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  • Mold Design and Maintenance - Eliminating Contamination and Wear in Cleanroom Tooling - 06/06
    Parts One, Two and Three of Cleaning Molds Cleaning a mold is a critical part of the repair process, but many myths must be dispelled. Parts One and Two of Troubleshooting Defects Using analytical skills based on historical mold performance and maintenance requirements, combined with mold and part
  • Interphex Stands Test of Time (and Economy)
    By Paul Thomas, Senior Editor ATS Automation Tooling Systems Booth #2841 ATS Automation Tooling Systems provides innovative, custom-designed, built and installed manufacturing solutions to many pharmaceutical companies. ATS also contract manufactures electro-mechanical components and machinery
  • Five Factors to Consider when Molding PEEK
    . PEEK can be molded on standard injection molding machines supplied by most of the well-known machine suppliers. Depending on the grade of PEEK that you'll be molding, processing temperatures on your injection molding barrel will be somewhere in the range of 350-400°C. These temperatures can
  • Designing Atmospheric-Pressure Plasma Sources for Surface Engineering of Nanomaterials
    the silicon. wafer and cured for 45 min at 1001C. Upon cooling, the. PDMS mold was peeled from the master stamp, fluidic. connections were punched using 1.5 mm hole punchers. (Harris Uni-Core, Ted Pella, Redding, CA, USA) and excess. PDMS was cut off. The PDMS mold was then bonded to. cleaned 3  3 cm

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  • Advanced Flip Chip Packaging
    The processes of the solder fill, auto inspection, solder transfer and cleaning are automated using Mold Fill, Mold Inspection, Solder Transfer and Mold Cleaning tools .
  • C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
    The solder fill, auto inspection, solder transfer and cleaning processes are performed using Mold Fill, Mold Inspection, Solder Transfer and Mold Cleaning tools to provide the desired product C4 pattern on the wafers.