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Supplier: Fiber Instrument Sales, Inc./FIS
Description: Epoxy remains liquid until heat is applied
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Other
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Supplier: Fiber Instrument Sales, Inc./FIS
Description: Excellent for general connector use, heat cure in 30 minutes
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Other
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Supplier: Protavic America, Inc.
Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 4 to 5
- Features: Thermal Compound / Interface (Thermally Conductive), Electrical Insulation / Dielectric Material
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulation / Dielectric Material
- Filled / Reinforced: Yes
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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. Requires heat assist.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulation / Dielectric Material
- Filled / Reinforced: Yes
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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Flexible / Dampening
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Ellsworth Adhesives
Description: Parker LORD® Thermoset 70 Epoxy Adhesive Hardener Tan is a low viscosity curing epoxy hardener. It is used with several Thermoset epoxy resins to obtain a variety of handling and cured properties. 1 qt Bottle.
- Cure Type / Technology: Two Component System
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Description: Macropoxy® HS HIGH SOLIDS EPOXY is a VOC compliant epoxy polyamide mastic designed for application to properly prepared steel surfaces. May be used as a one or two coat, direct-to-metal protective coating. Can be applied to marginally prepared surfaces. Long-term durability
- Chemistry: Epoxy, Resin Base / Polymer Binder, Other
- Cure / Dry Temperature: 50 to 100 F
- Features: Chemical / Oil Resistant, Corrosion Inhibiting / Rust Preventive, Heat Resistant / High Temperature, Protective
- Form: Liquid
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Supplier: Ellsworth Adhesives
Description: Parker LORD® Thermoset 300 Epoxy Adhesive Resin Part A Black is a filled epoxy resin used with thermoset hardeners to obtain a variety of handling and cured properties. It offers shock resistance, excellent thermal conductivity, and lower coefficient of thermal expansion
- Cure Type / Technology: Two Component System
- Viscosity: 68000 cP
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Supplier: Techsil Limited
Description: Devcon 5 minute epoxy is a rapid curing multi purpose adhesive and encapsulating resin. It bonds rigid, durable substrates such as metal, glass, ceramics, concrete, and wood in minutes. This Devcon epoxy offers bonds which are permanent, non shrinking and will continue working all the
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress Technical Properties
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Fiber Instrument Sales, Inc./FIS
Description: Blue dye, pot life 30 minutes
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Other
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Supplier: Fiber Instrument Sales, Inc./FIS
Description: Quick cure, pot life 2 hours
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Other
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 31.67 to 82.78 µin/in-F
- Compound Type: Casting Resin
- Features: Biocompatible, Optical Grade
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 28.33 to 103 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 2.62
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 36.11 to 90 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 3.74
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 18.89 to 71.67 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 2.59
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Supplier: Georgia-Pacific Chemicals LLC
Description: These phenolic novolac resins are used as curing agents for epoxy resins in molding compounds, copper clad laminates, electrical applications and potting.
- Chemical / Polymer System Type: Phenolics (Melamine, Furan)
- Filler Material: Unfilled
- Industry: Industrial
- Resins & Compounds: Liquid
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Supplier: Techsil Limited
Description: Devcon 2 Ton epoxy is an extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, woods, concrete, glass etc. 2 Ton Epoxy is a general purpose material which dries to a clear product to achieve an extremely strong rigid bond with
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Koford Engineering, LLC
Description: E-108 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength at elevated temperatures as well as good long term strength at high temperature. Due to thealuminum filler the minimum bondline gap is approximately .002" to .003".
- Chemical / Polymer System Type: Epoxy (EP)
- Use Temperature: 257 to 572 F
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Description: LOCTITE® ABLESTIK 8175 is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metallizations or traditional printed circuit board surfaces. It is capable of resolving fine pitch resolution (0.02 inch) when printed using either a
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: OEM / Industrial
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Supplier: Koford Engineering, LLC
Description: E-114 is a low cure temperature, non sag high performance filled single component epoxy adhesive whichcan be cured at 100°C or 120°C to provide good shear strength in combination with good temperatureresistanc e. Especially suitable for assembley applications such as building
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics
- Substrate / Material Compatibility: Metal
- Use Temperature: 284 to 392 F
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Supplier: Koford Engineering, LLC
Description: E-111 is a high performance aluminum filled single component modified epoxy adhesive which can be curedat 125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for
- Chemical / Polymer System Type: Epoxy (EP)
- Dissimilar Substrates: Yes
- Substrate / Material Compatibility: Metal
- Use Temperature: 257 to 392 F
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Supplier: Epoxies Etc...
Description: 10-3032R is a high bond strength epoxy adhesive and sealant. This system has a non-critical mix ratio and adjustable flexibility. 10-3032R is also safe to use due to the absence of harmful solvents and toxic chemicals in the formulation.
