Semiconductor Etch

Description: High-performance peroxide-sulfuric etchant system that ensures maximum circuit densities, trace profile and excellent adhesion. Product Overview CircuEtch 300 is a high-performance flash etching process for circuit formation in Semi-Additive (SAP) and modified-Semi Additive

• Industry: Semiconductors / IC Packaging, Electronics

Description: Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

• Industry Applications: Semiconductor Wafer / Cleanroom
• Type: Etchant / Pickle, Surface Treatment

Description: and DI water injection system compensates for boil-off to maintain consistent chemistry temperature and acid/water ratio Includes etch-foil resistance heater and vapor thermocouple (for chemical boiling control) 360° nitrogen-purged housing seal reduces acid penetration of heating element for

Description: Used to deoxidize/activate copper based parts prior to electroplating.

• Industry Applications: Semiconductor Wafer / Cleanroom
• Type: Etchant / Pickle

Description: Continuously filters process chemistry to increase purity and maximize product yield Reduced acid consumption generally pays for bath in three months Select semiconductor-grade natural polypropylene or PVDF seamless process tank 360° serrated overflow weir

Description: Low Cost, High Copper Capacity Compared to Generic Sodium Persulfate.

• Industry Applications: Semiconductor Wafer / Cleanroom
• Type: Cleaner / Cleaning Agent

Description: Based on our popular BT-1, it shares the same robust and reliable characteristics while providing yet another example of Plasma Etch surface modification innovation. The large all aluminum chamber accommodates a generously sized circular, rotating active processing surface has the option of

• Applications & Materials Processed: Research / Surface Analysis, Other
• Automated Loading: Yes
• Coating System Type: Factory / Free Standing
• Gas Control Unit: Yes

Description: Rapid increases in aerial densities of HDD (Hard Disk Drive) requires advanced patterning solutions for thin film head production. This brings leading-edge semiconductor processes into the HDD industry as a breakthrough. Magnetic Head Etch System E-6000 Series: the EMCP (Electro

• Applications: Etching - Plasma / Wet
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Copper seed layer etchant providing selective etch and high loading capacity for UBM and RDL applications. Used also for selective Cu/Ni in UBM stack because of its great etching metal selectivity.

• Industry Applications: Semiconductor Wafer / Cleanroom
• Type: Etchant / Pickle, Surface Treatment

Description: Thermal Circuits is a custom manufacturer of conductive, convective and radiant etched foil heaters. They service a wide variety of markets and geographic areas and through continuous quality improvement, maintain world-class leadership in all aspects of their business. Strong engineering

• Industry Served: Aerospace, Automotive, Electronics, Food and Beverage, General Industrial, Medical, Military, Other
• Location: North America, United States Only, Northeast US Only
• Services: Design Assistance

Description: Gravimetric determination of etch rate of mixtures for etching silicon single crystals for use in semiconductor technology

Description: Spectrophotometric determination of etch rate of mixtures for etching silicon dioxide coatings for use in semiconductor technology

Description: Built as an extension of our MK-II platform, it offers you the same repeatability, reliability and long life, as well as low maintenance costs. The Reactive Ion Etch (RIE) electrode offers the highest directional plasma effect. Etching with our roll to roll plasma etcher in the large

• Applications & Materials Processed: Research / Surface Analysis, Other
• Gas Control Unit: Yes
• Integral Process Controller: Yes
• Materials Processed (Deposit or Substrate): Metal, Compound Semiconductors / GaAs, Tungsten / Refractory Metal, Other

Description: -cost-of-ownershi p solutions make it a wise choice for new installations or retrofitting existing systems for abatement. Benefits Generates high reactive specie fluxes, delivering higher destruction efficiency Etch gas abatement solution that meets regulatory or green

• Applications: Semiconductor Wafers, Etching - Plasma / Wet, Photolithography / Patterning
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Ebara's GCR abatement systems cleanly and efficiently remove carbon monoxide and PFC gases from ashing and oxide etch semiconductor waste streams. The standard GCR model targets CO gases using a high temperature oxidation path. PFC's such as CF4 are decomposed using an optional metal

