- IC Package Type: Other
- Memory Category: Flash
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Supplier: Quarktwin Technology Ltd.
Description: FLASH - NOR (SLC) Memory IC 64Mbit SPI - Quad I/O 8-XSON (4x4)
- Density: 64000 kbits
- IC Package Type: Other
- Memory Category: Flash, Other
- Supply Voltage: Other
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Supplier: Advantech
Description: The PCD-3835 is an IDE compatible Solid State Disk (SSD). The SSD uses a Flash memory chip to store data. You can read and write to the solid state disk just as you read and write to a hard disk drive. However, solid state disks are designed to be much more reliable in harsh
- Memory Type: CompactFlash®
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Supplier: Twilight Technology Inc.
Description: and memory module solutions. Our customers benefit from our broad experience and expertise in design, IC packaging, component reliability, and quality testing. With 25 years of design experience, our engineering staff solves problems with footprint conversions, RoHS, BGA and flip chip
- Memory Category: Flash
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Supplier: DigiKey
Description: Memory
- Density: 128000 kbits
- IC Package Type: Other
- Memory Category: Flash
- Operating Temperature: -40 to 85 C
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Supplier: ODG (Origin Data Global)
Description: IC MEMORY FLASH NOR
- Memory Category: Flash
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Supplier: Microchip Technology, Inc.
Description: The Flashtec® NVMe 2108 PCIe Flash controller supports the standard NVM Express (NVMe™) host interface, and is optimized for high-performance 4 KB random read/write operations, performing all flash management operations on-chip and consuming negligible host processing and
- Memory Category: Flash
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Supplier: Sealevel Systems, Inc.
Description: The 1GB SD card is designed for industrial computer equipment operating at extended temperature ranges from -40C to +85C. The flash memory card has built-in error correction for reliable high-speed and error-free data transfers. The SD card uses SLC memory chips and is
- Features: Embedded
- Memory Size: 1 GB
- Memory Type: SD™
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Supplier: Lingto Electronic Limited
Description: IC MEMORY FLASH NOR
- Access Time: 8 ns
- Density: 128000 kbits
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Supplier: ODG (Origin Data Global)
Description: IC 512 MB FLASH MEMORY
- Density: 512000 kbits
- IC Package Type: Other
- Operating Temperature: -40 to 105 C
- Supply Voltage: Other
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Supplier: Texas Instruments
Description: 32-Mbit High-Temp Flash Memory with Serial Peripheral Interface (SPI) Bus 0-XCEPT -55 to 210
- Density: 32000 kbits
- IC Package Type: Other
- Operating Temperature: -55 to 210 C
- Screening Level: Other
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Description: The authoritative reference guide for nonvolatile memory users Presented here is an all-inclusive treatment of Flash technology, includingFlash memory chips, Flash embedded in logic, binary cell Flash, and multilevel cell Flash. Comprised of
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Supplier: MagicRAM, Inc.
Description: Monitoring &diagnostic feature. Features: Compliant with standard SD 2.0/SD 3.0/SD 4.0 Chip On Board design for highest robustness SLC, pSLC , MLC or TLC NAND Flash SMART disk Health Monitoring Controlled BOM and PCN
- Memory Size: 0.2560 to 256 GB
- Memory Type: MicroSD™
- Transfer Speed: 90 to 95 MB/sec
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Supplier: Corsair Memory
Description: The Flash Voyager Mini utilizes a cap-less retractable connector plug which easily opens with the flick of the thumb, and its ergonomic rubberized housing makes it easy to connect and disconnect from any computer. This makes it the perfect flash drive for users with busy and active
- Memory Size: 32 GB
- Memory Type: USB
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High-Performance 32Mb SPI NOR Flash Memory Chip The W25Q32JVSSIQ by Winbond Electronics Corporation America delivers superior performance with its large storage capacity, fast (read more)
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The level of reliability demanded of the NAND-type Flash memory control is constantly rising. To meet this demand, TDK has developed its own NAND Flash memory controller GBDriver with TDK's unique NAND Flash control technology. The GBDriver provides SSD, NAND (read more)
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SoftDevice S112 is a memory-optimized Bluetooth® Low Energy protocol stack for the nRF52805, nRF52810, nRF52811, nRF52820 and nRF52832 System-on-Chips (SoCs). Up to 4 connections as a Peripheral can be run concurrently with a Broadcaster. It is Bluetooth 5.1 qualified and supports the (read more)
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External Memory Interfacing Techniques for the PIC18F8XXX