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: OEM / Industrial
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Supplier: Koford Engineering, LLC
Description: E-110 is a high performance unfilled single component modified epoxy adhesive which can be cured at125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for bonding
- Chemical / Polymer System Type: Epoxy (EP)
- Dissimilar Substrates: Yes
- Substrate / Material Compatibility: Metal
- Use Temperature: 257 to 392 F
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Supplier: Epoxies Etc...
Description: 10-3031 is a two component electronic grade epoxy system. This material provides excellent chemical and heat resistance. It is available in a standard and low viscosity.
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Electronics, OEM / Industrial
- Use Temperature: -40 to 320 F
- Viscosity: 11600 cP
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Supplier: Ellsworth Adhesives
Description: Parker LORD® Thermoset 600 General Purpose Epoxy Adhesive is used with a variety of Thermoset hardeners. It can be used in many applications including adhesives, laminating, and electrical/electroni c insulation. It also has different handling and cured properties depending on
- Cure Type / Technology: Two Component System
- Features: Laminating / Composites
- Viscosity: 13500 cP
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Description: SeaGuard® MP - Multi-Purpose Epoxy Primer is a high performance, VOC compliant primer that is designed to be used over a variety of substrates. This product contains an anticorrosive pigment specifically for the first coat on non-iron/steel substrates, providing outstanding adhesion and
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Cure / Dry Temperature: 50 to 110 F
- Features: Corrosion Inhibiting / Rust Preventive, Dielectric, Other
- Form: Liquid
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Supplier: Accuris
Description: Standard Criteria for Implantable Thermoset Epoxy Plastics
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Supplier: Master Bond, Inc.
Description: Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500°F. It cures
- Chemical / Polymer System Type: Epoxy, Specialty / Other
- Compound Type: Casting Resin
- Dielectric Constant: 2.94 to 3.74
- Electrical Resistivity: 1.00E10 to 3.00E14 ohm-cm
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Supplier: Epoxies Etc...
Description: 70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 2.5 µin/in-F
- Compound Type: Casting Resin
- Features: Thermally Conductive
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M™ Scotch-Weld™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Constant (Relative Permittivity): 6.06 to 6.1
- Dielectric Strength: 585 to 600 kV/in
- Elongation: 2 to 7 %
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Supplier: Ellsworth Adhesives
Description: Parker LORD® Thermoset EL-636 Epoxy Encapsulant is a two component system used for high temperature applications. It offers durability and protection of electrical devices exposed to harsh environmental conditions. Hardener Part B, Gray, 0.5 pt Can.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 464 kV/in
- Form / Function: Encapsulant / Potting Compound
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Description: Macropoxy® 920 PRE-PRIME is a 100% solids, VOC compliant, penetrating epoxy primer designed for use over marginally prepared steel or concrete surfaces. A penetrating sealer for tight rusted surfaces A penetrating sealer for concrete and masonry surfaces Low
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Cure / Dry Temperature: 40 to 120 F
- Features: Heat Resistant / High Temperature, Other
- Industry: Marine, OEM / Industrial, Other
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Featured Products Top
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most impact resistant plastics available. Examples of thermoset plastic polymers include epoxies, phenolics, silicones, and polyesters. Thermosetting Plastic Advantages: (read more)
Browse Datasheets for Osborne Industries, Inc. -
The molding process itself is crucial to reap the rewards of the advantages of thermosets, but the properties of the materials used, like fiber-reinforced polymers or fiberglass-reinforced plastics (FRP), are what make these finished parts a success ... There is a reason so (read more)
Browse Datasheets for Osborne Industries, Inc. -
Telene® polymer is an incredible family of materials, based on polydicyclopentadiene (PDCPD) chemistry. Osborne is one of only a few licensees worldwide for this thermoset which has properties similar to thermoplastic polyolefins. Telene polymer has outstanding corrosion resistance and (read more)
Browse Datasheets for Osborne Industries, Inc. -
At Osborne Industries, we have the knowledge and capability to mold custom structural foams for any number of applications. Polyurethane structural foams can be made very quickly and efficiently in our RIM molding shop. The use of structural foam in some applications can prove to be very cost effective. Light weight and rigid, structural foam can be molded with integral skin to give
(read more)
Browse Datasheets for Osborne Industries, Inc. -
Comprehending the difference between thermoset vs thermoplastics, and which applications are suitable for each type, is often confused. The differences between these two polymers are significant enough that understanding the behavior of each can ultimately help improve product designs and decisions. Osborne Industries breaks down the differences between these two types of well-known polymers. Read more via the link above. (read more)
Browse Datasheets for Osborne Industries, Inc. -
Custom injection molding and die-cast molding have been compared for decades. When it comes down to a side-by-side comparison, companies that convert from metal to plastic experience many benefits from the transition. Plastic components are superior to metal in more ways than one, including strength and impact resistance, weight, and design flexibility.
