Epoxy Adhesive Formulations

| Curing agent | Type | Active hydrogen equivalent weight | Viscosity, cP, at 25 C | Mix ratio, pph (DGEBA EEW: 185) | Curing conditions; comments | Supplier |
|---|---|---|---|---|---|---|
| Polyamines | ||||||
| DEH 20 | DETA | 20.6 | 6 | 10.9 | RT | Dow |
| DEH 24 | TETA | 24.4 | 20 | 12.9 | RT | Dow |
| DEH 26 | TEPA | 27.1 | 50 | 14.3 | RT | Dow |
| DEH 29 | Polyethylene polyamine | 28.8 | 75 160 at 40 C | 15.2 | RT | Dow |
| DEH 39 | Aminoethylpiperazine | 43 | 10 | 22.8 | RT; improved impact and shorter pot life | Dow |
| DEH 52 | Amine adduct (DETA modified with liquid epoxy) | 42 47 | 5,000 7,000 | 28 | RT | Dow |
| DEH 58 | Amine blend; DETA modified bisphenol A | 30 | 85 130 | 15.9 | Dow | |
| DEH 85 | Phenolic curing agent | 250 280 | 290 470 at 150 C | Dow | ||
| EPI CURE 3223 | DETA | 20.7 | 1500 4000 | 10.9 | RT; gel time 25 min | Resolution |
| EPI CURE 3234 | TETA | 24.5 | 25 | 12.9 | RT; gel time 30 min | Resolution |
| EPI CURE 3200 | N-aminoethylpiperazine | 43 | 20 | 22.6 | RT; gel time 19 min | Resolution |
| EPI CURE 3300 | Isophoronediamine (IPDA) | 42.6 | 13 18 | 22.7 | RT and ET; gel time 128 min at RT | Resolution |
| EPI CURE 3282 | Amine adduct | 38 | 2900 4900 | 20 | RT; gel time 15 min | Resolution |
| Aromatic amines | ||||||
| MPDA | Metaphenelyene diamine | 27 | Melting point 60 C | 14.3 | ET | |
| DADPS or DDS | Diamino diphenyl sulfone | 57 | Melting point 175 C | 30.2 | ET; good B-stage shelf life; can be accelerated with BF 3-MEA or aliphatic amines | |
| Diethyltoluene diamine | 44.6 | 23.6 | Low-viscosity liquid aromatic diamine; low exotherm and longer pot life than other aromatic amines | |||
| Ancamine Z | Aromatic amine eutectic | 2000 |