Semiconductor Polymer Composites

Description: Thermoplastic composites are produced using thermoplastic polymers as matrix materials, which soften upon heating to elevated temperatures for processing, and harden upon cooling. High-performance thermoplastic polymers used for thermoplastic composites provide a number

• Chemical / Polymer System Type: PEEK, Specialty / Other
• Filler Material: Aramid Fiber, Carbon / Graphite, Fiber Glass
• Industry: Aerospace, Electric Power, Semiconductor / IC's
• Material Type / Grade: Composite Material, Thermoplastic

Description: TPL, Inc. is a materials science-based technology development and manufacturing company, a technologies to products leader based in Albuquerque, New Mexico. TPL has three divisions the Defense Systems Division, the Capacitance Products Division and Micropower Technologies Division. The Defense

• Dielectric Constant: 4.75 to 5.03
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Composite, Film / Sheet, Polymer (Plastic / Elastomer)

Description: Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of

• Chemical / Polymer System Type: Epoxy
• Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
• Compound Type: Casting Resin
• Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F

Description: High performance thermoplastic material, unreinforced PolyEtherEtherKetone (PEEK), semi crystalline, fine powder for composite manufacture, easy flow, FDA food contact compliant, colour natural.

• Chemical / Polymer System Type: PEEK
• Compound Type: Extrusion Grade Resin, Molding Resin
• Elongation: 15 %
• Filler Material: Unfilled

Description: TECAPEEK® CMF white is a composite material based on Victrex® PEEK 450G polymer, that is filled with ceramic. This material has been specifically designed with the requirements of the semiconductor industry in mind. Because of the often-intricate designs necessary for parts such

• Chemical / Polymer System Type: PEEK
• Filler Material: Other
• Industry: Semiconductor / IC's, Other
• Material Type / Grade: Thermoplastic

Description: TECAPEEK CMF is a composite material based on Victrex® PEEK 450G polymer, that is filled with ceramic. This materials has been specifically designed with the requirements of the semiconductor industry in mind. Because of the often intricate designs necessary for parts such as

• Dielectric Constant: 4.71
• Dielectric Strength: 168 kV/in
• Elongation: 3 to 4.85 %
• Polymer Matrix Type: PEEK, Specialty / Other

Description: Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure to UV lamps or EB radiation. The cure can be effected in air or under an inert atmosphere such

• Coeff. of Thermal Expansion (CTE): Over 33 µin/in-F
• Dissimilar Substrates: Yes
• Elongation: 6 %
• Features: Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material, Flexible / Dampening, Laminating / Composites, Leveling / Filling Compound, Non-corrosive Cure

Description: ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full load,

• Dielectric Constant: 4.3
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Adhesive, Composite, Polymer (Plastic / Elastomer)

Description: Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die & lid attach material.Requires low heat assist for cure. Ideal for applications requiring low-heat curing.

• Dielectric Constant: 3.5 to 4.5
• Dielectric Strength: Over 1.50E7
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Adhesive, Composite, Polymer (Plastic / Elastomer)

Description: Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure.

• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Adhesive, Composite, Polymer (Plastic / Elastomer)

Description: Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. Requires heat assist.

• Dielectric Constant: 4.3
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Adhesive, Composite, Polymer (Plastic / Elastomer)

Description: Aremco’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high

• Dielectric Strength: 9.65E6
• Features: Electronics / Semiconductors
• Material Form: Polymer (Plastic / Elastomer)

Description: 10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible.

