Wafer Thickness Measurement

Description: The IMP-NIR-TH24 is a wafer thickness sensor with a 24 mm ±3.0 mm working distance, a 21 to 27 mm operating range and a measuring range of 50 µm to 1.05 mm for silicon and 0.2 to 4 mm for air gaps. It provides a 15 µm light spot for precise inline wafer measurements.

• Operating Temperature: 50 to 122 F
• Features: Other
• Measurement Capability: Specialty / Other, Thickness

Description: The IMS5420-TH absolute interferometer opens up new perspectives in the industrial thickness measurement of monocrystalline silicon wafers and silicon carbide wafers and comparable materials that are transparent for a wavelength range of 1,100 nm. Due to its broadband

• Resolution: 1 nm
• Operating Temperature: 50 to 122 F
• User Interface: Analog Control, Digital Interface
• Remote Interface: Computer Interface

Description: measures semiconductor materials. The thickness range is determined by the lens and software options (see datasheet for details). Thickness can be measured in less than a second. Like all Filmetrics thickness measurement instruments, the F70 connects to the USB port of

• Range: 0.0000005905515 to 0.5118113 inch
• Mounting / Loading Options: Benchtop / Floor
• Measurement Scale / Units: Metric
• Gaging Technology: Non-contact, Optical

Description: DESCRIPTION Marposs NCG gauge is a gauge to measure thickness based on interferometric technology: light waves, which are reflected at the layer boundaries of different surfaces of the object being measured, are brought to interference and the layer thickness is then calculated. The

• Gaging Technology: Non-contact
• Attribute Measurement Capability: Thickness Gage

Description: Methods of Measurement of Thickness, Taper and Bow for Silicon Wafers

Description: The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness,

• Maximum Wafer / Part Size: 300.00000000000006 mm
• Measurements: Area Mapping, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Technology: Capacitance / EM Gage
• Mounting / Loading: Manual Loading

Description: STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD)

Description: Method for Measurement of Oxide Thickness on Silicon Wafers and Metallization Thickness by Multiple-Beam Interference (Tolansky Method) (Withdrawn 1993)

Description: 1.1 This test method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer. 1.2 This test method is intended primarily for use with wafers that meet the dimension and

Description: IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable

Description: IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable

Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer. 1.2 This test method is intended

Description: Automated Wafer Thickness Measurement System Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 4” to 12” (100 to 300mm) Thickness range: 50um to 3mm Extended warpage range up

• Maximum Wafer / Part Size: 100 to 300.00000000000006 mm
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Features: Non-contact

Description: approximately and larger in thickness, independent of thickness variation and surface finish, and of wafer shape. 1.3 This test method measures the flatness of the front wafer surface as it would appear relative to a specified reference plane when the back surface of the

Description: ABTech’s standard thickness gages include Heidenhain Metro probes, Gage-Chek DRO®, Granite plate, stainless steel probe stands and probe actuator control box. These thickness gages allow the user to accurately measure thickness down to 1 micron without having to hold the part or

• Range: 0.984 inch
• Graduation / Resolution: 0.00000393701 inch
• Resolution: 0.00000393701 inch
• Mounting / Loading Options: Benchtop / Floor

Description: Product-Wafer Metrology Made Affordable Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness Imaging™ technology allows Filmetrics to offer easy recipe set up and industry-leading throughput, at a mere fraction of

• Measurements: Area Mapping
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: ISO 14701:2011 specifies several methods for measuring the oxide thickness at the surfaces of (100) and (111) silicon wafers as an equivalent thickness of silicon dioxide when measured using X-ray photoelectron spectroscopy. It is only applicable to flat, polished specimens and

Description: ISO 14701:2011 specifies several methods for measuring the oxide thickness at the surfaces of (100) and (111) silicon wafers as an equivalent thickness of silicon dioxide when measured using X-ray photoelectron spectroscopy. It is only applicable to flat, polished specimens and

Description: The FISCHERSCOPE X-RAY XDV-μ SEMI is an automated measurement system optimized for the quality control of micro-structures in complex 2.5D/3D packaging applications in the semiconductor industry. Fully automated analysis prevents damage to valuable wafer material. And consistent test

• Mounting / Loading Options: Benchtop / Floor
• Attribute Measurement Capability: Thickness Gage

