Wafer Thickness Measurement

Description: The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness,

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Maximum Wafer / Part Size: 300 mm

Description: accuracy and shortened processing time by using the Twin-contouring" method, compared to the conventional machine. Reduced processing time compared to the conventional machine. A built-in wafer profile measurement device is available. Enables measurement of the cross

• Applications: Semiconductor Wafers
• Maximum Wafer / Part Size: 50.8 to 203 mm
• Mounting / Loading: Manual Loading

Description: Automated Thickness measurement system IR interferometry probe technology. Single or dual probes. Manual Loading 0.5um accuracy. 0.1um resolution Wafer 4" to 12" (100 to 300mm) round or square Thickness range: 20um to 1mm Flexible recipe

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 100 to 300 mm
• Measurement Capability: Shape / Flatness, Thickness - Wafer / Disc (TTV)

Description: Benchtop, automated Thickness measurement systems Cassette to cassette or manual loading Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 2” to 4” (50 to 100mm). Thickness range: 50um to 3mm

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 50 to 100 mm
• Measurement Capability: Thickness - Wafer / Disc (TTV)

Description: Automated Thickness measurement system Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes). Manual Loading 20mm resolution Wafer 2" to 12" (50 to 300mm) round or square

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 50 to 300 mm
• Measurement Capability: Shape / Flatness, Thickness - Wafer / Disc (TTV)

Description: Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution Thickness range from 50um to 1mm Automated

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 156 mm
• Measurement Capability: Thickness - Wafer / Disc (TTV)

Description: The F70s are general-purpose thickness measurement instruments that are capable of measuring thicknesses up to 13mm. Common applications include glass and plastic sheets, lenses, and containers and semiconductor wafers. The basic F70 is designed to measure transparent

• Gaging Technology: Optical, Optical - Video / Imaging
• Mounting / Loading: Benchtop / Floor
• Range: 5.91E-7 to 0.5118 inch
• Units: Metric

Description: has been designed to control the thickness of different type of parts, glass, plastic and silicon wafers. Thanks to the infrared light source is possible to measure none transparent materials too. Our gauges are designed to improve and maintain machine cycle times, quality of the final

Description: Methods of Measurement of Thickness, Taper and Bow for Silicon Wafers

Description: Turn Your Microscope into a Film Thickness Measurement Tool The F40 product family is for applications that require a spot size as small as 1 micron. For most microscopes the F40 simply attaches to the c-mount adapter, which is the industry standard for video camera mounting. The

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Monitor / Instrument
• Measurement Capability: Optical Constants (n, k)
• Mounting / Loading: In-situ / System Mounted

Description: High-Resolution Film Thickness Maps The Filmetrics F42 can map the thickness of films, such as OSP, at over one-million points, each with a spot size as small as 3 microns. Using an integrated CCD camera, live video makes it easy to pinpoint exact measurement locations. Once the

• Applications: Semiconductor Wafers, CVD / PVD Films
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Measurement Capability: Optical Constants (n, k)

Description: warranty is standard. Enhanced Performance The F40-NSR dramatically increases measurement speed - results are delivered in less than one second. Multi-layer measurements of refractive indices and thickness are achievable, superior data analysis options are offered, and data can

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Monitor / Instrument
• Measurement Capability: Optical Constants (n, k)
• Mounting / Loading: In-situ / System Mounted

Description: hand tools such as a micrometer. The part under test is positioned on the granite plate while the probes are slowly activated to come in contact with the part. These turn key systems are available in single or dual probe configurations and are ideal for measuring thickness of wafers,

• Gaging Technology: Mechanical
• General Gage Type: Custom / OEM Gage
• Graduation / Resolution: 3.94E-6 inch
• Material Thickness: Yes

Description: 1.1 This test method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer. 1.2 This test method is intended primarily for use with wafers that meet the dimension and

Description: Method for Measurement of Oxide Thickness on Silicon Wafers and Metallization Thickness by Multiple-Beam Interference (Tolansky Method) (Withdrawn 1993)

Description: STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD)

Description: The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Maximum Wafer / Part Size: 76 to 300 mm

Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer. 1.2 This test method is intended

Description: for FOUP, SMIF and cassette, for 6"", 8"" and 12"" wafers Applications: Coating Thickness Measurement Base metallization layers (UBM) on a nanometer scale Thin lead-free solder caps on copper pillars Extremely small contact surfaces and other

• Mounting / Loading: Benchtop / Floor

Description: IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable

Description: film and/or optical measurement requirements. Thin Film Applications Solar PV Increased production of Thin-Film Photovoltaics (TFPVs) is becoming more predominant due to lower costs than their silicon-wafer-based cousins. Getting accurate thickness

• Applications: Semiconductor Wafers, CVD / PVD Films, Data Storage / Memory, Flat Panel Displays, Optical Components , Polishing / CMP, Polymers / Photoresists, Other
• Form Factor: Monitor / Instrument
• Measurement Capability: Thickness - Film / Layer, Thickness - Wafer / Disc (TTV)
• Mounting / Loading: In-situ / System Mounted

Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers a noncontacting, nondestructive procedure to determine the thickness and flatness of clean, dry, semiconductor wafers in such a way that no physical reference is required. 1.2 This test method

Description: The WDA-3650 X-ray fluorescence spectrometer for thin film evaluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 200 mm
• Measurement Capability: Composition, Thickness - Film / Layer