• Applications & Materials Processed: Semiconductor Manufacturing
• Coating System Type: Factory / Free Standing

Description: . Wafer Specifications Diameter: 150 mm, 200 mm, 300 mm Material: All semiconducting and semi-insulating wafers including Si, GaAs, Ge, SiC, InP Surfaces: As-Cut, Lapped, Etched, Polished, Patterned Flat/Notch: All SEMI Standard Flat(s) or Notch Conductivity: P or N Type

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Maximum Wafer / Part Size: 300 mm

Description: used to define cells and electrodes, as well as anti-reflection coatings can all be measures with StellarNet Thin Film Measurement systems. Semiconductors StellarNet systems can measure thickness of non-metallic semiconductor process films. Also, StellarNet Thin Film

• Applications: Semiconductor Wafers, CVD / PVD Films, Polishing / CMP, Polymers / Photoresists, Other
• Form Factor: Monitor / Instrument
• Measurement Capability: Thickness - Film / Layer, Thickness - Wafer / Disc (TTV)
• Non-contact: Yes

Description: IC chip manufacturing processes, such as photolithography, etch, CVD, PVD, CMP, ion implantation, RTP, inspection, and metrology, are complex methods that draw upon many disciplines. Introduction to Semiconductor Manufacturing Technologies, Second Edition thoroughly describes the

Description: Innovative low-etch alternative oxide for improved laser direct drilling of vias and optimized topography. Product Overview MultiBond 500 is a first-generation, low-etch oxide alternative designed for laser direct drill pretreatment and reliable innerlayer adhesion in multilayer

• Industry: Semiconductors / IC Packaging, Electronics

Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF 3760 includes Rigaku's patented

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 200 mm

Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3800e can measure elements from S through U with a single-target, dual-beam X-ray system and a new liquid nitrogen-free detector system. The TXRF 3800e includes Rigaku

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 200 mm

Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-310 includes Rigaku's patented

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 150 to 300 mm

Description: Semitron® MPR 1000 shapes possess excellent heat resistance and low rates of erosion in plasma chambers. Due to these characteristics, it is often chosen for vacuum chamber applications within etch, CVD, and ion implant sub segmentations in the semiconductor and electronics industry.

• Industry: Electronics, Semiconductors / ICs, Other
• Tensile Modulus: 1000 ksi
• Tensile Strength (Break): 15000 psi

Description: The new Edwards STPA3503C turbo pump has been designed to accommodate the high gas flows required by the next generation of semiconductor and thin film etch processes. The enhanced rotor design, half rack controller and battery free d.c. drive operation provide considerable space

• Applications: General Purpose / Industrial, Analytical / Scientific, Semiconductor Manufacturing
• Configuration: Individual Vacuum Pump
• High / Ultrahigh Vacuum Type: Turbomolecular
• Lubrication Style: Dry / Oil-less

Description: The new Edwards STPA2503C turbo pump has been designed to accommodate the high gas flows required by the next generation of semiconductor and thin film etch processes. The enhanced rotor design, half rack controller and battery free d.c. drive operation provide considerable space

• Applications: General Purpose / Industrial, Analytical / Scientific, Semiconductor Manufacturing
• Configuration: Individual Vacuum Pump
• High / Ultrahigh Vacuum Type: Turbomolecular
• Lubrication Style: Dry / Oil-less

Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-V310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-V310 includes Rigaku's patented

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 150 to 300 mm

Description: -cost-of-ownershi p solutions make it a wise choice for new installations or retrofitting existing systems for abatement. Benefits Generates high reactive specie fluxes, delivering higher destruction efficiency Etch gas abatement solution that meets regulatory or green

• Applications: Specialty / Other
• Substrates / Surfaces: Semiconductors / Wafers
• Technology Type: RF Plasma (ICP)