• Dielectric Constant: 3.3 to 3.6
• Dielectric Strength: 1.57E7
• Features: Electronics / Semiconductors
• Material Form: Adhesive, Composite, Polymer (Plastic / Elastomer)

Description: 10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. 10-3216 is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3216 is excellent for bonding many metals and woods, most plastics

• Dielectric Constant: 4.4
• Dielectric Strength: 1.61E7
• Features: Electronics / Semiconductors
• Material Form: Composite, Polymer (Plastic / Elastomer)

Description: Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This

• Chemical / Polymer System Type: Epoxy
• Coeff. of Thermal Expansion (CTE): 33 to 44 µin/in-F
• Compound Type: Casting Resin
• Deflection Temperature (@ 264 psi, 1.8 MPa): 150 F

Description: Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio

• Chemical / Polymer System Type: Epoxy
• Coeff. of Thermal Expansion (CTE): 22 µin/in-F
• Compound Type: Casting Resin
• Dielectric Constant: 4.1

Description: Aremco’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high

• Features: Electronics / Semiconductors
• Material Form: Grease / Gel, Polymer (Plastic / Elastomer)

Description: Hi-temp, prevents dusting of fibrous insulation materials

• Features: Electronics / Semiconductors
• Material Form: Composite, Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound

Description: TECAPEEK CMF is a composite material based on Victrex® PEEK 450G polymer, that is filled with ceramic. This materials has been specifically designed with the requirements of the semiconductor industry in mind. Because of the often intricate designs necessary for parts such as

• Chemical / Polymer System Type: PEEK
• Coeff. of Thermal Expansion (CTE): 31 µin/in-F
• Deflection Temperature (@ 264 psi, 1.8 MPa): 551 to 572 F
• Dielectric Constant: 4.71

Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire

• Dielectric Strength: 1.97E7
• Features: Electronics / Semiconductors
• Material Form: Composite, Polymer (Plastic / Elastomer), Potting Compound

Description: 20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives, which downgrade physical, thermal, and electrical insulation properties.

• Dielectric Constant: 0.5200
• Dielectric Strength: 2.36E6
• Features: Electronics / Semiconductors
• Material Form: Composite, Polymer (Plastic / Elastomer), Potting Compound

Description: 20-3221 is a very low viscosity epoxy potting, casting and encapsulating resin system. 20-3221 is a filled system resulting in excellent dimensional stability and low shrinkage.

• Features: Electronics / Semiconductors
• Material Form: Composite, Polymer (Plastic / Elastomer), Potting Compound

Description: Exceptional electrical, moisture & chemical resistance

• Features: Electronics / Semiconductors
• Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound

Description: service rating and/or superior electrical properties are desired. This material is often used as a release film in the production of high temperature flex circuit materials, as well as in the production of microwave circuit materials where it is seen as both a release film and a bonding film. DW2000

• Dielectric Strength: 7.87E7
• Features: Electronics / Semiconductors, Electrical Power / HV
• Material Form: Polymer (Plastic / Elastomer), Specialty / Other

Description: processing, they can be incorporated into a wide range of polymers for density reduction. And the benefits of 3M glass bubbles go far beyond lightweighting: the inherent properties of these microspheres provide a number of unique performance and processing advantages. - Weight reduction

• Applications: Coatings / Paint, Electronics / Semiconductors, Plastics / Composites
• Function: Extender (Bulking Agent / Diluent)

Description: JG&A Metrology Center is a global leader for Industrial Computed Tomography Scanning Services. By utilizing our non-destructive Industrial CT Scanning Services, clients are able to drastically reduce pre-production inspection costs and analyze internal failures quickly and accurately in 3D. The NDT

• Industry: Aerospace / Aviation, Automotive, Food / Beverage, Health Care / Medical, Military, Nuclear / Utility, Packaging, Semiconductors / Electronics, Structural / Construction, Specialty / Other
• Laboratory Services Offered: Deformulation / Reverse Engineering, Failure Analysis, Other
• Materials: Adhesives / Sealants, Ceramics / Glass, Composites, Concrete / Mortar, Fuel Cell / Battery Materials, Metals, PCBs / Dioxins, Plastic / Rubber, Polymers / Organics, Welds / Joints, Other
• Regional Preference: North America, United States Only, Northeast US Only, Southern US Only, Southwest US Only, Northwest US Only, Midwest US Only, Canada Only, South / Central America Only, Europe Only

Description: Cambridge Polymer Group, Inc. was founded in 1996 to provide a cost-effective resource for testing, research and development to clients who need periodic access to Ph.D.-level scientists and their support structure. With years of expertise in these testing parameters, we do more than

