Epoxy Adhesive Formulations

Appendix D: Epoxy Curing Agents

Curing agent

Type

Active hydrogen equivalent weight

Viscosity, cP, at 25 C

Mix ratio, pph (DGEBA EEW: 185)

Curing conditions; comments

Supplier

Polyamines

DEH 20

DETA

20.6

6

10.9

RT

Dow

DEH 24

TETA

24.4

20

12.9

RT

Dow

DEH 26

TEPA

27.1

50

14.3

RT

Dow

DEH 29

Polyethylene polyamine

28.8

75 160 at 40 C

15.2

RT

Dow

DEH 39

Aminoethylpiperazine

43

10

22.8

RT; improved impact and shorter pot life

Dow

DEH 52

Amine adduct (DETA modified with liquid epoxy)

42 47

5,000 7,000

28

RT

Dow

DEH 58

Amine blend; DETA modified bisphenol A

30

85 130

15.9

Dow

DEH 85

Phenolic curing agent

250 280

290 470 at 150 C

Dow

EPI CURE 3223

DETA

20.7

1500 4000

10.9

RT; gel time 25 min

Resolution

EPI CURE 3234

TETA

24.5

25

12.9

RT; gel time 30 min

Resolution

EPI CURE 3200

N-aminoethylpiperazine

43

20

22.6

RT; gel time 19 min

Resolution

EPI CURE 3300

Isophoronediamine (IPDA)

42.6

13 18

22.7

RT and ET; gel time 128 min at RT

Resolution

EPI CURE 3282

Amine adduct

38

2900 4900

20

RT; gel time 15 min

Resolution

Aromatic amines

MPDA

Metaphenelyene diamine

27

Melting point 60 C

14.3

ET

DADPS or DDS

Diamino diphenyl sulfone

57

Melting point 175 C

30.2

ET; good B-stage shelf life; can be accelerated with BF 3-MEA or aliphatic amines

Diethyltoluene diamine

44.6

23.6

Low-viscosity liquid aromatic diamine; low exotherm and longer pot life than other aromatic amines

Ancamine Z

Aromatic amine eutectic

2000

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