Products & Services
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Supplier: Bruker Corporation
Description: Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker™s acquisition of Jordan Valley Semiconductors, a name synonymous with
- Applications: Semiconductor Wafers, Other
- Measurement Capability: Defects / ADC, Roughness / Waviness
- Technology: Profilometer / AFM, X-ray Diffractometer
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Supplier: JG&A Metrology Center
Description: JG&A Metrology Center is a global leader for Industrial Computed Tomography Scanning Services. By utilizing our non-destructive Industrial CT Scanning Services, clients are able to drastically reduce pre-production inspection costs and analyze internal failures quickly and accurately in 3D.
- Capabilities: Deformulation / Reverse Engineering, Failure Analysis, Quality / Purity (Contamination - Alloys, Polymers, etc.), Report Preparation, Other
- Industry Applications: Aerospace / Aviation, Automotive, Health Care / Medical, Military, Packaging, Piping / Pressure Vessel, Specialty / Other
- Materials: Adhesives / Sealants, Asbestos / Fibers, Ceramics / Glass, Composites, Concrete / Mortar, Fuel Cell / Battery Materials, Metals, Nanomaterials, Plastic / Rubber, Polymers / Organics, Textiles, Thin Films / Plating, Welds / Joints, Other
- Regional Preference: North America, United States Only, Northeast US Only, Southern US Only, Southwest US Only, Northwest US Only, Midwest US Only, Canada Only, South / Central America Only, Europe Only
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Supplier: Zygo Corporation
Description: virtually all types of surfaces, from rough to super smooth, including thin films, steep slopes, and large steps. Sub-nanometer measurement precision is independent of field magnification Gage capable performance - exceptional precision and repeatability for the most demanding
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Depth Profiling: Yes
- Form Factor: Monitor / Instrument
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Supplier: MTI Instruments Inc.
Description: The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Wafer Probing System, Sensor / Sensing Element
- Maximum Wafer / Part Size: 76 to 300 mm
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Supplier: Accuris
Description: A PRACTICAL GUIDE TO OPTICAL METROLOGY FOR THIN FILMS
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF 3760 includes Rigaku's patented
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: Filmetrics, Inc.
Description: Product-Wafer Metrology Made Affordable Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness Imaging™ technology allows Filmetrics to offer easy recipe set up and industry-leading throughput, at a mere fraction of the cost
- Applications: CVD / PVD Films, Semiconductor Wafers
- Area Mapping: Yes
- Mounting / Loading: In-situ / System Mounted
- Non-contact: Yes
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Supplier: Filmetrics, Inc.
Description: Product-Wafer Metrology Made Affordable Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness Imaging™ technology allows Filmetrics to offer easy recipe set up and industry-leading throughput, at a mere fraction of the cost
- Applications: CVD / PVD Films, Semiconductor Wafers
- Area Mapping: Yes
- Mounting / Loading: In-situ / System Mounted
- Non-contact: Yes
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Supplier: MicroSense, LLC
Description: calibration Hiscan option for surface roughness and link profile measurement and other surface structures Applications Solar Wafers QA and QC, Cost effective, compact metrology tool for R&D labs for all type of wafers and surfaces.