The PIC18FXXXX family offers the largest range of on-chip enhanced FLASH program memory and the richest selection of peripherals in the current line of Microchip microcontrollers. The PIC18F8XXX subset is made up of 80-pin parts that further extend the capabilities by providing access to external
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External Memory Interfacing Techniques for the PIC18F8XXX
The PIC18FXXXX family offers the largest range of on-chip enhanced FLASH program memory and the richest selection of peripherals in the current line of Microchip microcontrollers. The PIC18F8XXX subset is made up of 80-pin parts that further extend the capabilities by providing access to external
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Freescale: Using HC08 Micro Controller Family to Enhance System Security
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
a DVD device that it hopes will seed the market for the growing video standard in everything from cars to mini-entertainment systems. Samsung taps NAND flash devices for cell phones SAN MATEO, Calif. -- Samsung Electronics said it has started offering NAND flash memory, used mostly as data storage
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
with 0.15-micron design SEOUL -- Samsung Electronics Co. Ltd. today reported development of a 512-megabit NAND-type flash memory chip using 0.15-micron design rules. The Korean chip maker claimed the memory is the industry's smallest 512-Mbit NAND-type flash, and the company said it plans to launch
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
memory fabs and memory process technology development effort within the company 's flash memory group. How to win IC-equipment orders at Intel For years, Intel Corp. has been the world 's largest buyer of semiconductor equipment and materials. This, in turn, prompts chip-equipment and materials
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Ericsson readies a common 3G platform, urges China to award licenses Future Horizons goes back to 18% growth forecast for ICs The Week in Review: November 23 to 29 Dubai pulls the plug on German foundry, says report Citigroup reportedly offers $430 million for non-memory Hynix Strong October chip
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
and development of its patented porous silicon-based direct methanol fuel cell to include 200-mm wafers. The company's current process primarily uses 100-mm wafers. Renesas, Powerchip broaden relationship on flash memory Renesas Technology and Powerchip Semiconductor have signed a manufacturing
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
TV French fabless chip company DiBcom SA has formed a partnership with Tata Elxsi Ltd., the embedded product design arm of the Tata Group (Bangalore, India), Tata Elxsi has said. Qimonda takes time out of flash market Memory chip vendor Qimonda has stopped development of NAND flash memory devices
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Smart Computing Article - Basic Input/Output System
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disk drive chip business for $100 million North America is key to Israeli DSL supplier Metalink's Q4 revenue growth Intel forum to map three-front battle for processor platforms Amkor, suppliers tackle testing bottlenecks for 5-GHz chip package Ericsson, Intel to define new flash memories for 3G cell
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
, Powerchip broaden relationship on flash memory Renesas Technology and Powerchip Semiconductor have signed a manufacturing agreement and a technology and sales licensing agreement pertaining to Renesas' 4-gigabit AG-AND flash memory devices. Advanced display technology on full view at SID
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
XP microprocessor line. The chip set will also propel the adoption of 1394 in PCs, consumer items, and home networking systems. Samsung files suit against SanDisk over flash-memory patents SEOUL -- Samsung Electronics Co. Ltd. here has filed a suit against SanDisk Corp. over flash-memory patents
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
IC Insights ranks hot, cold IC markets for 2005 Industrial/special-purpose logic and NAND flash memory are among the "hottest " chip market in terms of growth for 2005, while MOS gate arrays and NOR flash are projected to be among the worst sectors this year, according to IC Insights. TEL led
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
by renegotiating building contracts with various companies, according to the Flash memory's direction unclear after down year Coming off the worst year in its history, is flash memory poised for a comeback in 2002 or continued recession? Forecasts last week varied dramatically, ranging from 20% growth
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
on the company's cdma2000 3G standard, the new MSM5010 chip set from Qualcomm is geared for carriers in Latin America, Australia, New Zealand, Asia and North America. SanDisk braces for big loss, 35% sequential sales drop due to low flash prices SUNNYVALE, Calif.--Flash memory supplier SanDisk Corp. here