(read more)
Browse Datasheets for Osborne Industries, Inc. -
Custom thermoset molding services range across a variety of industries, each with a unique set of materials and part specifications. Both the resin transfer molding (RTM) process and reaction injection molding (RIM) process offer specific capabilities that can be applied to virtually any project (read more)
Browse Datasheets for Osborne Industries, Inc. -
success. “It was clear they had the capability to make this project a reality,” Fisher said, “and our initial impressions turned out to be correct, as Osborne Industries delivered what they promised.” Polydicyclopentadiene is an engineered thermoset polymer possessing an (read more)
Browse Datasheets for Osborne Industries, Inc. -
See the incredible impact and abrasion-resistant properties of composites molded via Reaction Injection Molding (RIM) at Osborne.
(read more)
Browse Datasheets for Osborne Industries, Inc. -
ELANTAS PDG, Inc. manufactures custom thermosets and thermoset resins to match your specifications. (read more)
Browse Thermosets and Thermoset Resins Datasheets for ELANTAS North America LLC
Conduct Research Top
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Is Epoxy Stronger than Glue?
. In addition, epoxides can be easily cured or reacted with different curing agents to form rigid, durable thermoset polymers. Cured epoxy polymers are used in various applications, including adhesives, coatings, composites, and electrical laminates.
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Polyurethane Composites: A Versatile Thermo-Set Polymer Matrix for a Broad Range of Applications. Mechnical Analysis on Pultruded Laminates.
Polyurethane resin is currently a minor player in the composite industry, with unsaturated. polyesters and epoxies having the largest shares among thermosetting materials1. . However, the. outlook for this chemistry is positive due to the quest for fast, automated and quality composite. production
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Best industrial electronic component adhesives manufacturers and types available in the market
Industrial electronic component adhesives are inorganic or organic chemical compounds used to bond components. The products include industrial sealants, UV curing electronic component adhesives, thermosets, silicone, polyurethane, hot melt, epoxy, and acrylic. Under the industrial category
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Industrial Adhesives Selection Guide: Types, Features, Applications
Industrial adhesives are organic and inorganic chemical compounds that are used to join components. Products include acrylic, epoxy, hot melt, polyurethane, silicone, thermoset, and UV curing adhesives, as well as industrial sealants. Most industrial adhesives are used in fastening applications
More Information Top
Indicates content that may require registration and/or purchase.
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Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
Uses: Reactive flame retardant additive for thermosets ( epoxy , phenolic, unsat. polyesters); good UV stability .
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Handbook of Paint and Coating Raw Materials Volume 1 and 2
Uses: Flame retardant for thermoplastics (ABS, HIPS, PC), thermosets ( epoxy , unsat. polyester), adhesives, coatings, textiles .
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Handbook of Adhesive Chemical and Compounding Ingredients
Uses: Flame retardant for thermoplastics (ABS, HIPS, PC), thermosets ( epoxy , unsat. polyester), adhesives, coatings, textiles .
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Nanomechanical characterization of dispersion and its effects in nano-enhanced polymers and polymer composites
Dispersion of Carbon nanofibers (CNFs) as a model nanoscale ingredient is characterized in two model polymer systems: (a) a thermoplastic polymer processed using a Twin Screw Extruder, and (b) a thermoset epoxy processed using sonication during solvent processing.
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ZASMHBA0003447
Thermoset Epoxy Resins and Fiber-Resin Composites (Ref 1, 8, 4365).
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The effect of stoichiometry on curing and properties of epoxy–clay nanocomposites
Thermoset epoxy – clay nanocomposites: the dual role of a,x-diamines as clay sur- face modifiers and polymer curing agents.
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Investigation of readily processable thermoplastic‐toughened thermosets. V. Epoxy resin toughened with hyperbranched polyester
Thermoplastic was dissolved in epoxy at 10, 20, 30, and 50% w thermoplastic/w epoxy, which corresponded to 7, 13, 19, and 28% w ther- moplastic/w thermoset ( epoxy , DDS, and thermo- plastic).
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ZASMHBA0003032
Thermoset Epoxy Resins Composites (Ref 1.
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Organic sealant materials for quasi-hermetic sealing of MEMS sensor packages
The three adhesives chemistries (used for sealing the package) being studied are Thermoset Epoxy , Silicone Rubber and Olefin Epoxy respectively.
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Americam Society of Composites: 29th Technical Conference
After weaving, the face sheet fabric layers are infiltrated with a thermoset epoxy matrix and it was cured.