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 156 mm
- Measurement Capability: Thickness - Wafer / Disc (TTV)
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Supplier: MicroSense, LLC
Description: The SigmaTech UltraMap-TSV system is the world’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer—up to 300mm in diameter. The UltraMap-TSV system can be offered in
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Measurement Capability: Critical Dimension / Trench Geometry, Other
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3800e can measure elements from S through U with a single-target, dual-beam X-ray system and a new liquid nitrogen-free detector system. The TXRF 3800e includes Rigaku
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: Rigaku Corporation
Description: The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 to 300 mm
- Measurement Capability: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer
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Supplier: MicroSense, LLC
Description: Automated Thickness measurement system Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes). Manual Loading 20mm resolution Wafer 2" to 12" (50 to 300mm) round or square Thickness range: 200um to 5mm Automated calibration 2D &
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 50 to 300 mm
- Measurement Capability: Shape / Flatness, Thickness - Wafer / Disc (TTV)
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Supplier: MicroSense, LLC
Description: Automated Thickness measurement system IR interferometry probe technology. Single or dual probes. Manual Loading 0.5um accuracy. 0.1um resolution Wafer 4" to 12" (100 to 300mm) round or square Thickness range: 20um to 1mm Flexible recipe generation 2D & 3D mapping capability SECS/GEM communication
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 100 to 300 mm
- Measurement Capability: Shape / Flatness, Thickness - Wafer / Disc (TTV)
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Supplier: Rigaku Corporation
Description: TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-310 includes Rigaku's patented
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: SPIE - Education
Description: . Leveraging real time normalized product data to decrease Mean Time To Detect (MTTD) tool drifts. Recipe portability matching and monitoring to catch other issues that will affect lot cycletime. The concepts discussed are applicable to any metrology toolset such as CD-SEM, overlay,
- Modality: On-site / In Plant
- Technology / Subject: Design / Engineering Methods (ESDU, DFx, etc.), Instruments / Sensors, Photonics / Optics
- Type: Course
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Supplier: StellarNet, Inc.
Description: TF Systems for Non-Contact Film Thickness Measurements We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry
- Applications: Semiconductor Wafers, CVD / PVD Films, Polishing / CMP, Polymers / Photoresists, Other
- Form Factor: Monitor / Instrument
- Measurement Capability: Thickness - Film / Layer, Thickness - Wafer / Disc (TTV)
- Non-contact: Yes
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Supplier: Filmetrics, Inc.
Description: The Most Powerful Tool Available for Monitoring Thin-Film Deposition Measure deposition rates, film thickness, optical constants (n and k), and uniformity of semiconductors and dielectric layers in real-time with the F30 spectral reflectance system. Example Layers MBE
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Monitor / Instrument
- Measurement Capability: Optical Constants (n, k), Thickness - Film / Layer
- Mounting / Loading: Autoloading / In-line
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Supplier: Filmetrics, Inc.
Description: Measure film thickness in-line and in real-time at up to seven locations with the F37. Example Layers Almost any smooth and at-least-partially transparent films may be measured. This includes virtually any semiconducting material, including those used in thin-film photovoltaics
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Monitor / Instrument
- Measurement Capability: Thickness - Film / Layer
- Mounting / Loading: Autoloading / In-line
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Supplier: KEYENCE
Description: SI-F Series Spectral Interference Displacement Meter The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the
- Applications: Semiconductor Wafers, Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone
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Supplier: KEYENCE
Description: Angle Micron-level Defect Detection Surface Profiling Thin-film Thickness Coating Thickness BGA Profile Laser-Marking Depth
- Applications: Semiconductor Wafers, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: Autoloading / In-line, Floor Mounted / Stand-alone
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Supplier: KEYENCE
Description: LK-G5000 High-Speed / High-Accuracy Laser Displacement Sensor The LK-G5000 is a High-Speed 1D Laser Displacement Sensor for precision displacement measurement. With a sampling speed of 392 kHz, this sensor is able keep up with just about any inline process as well as account for vibration for
- Applications: Semiconductor Wafers, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: Autoloading / In-line, Floor Mounted / Stand-alone
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Supplier: KEYENCE
Description: SI-F Series Spectral Interference Displacement Meter The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the
- Applications: Semiconductor Wafers, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: Autoloading / In-line, Floor Mounted / Stand-alone
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Supplier: Hitachi High-Tech America
Description: Microspot XRF coating thickness and materials analyzers for rapid quality control and validation testing, making it easy to get the right results in seconds. Coating thickness and materials analysis based on X-ray fluorescence (XRF) is a widely accepted and industry-proven analytical technique,
- Applications: Semiconductor Wafers, Electroplated Films
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 102 to 305 mm
- Measurement Capability: Composition, Thickness - Film / Layer
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Supplier: StellarNet, Inc.