Description: High-Resolution Film Thickness Maps The Filmetrics F42 can map the thickness of films, such as OSP, at over one-million points, each with a spot size as small as 3 microns. Using an integrated CCD camera, live video makes it easy to pinpoint exact measurement locations. Once the

• Measurements: Area Mapping, Optical Constants (n, k)
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: your own with no limit on the number of measurement points. Dozens of pre-defined map patterns are supplied. The F50 film thickness mapping system connects to the USB port of your Windows™ computer and can be set up in minutes. The different F50 instruments are distinguished primarily

• Measurements: Area Mapping
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not

• Maximum Wafer / Part Size: 76 to 300.00000000000006 mm
• Measurements: Area Mapping, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Technology: Capacitance / EM Gage
• Mounting / Loading: Manual Loading

Description: • sheet metal thickness • semiconductor wafer thickness • rotating shaft run out and other metrology measurements The AS-9000 delivers nanometer level resolution for ultra-high-precision measurements – each and every time. Lightweight. Compact. Fast and Easy Setup

• Measuring Technology: Capacitance, Non-contact
• Gap Sensor / Feeler Gauge Type: Gap Monitor / Instrument

Description: • sheet metal thickness • semiconductor wafer thickness • rotating shaft run out and other metrology measurements The AS-9000 delivers nanometer level resolution for ultra-high-precision measurements – each and every time. Lightweight. Compact. Fast and Easy Setup

• Measurement Range: 0 to 0.49212625 inch
• Sensor Technology: Capacitive Linear Position Sensor
• Features: DC Powered
• Output: Voltage

Description: silicon substrate with the following characteristics: a) the film is electrically insulating; b) the film has a thermal conductivity that is less than one tenth the thermal conductivity of silicon; c) the film is uniform in thickness and the thickness lies in the range 0,25 to 1

Description: The WDA-3650 X-ray fluorescence spectrometer for thin film evaluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film

• Maximum Wafer / Part Size: 200 mm
• Measurements: Composition, Thickness - Film / Layer
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: MFM65 is designed with high-volume 200mm and 300mm manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and S2/S8

• Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
• Measurements: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: SI-F Series Spectral Interference Displacement Meter The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able

• Features: Autoloading / In-line, Non-contact, Non-destructive
• Form Factor: Controller, Monitor / Instrument, Sensor / Sensing Element
• Applications: Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone, In-situ / System Mounted

Description: SI-F Series Spectral Interference Displacement Meter The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able

• Features: Autoloading / In-line, Non-contact, Non-destructive
• Form Factor: Controller, Monitor / Instrument, Sensor / Sensing Element
• Applications: Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone, In-situ / System Mounted

Description: measurement of both transparent and opaque materials. Such as, mobile phone’s camera module and motherboard measurement,curved glass profile measurement, chip measurement,glass thickness measurement, LCD screen inspection, wafer depth/thickness

• Application: Dimensional Measurement

Description: measurement of both transparent and opaque materials. Such as, mobile phone’s camera module and motherboard measurement,curved glass profile measurement, chip measurement,glass thickness measurement, LCD screen inspection, wafer depth/thickness

• Application: Dimensional Measurement

Description: TF Systems for Non-Contact Film Thickness Measurements We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry

• Applications: CVD / PVD Films, Data Storage / Memory, Flat Panel Displays, Optical Components, Polishing / CMP, Polymers / Photoresists, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument
• Features: Non-contact, Non-destructive, Other

Description: CHRocodile IT TW Application: Non-contact thickness measurement of Thin Wafer High measuring rate nm resolution Transparent coatings/foils from 3.5 up to 250 µm

Description: Roughness (Ra) overthe full surface with results comparable to an AFM, but in a fraction of the time. You can achieve repeatablenano and micro waviness measurements when measuring the same target on different machines and the capability to not only find defects, but to classify nano-pits and

• Applications: Data Storage / Memory
• Measurements: Defects / ADC, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: Four Point Probe Automatic Resistivity Meter Easy to operate: simply load the wafer and close the lid. Automatic calculation and display of sheet or slice resistivity, V/I, metallization thickness, and P-N type. Ideal for epitaxial, diffused, ion implanted, and metallized layers.