Description: The ST-037-022-5000N is a Silicon Semiconductor "N"-doped bulk type Temperature Sensing Element that develops a large resistive change with temperature. This thermoresistive device is etched from a solid piece of doped material and has a minimum of molecular slippages and/or

• Nominal Resistance: 2800 to 6900 R₀ @ 0° C
• Operating Temperature: -100 to 400 F

Description: Low-etch alternative oxide provides low surface profiles and reliable adhesion for high frequency applications. Product Overview M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. The unique low-etch process provides a low

• Industry: Electronics, Semiconductors / IC Packaging

Description: for battery-free operation. The STPA2203C has been approved for use by major etch, ion implant and deposition equipment manufacturers in the semiconductor and magnetic media industries.

• Applications: General Purpose / Industrial, Chemical / Corrosive Gas, Semiconductor Manufacturing, Other
• Configuration: Individual Vacuum Pump
• High / Ultrahigh Vacuum Type: Turbomolecular
• Integral Backing Pump: Yes

Description: The small and powerful Edwards STPA1603C turbo-molecular pump has been designed using Edwards advanced rotor technology. This provides high throughput, maximum reliability and class leading performance which is demanded by the latest generation of semiconductor processes. Its half rack

• Applications: General Purpose / Industrial, Chemical / Corrosive Gas, Semiconductor Manufacturing, Other
• Configuration: Individual Vacuum Pump
• High / Ultrahigh Vacuum Type: Turbomolecular
• Integral Backing Pump: Yes

Description: embedded organic coating. Designed for use in high-throughput, automated horizontal conveyorized systems, it enables fast, consistent processing of thin core innerlayers. It is the ideal bonding process for controlled impedance innerlayers on advanced resin systems. With up to an 80% reduction in

• Industry: Electronics, Semiconductors / IC Packaging

Description: board prototyping. A higher resolution and faster detection algorithms accelerate the manufacturing process. This camera allows the LPKF ProtoLaser S4 to visually inspect and properly align the workpiece. The LPKF ProtoLaser S4 laser system can laser etch PCBs in minutes on a wide range of

• Automation / Control: Windows / PC Control
• Form Factor: Work Station
• Materials Processed: Semiconductors / Electronics
• Process / Operation: Laser Cutting

Description: PTFE can be etched with a sodium ammonia or sodium naphthalene etch so that its surface is chemically modified for adhesion to various substrates using ordinary commercial grade epoxies. When etched for bonding, PTFE can be used as chute liners, vessel linings, and glued to

• Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
• Coeff. of Thermal Expansion (CTE): 55 µin/in-F
• Dielectric Constant: 2.1
• Dielectric Strength: 500 kV/in

Description: data prep (DFM, OPC, SMO) • Mask write, corrections, process compensation (MPC) • Mask blanks, defects and metrology (materials, process, control) • Mask process (resist, devlop, etch, cleans) • Metrology (CD, placement, AFM, AIMS) • Defects

• Frequency: Annually
• Industry: Electronics and Semiconductor
• Type: Conference, Exhibition

Description: The m924 (4channel) and m922 (2channel) Semiconductor OEM modules are the newest Luxtron products for Etcher and Wafer Fab equipment temperature monitoring of Electrostatic Chucks, Chambers and other devices. The m920 Series modules are high performance solutions that are flexible,

• Device Category: Sensor / Transducer
• Electrical Outputs: Current, Serial
• Operating Temperature: 32 to 140 F
• Technology: Optical Pyrometer

Description: : High precision stage facilitates accurate measurements for even wider dimensions Enables measurements of top and bottom widths of etched lines Laser AF facilitates measurements of minuscule bump heights Enables evaluation of cross-sectional shapes of bumps and solder balls

• Applications / Capabilities: Electronics or Semiconductor Inspection
• Image Source: Optical Microscope
• System Type: Turnkey / Complete System

Description: For semiconductor liquid chemical processes A compact refractometer with an ultra-pure modified PTFE flow cell body for semiconductor liquid chemical processes. Connected to the process by a ¼ — 1 inch pillar or flare fitting. Vaisala K-PATENTS® Semicon