• Industry: Automotive, Chemical / Material Processing, Food / Beverage, Health Care / Medical, Legal / Forensics, Pharmaceutical / Biotech, Semiconductors / Electronics, Specialty / Other
• Laboratory Services Offered: Assays / Quantitative, Chemical Testing Services, Cleanliness Monitoring / Testing, Deformulation / Reverse Engineering, Failure Analysis, Materials Testing Services, Report Preparation, Standards Testing / Certification, Other
• Materials: Adhesives / Sealants, Chemicals, Coatings, Composites, Cosmetics (Creams, Sunblocks, etc.), Fuel Cell / Battery Materials, Nanomaterials, Paper, Petroleum Fluids (Oil, Fuel, Distillates), Plastic / Rubber, Polymers / Organics, Powders, Solid Waste, Textiles, Volatiles (VOCs) /
• Regional Preference: North America, United States Only, Northeast US Only

Description: (DMA), tensile testing, compression testing, creep testing For a partial list of ASTM standards performed by Cambridge Polymer Group, please see ASTM Standards on our website: http://www.campoly.c om/astm.html Cambridge Polymer Group provides testing services of

• Industry Applications: Aerospace / Aviation, Food / Beverage, Automotive, Chemical / Material Processing, Health Care / Medical, Legal / Forensics, Marine, Military, Pharmaceutical / Biotech, Packaging, Semiconductors / Electronics, Structural / Construction, Specialty / Other
• Materials: Adhesives / Sealants, Chemicals, Coatings, Composites, Cosmetics (Creams, Sunblocks, etc.), Inorganics, Nanomaterials, Paper, Petroleum Fluids (Oil, Fuel, Distillates), Plastic / Rubber, Polymers / Organics, Powders, Textiles, Thin Films / Plating, Wafers / Surfaces, Water
• Regional Preference: North America, United States Only, Northeast US Only
• Services Offered: Assays / Quantitative, Cleanliness Monitoring / Testing, Deformulation / Reverse Engineering, Environmental Exposure Testing, Materials Testing Services, Quality / Purity (Contamination), Report Preparation, Standards Testing / Certification, Umpire Testing, Other

Description: pulse energy >0.1mJ Beam diameter10~30um Marking area: 60mm*60mm- 250mm*250mm Repetition accuracy±0.005mm Scanning speed5000mm/s Application materials and field: Various of metals, alloy, semiconductor, diamond, jade, sapphire , ceramic, polymer, composite material , resin,

• Automation / Control: Windows / PC Control
• Materials Processed: Metal / Conductive Materials, Semiconductors / Electronics, Soft / Fibrous (Textiles, Foams, Paper)
• Process / Operation: Laser Cutting
• Pulsed / Q-switched: Yes

Description: Atlas is the industry leader and the only weathering organization to provide a global approach to providing natural and accelerated weathering testing solutions for materials durability issues with over 20 exposure sites and laboratories to serve your needs. As part of a commitment to provide the

• Industry: Aerospace / Aviation, Automotive, Chemical / Material Processing, Food / Beverage, Health Care / Medical, Marine, Military, Packaging, Pharmaceutical / Biotech, Semiconductors / Electronics, Structural / Construction
• Laboratory Services Offered: Environmental Exposure, Environmental Testing and Analysis Services, Materials Testing Services, Standards Testing / Certification, Sunlight Exposure / Solar Simulation
• Materials: Adhesives / Sealants, Ceramics / Glass, Chemicals, Coatings, Composites, Concrete / Mortar, Metals, Nanomaterials, Paper, Plastic / Rubber, Polymers / Organics, Powders, Soil, Textiles, Thin Films / Plating
• Regional Preference: North America, United States Only, Southern US Only, Southwest US Only, Midwest US Only, Europe Only, South Asia Only, Other