Description: spectrometer software and development kit, and is available at an extremely low price! Couple this with StellarNet’s Thin Film Measurement System and have full functionality for measuring thickness and index of both single-layer and multilayer films!
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Supplier: North Star Imaging, Inc.
Description: Seamlessly acquire full internal and external measurements of your components with the CXMM 50, a true X-ray Metrology CT system. Whether you need to measure the inside of a fuel injector or the coating thickness on a heart valve, the CXMM 50 was designed to give the user an unparalleled
- Display & Special Features: SPC / Software Capability
- Industrial Applications: Aerospace / Defense, Automotive, Coatings (Thin Films, Plating, etc.), Electronics, Mechanical Parts (Bearings, Shafting), Medical, Precision Machining / Grinding, Wear / Tribology
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography
- Mounting / Loading: Floor / Free Standing
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Supplier: Technic, Inc.
Description: The RTA is an automated, on-line, real-time, and in-tank system for monitoring and controlling the levels of chemical constituents of plating baths. The RTA technology is a unique modern approach to metrology combining the advanced, purpose-selected electroanalytical techniques with state
- Applications: Electroplated Films, Semiconductor Wafers
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Supplier: North Star Imaging, Inc.
Description: The X7000 is North Star Imaging’s largest standard system. The large scanning envelope and generous focal distance allow for unparalleled inspection capabilities of very large objects. The system is great for composites, castings, pipes, tubes, welds and similar parts. SYSTEM CAPABILITIES X-ray
- Display & Special Features: SPC / Software Capability
- Industrial Applications: Aerospace / Defense, Automotive, Coatings (Thin Films, Plating, etc.), Electronics, Mechanical Parts (Bearings, Shafting), Medical, Precision Machining / Grinding, Wear / Tribology
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography
- Mounting / Loading: Floor / Free Standing
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Supplier: North Star Imaging, Inc.
Description: The X3500 is the standalone manipulator from North Star Imaging’s newest system, the X3000. Whether you are inspecting small or large components, the X3500 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system SYSTEM
- Display & Special Features: SPC / Software Capability
- Industrial Applications: Aerospace / Defense, Automotive, Coatings (Thin Films, Plating, etc.), Electronics, Mechanical Parts (Bearings, Shafting), Medical, Precision Machining / Grinding, Wear / Tribology
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography
- Mounting / Loading: Floor / Free Standing
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Supplier: North Star Imaging, Inc.
Description: The X25 is quite possibly the most conveniently sized system on the market. The system offers all of the same creature features as the larger systems while still maintaining the ability to fit through a standard interior door. The X25 is well suited for small to medium sized objects. SYSTEM
- Display & Special Features: SPC / Software Capability
- Industrial Applications: Aerospace / Defense, Automotive, Coatings (Thin Films, Plating, etc.), Electronics, Mechanical Parts (Bearings, Shafting), Medical, Precision Machining / Grinding, Wear / Tribology
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography
- Mounting / Loading: Floor / Free Standing
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Supplier: Bruker Corporation
Description: stress analyses. Dektak surface profilers have been widely accepted as a superior solution for measuring thin film thickness, stress, and surface roughness and form in applications ranging from educational research verification to semiconductor process control. More recently, Dektak
- Display & Special Features: Computer Interface / Networkable
- Industrial Applications: Electronics, Semiconductor Manufacturing, Other
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Thickness
- Mounting / Loading: Benchtop, Floor / Free Standing
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Supplier: TSI Incorporated
Description: range of substrates to be deposited including 150 mm, 200 mm, and 300 mm wafers, supporting of all of your wafer metrology applications and improving product yield.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 150 to 300 mm
- Mounting / Loading: Manual Loading
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Supplier: TSI Incorporated