• Features: Alarms, Automatic Temperature Compensation, Measures Temperature
• Measurement Scale: RI Detector
• Monitoring: Continuous
• Mounting: Permanent or Fixtured

Description: For semiconductor liquid chemical processes A compact refractometer with an ultra pure modified PTFE flow cell body for semiconductor liquid chemical processes. Connected to the process by a ¼ — 1 inch pillar or flare fitting. Vaisala K-PATENTS® Semicon

• Features: Alarms, Automatic Temperature Compensation, Measures Temperature
• Measurement Scale: RI Detector
• Monitoring: Continuous
• Mounting: Permanent or Fixtured

Description: DW 212 is a film , skived from virgin PTFE, that has been etched on one side with sodium naphthalene. This surface treatment allows PTFE, which normally exhibits very poor adhesion, to be bonded to other materials. APPLICATION INFORMATION The major applications for sodium

• Adhesive: None / Non-adhesive
• Backing: Fluoropolymer, Plastic / Polymer, Specialty / Other
• Dielectric Strength: 9.84E7 V/m
• Features: Dielectric / Insulating

Description: , condensable and particulate by-products. They are very compact, quiet and have state-of-the-art network, control and feedback capabilities. Recommended Applications: Diffusion Furnaces, PECVD, a-Si / u-Si deposition, Etch, LPCVD Pumping Capacities: 120 m³/hr to 1,000 m³/hr (70-588 cfm)

• Applications: General Purpose / Industrial, Semiconductor Manufacturing, Other
• Configuration: Individual Vacuum Pump
• Lubrication Style: Dry / Oil-less
• Mechanical Pump Type: Other Mechanical Type

Description: PVC core: All interim thickness sizes are available on special order, and rolls may be silt to interim widths. All material conforms to ASTM D3308. Material is white. The material may be ordered etched for bonding on one or both sides for an additional charge (both Sodium Ammonia and Sodium

• Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
• Coeff. of Thermal Expansion (CTE): 55 µin/in-F
• Dielectric Constant: 2.1
• Dielectric Strength: 500 kV/in

Description: As the leading global lithography event, the technical program will focus on works in optical lithography, metrology, and EUV. Leaders come to solve challenges in lithography, patterning technologies, and unique materials, while sharing the latest advancements in the semiconductor industry

• Frequency: Annually
• Industry: Electronics and Semiconductor, Metals and Metal Fabrication
• Type: Conference, Exhibition

Description: , MOAIMO, and other substrates on glass or film bases Size of working area: 600mm*600mm (customizable, up to 84 inches) Smallest etching line width and spacing: 20µm, 20µm Mass production etching speed: 5000mm/s Able to etch strict 90° angles; no material distortion

• Applications: Other
• Automation: Automatic
• Media Handling: Metals, Plastics, Semiconductors / Electronics
• Operation: Electric

Description: As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped

• Applications & Materials Processed: Semiconductor Manufacturing, Photovoltaic / Solar, Medical, MEMS, Research / Surface Analysis, Other
• Coating System Type: Laboratory / Benchtop
• Integral Process Controller: Yes
• Materials Processed (Deposit or Substrate): Metal, Compound Semiconductors / GaAs, Tungsten / Refractory Metal, Other

Description: Material below .005 inches in thickness is classified as foil. Typical uses for it are production of drawn parts, electronic components, metallizing sources, furnace insulation and chemically etched parts. Molybdenum foil has the ability to be etched into fine patterns, which makes it

• Applications: Aerospace / Aircraft (AQ), Electronics / RF-Microwave, Other
• Features: Corrosion Resistant
• Metal / Alloy Types: Refractory / Reactive (UNS R), Molybdenum / Molybdenum Alloy
• Overall Thickness: 1.00E-3 to 0.0050 inch

Description: Our welded aluminum vacuum chamber encloses a generous 500 square inches of active plasma processing surface. Surface modification with Plasma Etch yields increased bond strength and cleanliness of most any surface material.