Description: No Description Provided

• Industry Applications: Aerospace / Aviation, Food / Beverage, Automotive, Chemical / Material Processing, Cleanroom, Health Care / Medical, Legal / Forensics, Marine, Military, Pharmaceutical / Biotech, Packaging, Semiconductors / Electronics, Structural / Construction
• Materials: Adhesives / Sealants, Ceramics / Glass, Chemicals, Coatings, Composites, Concrete / Mortar, Cosmetics (Creams, Sunblocks, etc.), Inorganics, Metals, Nanomaterials, Paper, Plastic / Rubber, Polymers / Organics, Powders, Textiles, Thin Films / Plating, Wafers / Surfaces
• Regional Preference: North America, United States Only, Northeast US Only
• Services Offered: Materials Testing Services, Sunlight Exposure / Solar Simulation

Description: has successfully provided superior materials characterization, product development and manufacturing services to entrepreneurs, quality control, research and industrial scientists and engineers in the following industries: Aerospace Electronics Graphic Arts Medical Devices Personal Care Plastics

• Capabilities: Corona Treatment, Other
• Industry Expertise: Aerospace, Automotive, Biotechnology, Chemicals / Materials, Consumer, Electrical / Electronics, Food and Beverage, Medical, Packaging, Pharmaceutical, Rail / Mass Transit, Transportation Services, Other
• Materials: Composites, Plastic / Polymer
• Regional Preference: North America, United States Only, Southwest US Only

Description: -metal composite materials such as metal matrix composites and laminated materials. ISO 15856:2009 does not cover semiconductor materials used for electronic components. The types of simulated radiation include charged particles (electrons and protons), solar ultraviolet

Description: has successfully provided superior materials characterization, product development and manufacturing services to entrepreneurs, quality control, research and industrial scientists and engineers in the following industries: Aerospace Electronics Graphic Arts Medical Devices Personal Care Plastics

• Capabilities: Assays / Quantitative, Chemical Testing Services, Cleanliness Monitoring / Testing, Deformulation / Reverse Engineering, Environmental Exposure Testing, Environmental Testing and Analysis Services, Failure Analysis, Field Sampling, Monitoring Programs (Audits / Surveillance), Quality / Purity
• Industry Applications: Aerospace / Aviation, Automotive, Chemical / Material Processing, Food / Beverage, Health Care / Medical, Pharmaceutical / Biotech, Packaging, Semiconductors / Electronics, Specialty / Other
• Materials: Adhesives / Sealants, Chemicals, Coatings, Composites, Cosmetics (Creams, Sunblocks, etc.), Fuel Cell / Battery Materials, Petroleum Fluids (Oil, Fuel, Distillates), Plastic / Rubber, Polymers / Organics, Powders, Wafers / Surfaces, Other
• Regional Preference: North America, United States Only, Southwest US Only

Description: TÜV Rheinland ® Industrial Solutions (TRIS) combines the superior services of Non-Destructive Testing Services, Inc., Unified Testing Services, Inc. and TÜV Rheinland Industrial Solutions to better meet the requirements of national and international industrial clients. TRIS provides a full range of

• Capabilities: Cleanliness Monitoring / Testing, Deformulation / Reverse Engineering, Environmental Exposure Testing, Environmental Testing and Analysis Services, Failure Analysis, Field Sampling, Geotechnical Services, Monitoring Programs (Audits / Surveillance), Quality / Purity (Contamination - Alloys,
• Industry Applications: Aerospace / Aviation, Automotive, Chemical / Material Processing, Cleanroom, Food / Beverage, Health Care / Medical, Legal / Forensics, Marine, Military, Nuclear / Utility, Pharmaceutical / Biotech, Packaging, Piping / Pressure Vessel, Semiconductors / Electronics, Structural / Construction,
• Materials: Adhesives / Sealants, Asbestos / Fibers, Ceramics / Glass, Coatings, Composites, Concrete / Mortar, Fuel Cell / Battery Materials, Metals, Paper, Petroleum Fluids (Oil, Fuel, Distillates), Plastic / Rubber, Polymers / Organics, Soil, Textiles, Thin Films / Plating, Toxins / Restrictive
• Regional Preference: North America, United States Only, Northeast US Only, Southern US Only, Southwest US Only, Northwest US Only, Midwest US Only