Description: range of substrates to be deposited including 150 mm, 200 mm, and 300 mm wafers, supporting of all of your wafer metrology applications and improving product yield.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 150 to 300 mm
- Mounting / Loading: Manual Loading
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Supplier: Micro-Epsilon Group
Description: scanCONTROL 25x0 laser scanners are designed for industrial measurement tasks. The combination of compact design, versatility and signal stability creates an excellent price/performance ratio, especially for measurement tasks involving large quantities. The scanCONTROL 25x0 laser scanners are
- Factory / Production Use: Yes
- Industrial Applications: Aerospace / Defense, Automotive, Coatings (Thin Films, Plating, etc.), Displays / FPD, Electronics, Mechanical Parts (Bearings, Shafting), Medical, MEMS, Precision Machining / Grinding, Semiconductor Manufacturing
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Defects / ADC, Flatness, Parallelism, Roundness, Squareness / Angularity, Step Height, Straightness, Thickness, Warp / Bow
- Mounting / Loading: Other
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Supplier: Micro-Epsilon Group
Description: scanCONTROL 30x0 laser scanners are among the highest performing profile sensors in terms of their size, accuracy and measuring rate. They provide calibrated 2D profile data with up to 7.37 million points per second. Their profile frequency of max. 10 kHz enables precise profile measurements in
- Factory / Production Use: Yes
- Industrial Applications: Aerospace / Defense, Automotive, Coatings (Thin Films, Plating, etc.), Displays / FPD, Electronics, Mechanical Parts (Bearings, Shafting), Medical, MEMS, Precision Machining / Grinding, Semiconductor Manufacturing
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Defects / ADC, Flatness, Parallelism, Roundness, Squareness / Angularity, Step Height, Straightness, Thickness, Warp / Bow
- Mounting / Loading: Other
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Supplier: Micro-Epsilon Group
Description: scanCONTROL 30x2 laser scanners are powerful profile sensors in terms of size, accuracy and measuring rate. These laser scanners provide calibrated 2D profile data with up to 5.12 million points per second. With a maximum profile frequency of 5 kHz, the scanners are designed for precise profile
- Factory / Production Use: Yes
- Industrial Applications: Aerospace / Defense, Automotive, Coatings (Thin Films, Plating, etc.), Displays / FPD, Electronics, Mechanical Parts (Bearings, Shafting), Medical, MEMS, Precision Machining / Grinding, Semiconductor Manufacturing
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Defects / ADC, Flatness, Parallelism, Roundness, Squareness / Angularity, Step Height, Straightness, Thickness, Warp / Bow
- Mounting / Loading: Other
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Supplier: Micro-Epsilon Group
Description: scanCONTROL 30x2 laser scanners are powerful profile sensors in terms of size, accuracy and measuring rate. These laser scanners provide calibrated 2D profile data with up to 5.12 million points per second. With a maximum profile frequency of 5 kHz, the scanners are designed for precise profile
- Factory / Production Use: Yes
- Industrial Applications: Aerospace / Defense, Automotive, Coatings (Thin Films, Plating, etc.), Displays / FPD, Electronics, Mechanical Parts (Bearings, Shafting), Medical, MEMS, Precision Machining / Grinding, Semiconductor Manufacturing
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Defects / ADC, Flatness, Parallelism, Roundness, Squareness / Angularity, Step Height, Straightness, Thickness, Warp / Bow
- Mounting / Loading: Other
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Supplier: TSI Incorporated
Description: handling allows up to 25 wafers to be processed in a single control job, increasing productivity in your metrology operations and improving product yield.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 200 to 300 mm
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: TSI Incorporated
Description: handling allows up to 25 wafers to be processed in a single control job, increasing productivity in your metrology operations and improving product yield.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 200 to 300 mm
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Park Systems, Inc.
Description: , until now, had very limited choices for industrial grade in-line inspection tools for HDD slider metrology. Artifact Free Metrology by Crosstalk Elimination • Two independent, closed-loop XY and Z flexure scanners for sample and tip • Flat and linear XY scan of up to
- Applications: Semiconductor Wafers, Data Storage / Memory
- Form Factor: Monitor / Instrument
- Measurement Capability: Defects / ADC
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Park Systems, Inc.