• Applications & Materials Processed: Research / Surface Analysis, Other
• Coating System Type: Laboratory / Benchtop
• Gas Control Unit: Yes
• Integral Process Controller: Yes

Description: The CS-137 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use BHF solution to etch silicon oxide and remove particles from the wafer surface. The CS-137 continually monitors each

Description: -of-the-art network, control and feedback capabilities. Recommended Applications: Diffusion Furnaces, PECVD a-Si / u-Si deposition, Etch LPCVD Pumping Capacities: 120 M3/hr to 1,000 M3/hr (70-588 cfm)

• Applications: General Purpose / Industrial, Analytical / Scientific, Semiconductor Manufacturing
• Configuration: Individual Vacuum Pump
• Lubrication Style: Dry / Oil-less
• Mechanical Pump Type: Rotary Screw

Description: application deployment and bringing the power of artificial intelligence (AI) to non-programmers. Read challenging characters and text in minutes The In-Sight D900 deciphers badly deformed, skewed, and poorly etched codes using optical character recognition. Equipped with a pre

• Applications / Capabilities: Assembly Quality, Biotechnology or Medical, Electronics or Semiconductor Inspection, Food & Beverage, Pharmaceutical Packaging, Security & Biometrics, Other
• Data Storage: 16 GB
• System Type: Modular / PC-Based

Description: The Det-Tronics PM-5MPX Dual Spectrum IR flame detector is optimized for the rigorous semiconductor fabrication industry. It is ideal for the detection of hydrogen, siline, and typical materials used in electronics manufacturing. The detector incorporates unique Dual Spectrum infrared sensor

• Communication Interface Options: Serial
• Device Classification: Sensor
• Maximum Detector Range (Sensitivity): 18 ft
• Maximum Response Time: 1 seconds

Description: Oil and gas: hydraulics, subsea couplings, subsea Christmas trees, subsea compressors, electronic submersible pumps, flow meters Life sciences: imaging & scanning systems Ultra-high vacuum: accelerators & fusion research Semiconductor chamber, exhaust and other applications in

• Application / Industry: Chemical & Processing, Piping and Valves, Oil & Gas, Nuclear, Semiconductor, Specialized
• Cryogenic Application: Yes
• Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Silver, Titanium, Specialized or Other
• Material Features: Plated / Coated

Description: demand in RF-driven plasma systems for semiconductor processing. Applications include etch, RIE, parallel plate, ICP, RF sputtering, CVD and PVD, as well as induction and dielectric heating processes in industrial systems. Features: Solid state for long life and low

• AC Input Voltage: 208 volts
• Adjustable Frequency: Yes
• Form Factor: Rack Mount
• Input Frequency: 50 to 60 Hz

Description: series is designed to meet the performance demand in RF-driven plasma systems for semiconductor processing. Applications include etch, RIE, parallel plate, ICP, RF sputtering, CVD and PVD, as well as induction and dielectric heating processes in industrial systems. Features

• AC Input Voltage: 208 to 230 volts
• Adjustable Frequency: Yes
• Form Factor: Rack Mount
• Input Frequency: 50 to 60 Hz

Description: % bandwidth. The CLX 10000 provides 10,000 watts of power. The solid-state design provides low cost of ownership with high reliability. Applications: The CLX series is designed to meet the performance demand in RF-driven plasma systems for semiconductor processing. Applications include

• AC Input Voltage: 187 to 229 volts
• Adjustable Frequency: Yes
• Form Factor: Rack Mount
• Input Frequency: 50 to 60 Hz

Description: provides low cost of ownership with high reliability. Applications: The CX series is designed to meet the performance demand in RF-driven plasma systems for semiconductor processing. Applications include etch, RIE, parallel plate, ICP, RF sputtering, CVD and PVD, as well as induction

• AC Input Voltage: 115 to 480 volts
• Form Factor: Rack Mount
• Input Frequency: 50 to 60 Hz
• Number of Outputs: 1 #