Description: IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable

Description: MERMAID is a unique measurement instrument for analysis of liquid and thin film properties using magnetoelastic resonance (MER) sensors. Dynamic events such as viscosity change, phase transitions or bio film growth can be analyzed. The MER sensor can measure properties of either a coating on

• Applications: CVD / PVD Films, Polymers / Photoresists, Other
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Measurement Capability: Deposition Rate, Endpoint Detection / Plasma Diagnostics, Thickness - Film / Layer, Other
• Mounting / Loading: In-situ / System Mounted, Floor Mounted / Stand-alone

Description: . The MFM65 is designed with high-volume 200mm and 300mm manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 200 to 300 mm
• Measurement Capability: Composition, Particle Contamination, Roughness / Waviness, Thickness - Film / Layer

Description: SI-F Series Spectral Interference Displacement Meter The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able

• Applications: Semiconductor Wafers, Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates
• Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
• Measurement Capability: Shape / Flatness, Thickness - Film / Layer
• Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone

Description: SI-F Series Spectral Interference Displacement Meter The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able

• Applications: Semiconductor Wafers, Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates
• Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
• Measurement Capability: Shape / Flatness, Thickness - Film / Layer
• Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone

Description: Roughness (Ra) overthe full surface with results comparable to an AFM, but in a fraction of the time. You can achieve repeatablenano and micro waviness measurements when measuring the same target on different machines and the capability to not only find defects, but to classify nano-pits and

• Applications: Data Storage / Memory
• Form Factor: Monitor / Instrument
• Measurement Capability: Defects / ADC, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Mounting / Loading: Floor Mounted / Stand-alone

Description: LK-G5000 High-Speed / High-Accuracy Laser Displacement Sensor The LK-G5000 is a High-Speed 1D Laser Displacement Sensor for precision displacement measurement. With a sampling speed of 392 kHz, this sensor is able keep up with just about any inline process as well as account

• Applications: Semiconductor Wafers, Data Storage / Memory, Flat Panel Displays, Packaged ICs / Ceramic Substrates
• Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
• Measurement Capability: Shape / Flatness, Thickness - Film / Layer
• Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone

Description: LT-9000 Surface Scanning Laser Confocal Sensor The LT-9000 Surface Scanning Laser Confocal Displacement Meter excels in measuring micron-level defects or thicknesses without being affected by target color or angle. The confocal principle requires only that the light reflect off

• Applications: Semiconductor Wafers, Flat Panel Displays, Packaged ICs / Ceramic Substrates
• Form Factor: Monitor / Instrument, Controller, Sensor / Sensing Element
• Measurement Capability: Shape / Flatness, Thickness - Film / Layer
• Mounting / Loading: In-situ / System Mounted, In-line, Floor Mounted / Stand-alone

Description: ISO 14701:2011 specifies several methods for measuring the oxide thickness at the surfaces of (100) and (111) silicon wafers as an equivalent thickness of silicon dioxide when measured using X-ray photoelectron spectroscopy. It is only applicable to flat, polished specimens and

Description: ISO 14701:2011 specifies several methods for measuring the oxide thickness at the surfaces of (100) and (111) silicon wafers as an equivalent thickness of silicon dioxide when measured using X-ray photoelectron spectroscopy. It is only applicable to flat, polished specimens and

Description: Four Point Probe Automatic Resistivity Meter Easy to operate: simply load the wafer and close the lid. Automatic calculation and display of sheet or slice resistivity, V/I, metallization thickness, and P-N type. Ideal for epitaxial, diffused, ion implanted, and

Description: -Y stage position • sheet metal thickness • semiconductor wafer thickness • rotating shaft run out and other metrology measurements The AS-9000 delivers nanometer level resolution for ultra-high-precision measurements – each and every time

• Measurement Range: 0.0 to 0.4921 inch
• Output: Voltage
• Technology: Capacitive Linear Position Sensor

Description: -Y stage position • sheet metal thickness • semiconductor wafer thickness • rotating shaft run out and other metrology measurements The AS-9000 delivers nanometer level resolution for ultra-high-precision measurements – each and every time

• Gap Sensor / Feeler Gauge Types: Gap Monitor / Instrument
• Measuring Technology: Capacitance
• Non-contact: Yes

Description: The Sycon STM-100 Thickness/Rate Monitor/MF a precision mass and film thickness measurement instrument for use in thin film deposition processes and other quartz crystal microbalance applications.

• Applications: CVD / PVD Films
• Form Factor: Monitor / Instrument

Description: /distance/d isplacement measurement of both transparent and opaque materials. Such as, mobile phone’s camera module and motherboard measurement,curved glass profile measurement, chip measurement,glass thickness measurement, LCD screen inspection,

• Application: Dimensional Measurement

Description: /distance/d isplacement measurement of both transparent and opaque materials. Such as, mobile phone’s camera module and motherboard measurement,curved glass profile measurement, chip measurement,glass thickness measurement, LCD screen inspection,

• Application: Dimensional Measurement

Description: /distance/d isplacement measurement of both transparent and opaque materials. Such as, mobile phone’s camera module and motherboard measurement,curved glass profile measurement, chip measurement,glass thickness measurement, LCD screen inspection,

• Application: Dimensional Measurement

Description: /distance/d isplacement measurement of both transparent and opaque materials. Such as, mobile phone’s camera module and motherboard measurement,curved glass profile measurement, chip measurement,glass thickness measurement, LCD screen inspection,

• Application: Dimensional Measurement