Description: throughput when compared with other methods of defect review. Artifact Free Metrology by Crosstalk Elimination • Two independent, closed-loop XY and Z flexure scanners for sample and tip • Flat and linear XY scan of 100 µm x 100 µm with low residual bow
- Applications: Semiconductor Wafers, Data Storage / Memory
- Form Factor: Monitor / Instrument
- Measurement Capability: Defects / ADC
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Park Systems, Inc.
Description: . Artifact Free Metrology by Crosstalk Elimination • Two independent, closed-loop XY and Z flexure scanners for sample and tip • Flat and linear XY scan of 100 µm x 100 µm with low residual bow • Out of plane motion of less than 2 nm over entire scan
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Park Systems, Inc.
Description: -resolution imaging • Minimized sample damage or modification • Soft photoresist structures can be imaged non-destructively • Immunity from parameter-dependent results observed in tapping imaging Complete 3D Metrology of Sidewall • Sidewall
- Applications: Semiconductor Wafers
- Form Factor: Monitor / Instrument
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Raytheon ELCAN Optical Technologies
Description: simulator software. The optical design group encompasses the areas of detailed lens design, optical thin film definition & the assembly and alignment of prototypes, and optical testing. Mechanical Design Capabilities Our mechanical design department works closely with
- Additional Services: Consulting Services, Design Software, Optical Modeling, Prototyping, Low Volume Manufacture, Alignment Services, Testing and Metrology
- Design Services: Optical Component Design, Optical System Design, Optomechanical Design, Optoelectronic Design
- Industry Served: Aerospace, Biotechnology, Electronics, Energy, Food and Beverage, General Industrial, Government, Marine, Medical, Military, Telecommunications, Other
- Location: North America, Southern US Only, Canada Only, Other
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Supplier: ETEL S.A.
Description: applications such as Overlay Metrology, Critical Dimension and Thin film Metrology Back-end: specific flip-chip processes made on large panels/substrates Characteristics Compact footprint Nanometer position stability Short move and settle times High dynamics High
- Axis Configuration: X-Y Axes, Tip/Tilt Axes
- Features: Multi-position
- Motor Specifications: Other
- Rated Speed: 59.06 in/sec
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Supplier: Zygo Corporation
Description: -contact technique provides high-precision, and high-value surface metrology benefits including: Measures virtually all types of surfaces, from rough to super smooth, including thin films, steep slopes, and large steps. Sub-nanometer measurement precision is independent of field
- Application: Profile Measurement, Digitizing / Imaging
- Control: PC
- Machine Type and Specifications: 2-D Scanning / Profiling, 3-D Scanning / Profiling
- Mounting Options: Free Standing
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Supplier: ETEL S.A.
Description: Control applications such as Overlay Metrology, Critical Dimension and Thin film Metrology as well as photonics. Characteristics Total stroke: 50 mm Maximum payload: 45 kg Indirect drive - high precision ballscrew Dual encoder feedback Cleanroom
- Actuation Type: Electrical
- Motor Continuous Power: 83.2 HP
- Motor Specifications: DC Servo
- Motor Voltage: 400 volts
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Supplier: ETEL S.A.
Description: for high precision and high accuracy rotation. Suited to diverse applications and industries, the DXRH rotary module is especially suitable for Wafer Process Control applications such as Overlay Metrology, Critical Dimension and Thin film Metrology as well as photonics.
- Load Capacity: 27.56 lbs
- Maximum Torque: 69.65 In-lbs
- Overall Height: 2.5 inch
- Overall Width: 8.98 inch
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Supplier: Zygo Corporation
Description: technologies, thus optimizing your return on investment. Performance, Value, and Versatility Flexibility is the hallmark of ZYGO's NewView products. The NewView 9000 profiler offers exceptional value with applications as varied as flatness, roughness and waviness, thin films, step
- Application: Profile Measurement, Digitizing / Imaging
- Control: Manual, PC
- Machine Type and Specifications: 3-D Scanning / Profiling
- Mounting Options: Benchtop
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A high precision metrology method and system for thin film's parameters based on reflectance spectrum
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