Epoxy Adhesive Formulations

Appendix C: Selected Epoxy Resins

Resin

Epoxy equivalent weight

Viscosity, cP, at 25 C unless indicated otherwise

Comment

Supplier

Liquid bisphenol A type

DER 317

192 203

16,000 25,000

Fast cure with polyamine-type curing agents

Dow

DER 330

176 185

7,000 1,000

Standard undiluted DGEBA

Dow

DER 331

182 192

11,000 14,000

For general purposes up to 204 C; undiluted

Dow

DER 332

172 176

4,000 6,000

High-purity DGEBA

Dow

DER 364

190 210

4,000 7,000

Noncrystallizing

Dow

DER 383

176 183

9,000 10,500

Extended pot life

Dow

EPON 825

175 180

5,000 6,500

High-purity resin with strong crystallization tendency

Resolution

EPON 826

178 186

6,500 9,500

Provides good chemical resistance; subject to crystallization when cold

Resolution

EPON 828

185 192

11,000 15,000

Standard undiluted DGEBA

Resolution

EPON 8280

185 195

11,000 15,000

Antisettling and antifoaming resin

Resolution

EPON 830

170 225

17,000 22,500

Minimal crystallization tendency

Resolution

EPR 164

188

10,000

Bakelite AG

EPR 154

180

8,500

Bakelite AG

Epalloy 7200

Modified DGEBA; high reactivity for low-temperature cures

CVC

Liquid bisphenol F type

EPR 161

172

3,850

Bakelite AG

EPR 166

184

8,000

Blend with bisphenol A

Bakelite AG

EPR 144

173

4,200

Blend with bisphenol A

Bakelite AG

DER 354

158 175

3,000 5,500

Dow

DER 354 LV

160 170

2,000 3,000

Low-viscosity bisphenol F

Dow

EPON 862

166 177

2,500 4,500

Low-viscosity bisphenol F

Resolution

Multifunctional resins

EPON 1031

195 230

Solid

Tetraglycidyl ether of tetraphenolethane; functionality of 3.5

Resolution

EPON HPT 1050

176 181

31,000 40,000

Epikote 154; epoxy novolac; functionality of 3.6

Resolution

EPON SU-3

187 207

Semisolid

Epoxy novolac; functionality of 3

Resolution

EPON SU-8

195 230

Semisolid

Epikote 157; epoxy novolac; functionality of 8

Resolution

EPON 161

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